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Dataset documentation

Documentation for every dataset in the REEL LCI Database v1.0: system boundary, flow-by-flow sources, exclusions and data quality. Inventory quantities are not published here — they ship with the dataset itself on Circa. A plain list of every dataset, grouped by category, is also available.

520 datasets across 320 listings

A listing groups supported variants of the same dataset.

ATX Power Harness
Cables · China
1 cable
DAC 100G QSFP28
Cables · China
1 cable
DAC 25G SFP28
Cables · China
1 cable
Ethernet Cat 6A Patch
Cables · China
1 cable
Fiber OM4 LC Duplex
Cables · China
1 cable
Fiber OS2 LC Duplex
Cables · China
1 cable
Power Cord C13
Cables · China
1 cable
Power Cord C19
Cables · China
1 cable
SATA Data Cable
Cables · China
1 cable
USB4 Cable Passive
Cables · China
1 cable
Blower Fan Array 4x
Components · Global
1 component
Chassis Fan Array 6x40mm
Components · Global
1 component
DDR5 128GB MRDIMM
Components · Global
1 component
DDR5 16GB DIMM
Components · Global
1 component
DDR5 16GB SODIMM
Components · Global
1 component
DDR5 32GB CAMM2
Components · Global
1 component
DDR5 32GB CSODIMM
Components · Global
1 component
DDR5 32GB CUDIMM
Components · Global
1 component
1 component
Enterprise HDD 3.5"
Components · Global
1 component
1 component
1 component
1 component
1 component
1 component
1 component
NVMe M.2 SSD 128GB
Components · Global
1 component
1 variant · Capacity
PSU ATX 650W
Components · Global
1 component
PSU DC Buck 48V 500W
Components · Global
1 component
PSU DC POE 30W
Components · Global
1 component
PSU Laptop Adapter 100W
Components · Global
1 component
PSU Server 2000W
Components · Global
1 component
PSU USB Charger GaN 65W
Components · Global
1 component
PSU VRM CPU 300A
Components · Global
1 component
1 component
1 component
1 component
SiC Power Module
Components · Global
1 component
eUFS 5.0 256GB
Components · Global
1 component
ATX Power Connector
Connectors · China
1 connector
DDR5 DIMM Socket
Connectors · China
1 connector
FPC FFC Connector
Connectors · China
1 connector
Fiber LC Connector
Connectors · China
1 connector
Fiber MPO Connector
Connectors · China
1 connector
Mezzanine High Speed
Connectors · China
1 connector
PCIe Card Edge
Connectors · China
1 connector
RJ45 MagJack
Connectors · China
1 connector
SATA SAS Connector
Connectors · China
1 connector
USB4 Receptacle
Connectors · China
1 connector
Axial Fan
Electromechanical · China
1 piece
BLDC Motor Standalone
Electromechanical · China
1 piece
Blower Fan
Electromechanical · China
1 piece
Vibration Motor
Electromechanical · China
1 piece
MGX Board Pan
Infrastructure · Global
1 component
MGX Busbar 1400A
Infrastructure · Global
1 component
MGX Compute Tray
Infrastructure · Global
1 component
MGX DC SCM
Infrastructure · Global
1 component
MGX Fan Wall 12x80mm
Infrastructure · Global
1 component
MGX IO Bay Modules
Infrastructure · Global
1 component
MGX Manifold Assembly
Infrastructure · Global
1 component
MGX Rack Complete
Infrastructure · Global
1 component
MGX Rack Frame
Infrastructure · Global
1 component
MGX Rack Infrastructure
Infrastructure · Global
1 component
MGX Slide Rail
Infrastructure · Global
1 component
MGX Tray Assembly
Infrastructure · Global
1 component
PDU Rack 16-Outlet
Infrastructure · Global
1 component
UQD Assembly
Infrastructure · Global
1 component
5G Modem, FOWLP, 7nm
Logic ICs · Taiwan
1 IC
ADC/DAC, QFN 6x6, 65nm
Logic ICs · Taiwan
1 IC
Analog IC, SOP-8, 180nm
Logic ICs · Taiwan
1 IC
Audio Codec, QFN 4x4, 65nm
Logic ICs · Taiwan
1 IC
CAN Transceiver, SOIC-8, 180nm
Logic ICs · Taiwan
1 IC
Clock Generator, QFN, 65nm
Logic ICs · Taiwan
1 IC
DDR5 CKD, QFN, 28nm
Logic ICs · Taiwan
1 IC
DDR5 MDB, QFN, 28nm
Logic ICs · Taiwan
1 IC
DDR5 MRCD, QFN, 28nm
Logic ICs · Taiwan
1 IC
Display Driver, QFN 8x8, 40nm
Logic ICs · Taiwan
1 IC
ESD Protection, DFN, 65nm
Logic ICs · Taiwan
1 IC
Ethernet PHY, QFN 6x6, 28nm
Logic ICs · Taiwan
1 IC
1 IC
FPGA, FC-BGA 35x35, 28nm
Logic ICs · Taiwan
1 IC
Gate Driver, SOIC-8, 180nm
Logic ICs · Taiwan
1 IC
LDO Regulator, DFN, 180nm
Logic ICs · Taiwan
1 IC
LED Driver, TSSOP-16, 130nm
Logic ICs · Taiwan
1 IC
Logic Buffer, TSSOP, 130nm
Logic ICs · Taiwan
1 IC
Logic IC, CoWoS 2.5D, 3nm
Logic ICs · Taiwan
1 IC
Logic IC, FC-BGA, 14nm
Logic ICs · Taiwan
1 IC
Logic IC, FC-BGA, 5nm
Logic ICs · Taiwan
1 IC
Logic IC, FC-BGA, 7nm
Logic ICs · Taiwan
1 IC
Logic IC, FOWLP, 5nm
Logic ICs · Taiwan
1 IC
Logic IC, FOWLP, 7nm
Logic ICs · Taiwan
1 IC
MCU, LQFP-64, 28nm
Logic ICs · Taiwan
1 IC
MCU, LQFP-64, 40nm
Logic ICs · Taiwan
1 IC
MCU, LQFP-64, 65nm
Logic ICs · Taiwan
1 IC
MCU, QFN, 28nm
Logic ICs · Taiwan
1 IC
Motor Driver, QFN 6x6, 180nm
Logic ICs · Taiwan
1 IC
NOR Flash 128Mb, SOIC-8, 65nm
Logic ICs · Taiwan
1 IC
NPU, FC-BGA 27x27, 14nm
Logic ICs · Taiwan
1 IC
Op-Amp, SOIC-8, 180nm
Logic ICs · Taiwan
1 IC
PMIC, QFN 4x4, 180nm
Logic ICs · Taiwan
1 IC
Power MOSFET, TO-220, 180nm
Logic ICs · Taiwan
1 IC
RF LNA, QFN 3x3, 180nm
Logic ICs · Taiwan
1 IC
RS-485 Transceiver, SOIC-8, 130nm
Logic ICs · Taiwan
1 IC
RTC, SOIC-8, 130nm
Logic ICs · Taiwan
1 IC
Temperature Sensor, DFN, 180nm
Logic ICs · Taiwan
1 IC
UFS 5.0 Controller, FBGA, 5nm
Logic ICs · Taiwan
1 IC
USB Hub, QFN 7x7, 90nm
Logic ICs · Taiwan
1 IC
Voltage Reference, DFN, 180nm
Logic ICs · Taiwan
1 IC
WiFi/BT SoC, QFN 5x5, 28nm
Logic ICs · Taiwan
1 IC
DRAM IC 16Gb, FBGA, 1β
Memory components · South Korea
1 component
DRAM IC 8Gb, FBGA, 1α
Memory components · South Korea
1 component
DRAM IC 8Gb, FBGA, 1γ
Memory components · South Korea
1 component
GDDR7 IC 16Gb, FBGA, 1β
Memory components · South Korea
1 component
HBF Gen 1, 512 GiB, 16-Hi Stack
Memory components · South Korea
1 component
HBM3 16GB, 8-Hi Stack
Memory components · South Korea
1 component
HBM3 24GB, 12-Hi Stack
Memory components · South Korea
1 component
HBM3E 24GB, 8-Hi Stack
Memory components · South Korea
1 component
HBM3E 36GB, 12-Hi Stack
Memory components · South Korea
1 component
HBM4 32GB, 8-Hi Stack
Memory components · South Korea
1 component
2 variants · Yield scenario
HBM4 48GB, 12-Hi Stack
Memory components · South Korea
1 component
2 variants · Yield scenario
HBM4 64GB, 16-Hi Stack
Memory components · South Korea
1 component
2 variants · Yield scenario
LPDDR5 DRAM IC 8Gb, FBGA, 1α
Memory components · South Korea
1 component
LPDDR5 DRAM IC 8Gb, PoP, 1α
Memory components · South Korea
1 component
LPDDR5 DRAM IC 8Gb, WLCSP, 1α
Memory components · South Korea
1 component
LPDDR5X DRAM IC 16GB – 8DP WB-FBGA (8×16Gb, 1β)
Memory components · South Korea
1 component
LPDDR5X DRAM IC 16Gb, FBGA, 1β
Memory components · South Korea
1 component
LPDDR5X DRAM IC 16Gb, PoP, 1β
Memory components · South Korea
1 component
LPDDR5X DRAM IC 16Gb, WLCSP, 1β
Memory components · South Korea
1 component
1 component
LPDDR5X DRAM IC 4GB – DDP WB-FBGA (2×16Gb, 1β)
Memory components · South Korea
1 component
LPDDR5X DRAM IC 8GB – QDP WB-FBGA (4×16Gb, 1β)
Memory components · South Korea
1 component
NAND Flash IC 1TB, FBGA, 232L
Memory components · South Korea
1 component
NAND Flash IC 1TB, FBGA, 288L
Memory components · South Korea
1 component
NAND Flash IC 512Gb, FBGA, 176L
Memory components · South Korea
1 component
1-alpha DRAM wafer, 300mm, baseline scenario
Memory wafers · South Korea
1 wafer
2 variants · Operational scenario
1-beta DRAM wafer, 300mm, baseline scenario
Memory wafers · South Korea
1 wafer
2 variants · Operational scenario
1-gamma DRAM wafer, 300mm, baseline scenario
Memory wafers · South Korea
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario, Cryogenic etch
1 wafer
2 variants · Operational scenario, Cryogenic etch
1 wafer
5 variants · Operational scenario, Cryogenic etch
1 wafer
5 variants · Operational scenario, Cryogenic etch
1 wafer
5 variants · Operational scenario, Cryogenic etch
1 wafer
2 variants · Operational scenario
LED SMD 0603
Optoelectronics · China
1 component
LED SMD 2835
Optoelectronics · China
1 component
LED SMD 3528
Optoelectronics · China
1 component
LED SMD 3535
Optoelectronics · China
1 component
LED SMD High Efficiency
Optoelectronics · China
1 component
LED THT 5mm
Optoelectronics · China
1 component
Optical Fiber Singlemode
Optoelectronics · China
1 km
Optical Transceiver QSFP DD 400G
Optoelectronics · China
1 component
Optical Transceiver QSFP DD 400G FR4
Optoelectronics · China
1 component
Optical Transceiver QSFP DD 400G LR4
Optoelectronics · China
1 component
Optical Transceiver QSFP DD 400G Zr
Optoelectronics · China
1 component
Optical Transceiver QSFP28 100G SR4
Optoelectronics · China
1 component
1 package
DIP package
Packaging · Taiwan
1 package
Dual Flat No-lead package
Packaging · Taiwan
1 package
1 package
1 package
1 package
1 package
1 package
Fan-Out Wafer Level package
Packaging · Taiwan
1 package
1 package
1 package
1 package
1 package
Flip-Chip Ball Grid Array package
Packaging · Taiwan
1 package
1 package
2 variants · Stack height
1 package
2 variants · Stack height
Intel Foveros 3D Stacking package
Packaging · Taiwan
1 package
1 package
PLCC package
Packaging · Taiwan
1 package
Package-on-Package
Packaging · Taiwan
1 package
1 package
Quad Flat No-lead 2x2mm package
Packaging · Taiwan
1 package
Quad Flat No-lead 3x3mm package
Packaging · Taiwan
1 package
Quad Flat No-lead 4x4mm package
Packaging · Taiwan
1 package
Quad Flat No-lead 6x6mm package
Packaging · Taiwan
1 package
Quad Flat No-lead 7x7mm package
Packaging · Taiwan
1 package
Quad Flat No-lead 8x8mm package
Packaging · Taiwan
1 package
Quad Flat No-lead package
Packaging · Taiwan
1 package
Shrink Small Outline package
Packaging · Taiwan
1 package
1 package
1 package
Thin Quad Flat package
Packaging · Taiwan
1 package
Thin Shrink Small Outline package
Packaging · Taiwan
1 package
Thin Small Outline package
Packaging · Taiwan
1 package
Transistor Outline 220 package
Packaging · Taiwan
1 package
1 package
1 package
1 package
Wafer-Level Chip-Scale package
Packaging · Taiwan
1 package
1 package
1 package
1 package
Aluminum Electrolytic
Passives · China
1 piece
Chip Inductor
Passives · China
1 piece
Chip Inductor 0201
Passives · China
1 piece
Chip Inductor 0603
Passives · China
1 piece
Chip Inductor 0805
Passives · China
1 piece
Chip Resistor
Passives · China
1 piece
Chip Resistor 0201
Passives · China
1 piece
Chip Resistor 0402
Passives · China
1 piece
Chip Resistor 0805
Passives · China
1 piece
Chip Resistor 1206
Passives · China
1 piece
Common Mode Choke
Passives · China
1 piece
Current Sense Resistor
Passives · China
1 piece
Ferrite Bead
Passives · China
1 piece
Ferrite Bead 0402
Passives · China
1 piece
Ferrite Bead 0805
Passives · China
1 piece
Film Capacitor X2
Passives · China
1 piece
Film Capacitor Y2
Passives · China
1 piece
MLCC C0G
Passives · China
1 piece
MLCC X5R
Passives · China
1 piece
MLCC X7R
Passives · China
1 piece
MLCC X7R 0201
Passives · China
1 piece
MLCC X7R 0603
Passives · China
1 piece
MLCC X7R 0805
Passives · China
1 piece
MLCC X7R 1206
Passives · China
1 piece
MOV Varistor SMD
Passives · China
1 piece
NTC Thermistor SMD
Passives · China
1 piece
PFC Boost Inductor
Passives · China
1 piece
PTC Thermistor SMD
Passives · China
1 piece
Planar Transformer
Passives · China
1 piece
Resistor MELF
Passives · China
1 piece
Resistor THT Axial
Passives · China
1 piece
Ring Core Inductor
Passives · China
1 piece
1 piece
23 variants · Cathode chemistry, CV/g grade, EIA case size
Thermistor THT Disk
Passives · China
1 piece
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
1 m²
5 variants · Surface finish
CIS Image Sensor
Specialty · Taiwan
1 component
Diode MELF
Specialty · Taiwan
1 component
Diode SOD
Specialty · Taiwan
1 component
Discrete Rectifier GPP
Specialty · Taiwan
1 component
Discrete Schottky Diode
Specialty · Taiwan
1 component
Discrete TVS Diode
Specialty · Taiwan
1 component
Discrete Zener Diode
Specialty · Taiwan
1 component
GaN Power HEMT
Specialty · Taiwan
1 component
MEMS Accelerometer
Specialty · Taiwan
1 component
SiC Power MOSFET
Specialty · Taiwan
1 component
SiC Schottky Diode
Specialty · Taiwan
1 component
Transistor D2PAK
Specialty · Taiwan
1 component
Transistor DPAK
Specialty · Taiwan
1 component
Transistor SOT-223
Specialty · Taiwan
1 component
Transistor SOT-23
Specialty · Taiwan
1 component
Transistor TO-92
Specialty · Taiwan
1 component
1 wafer
2 variants · Operational scenario
CIS BSI 300mm wafer, 300mm, Japan
Specialty wafers · Japan
1 wafer
Discrete Silicon 200mm wafer, 200mm, China
Specialty wafers · China
1 wafer
GaAs VCSEL wafer, 100mm, United States
Specialty wafers · United States (WECC region)
1 wafer
1 variant · Geography
GaN-on-Si 200mm wafer, 200mm, Germany
Specialty wafers · Germany
1 wafer
1 variant · Geography
InGaAs Photodiode wafer, 100mm, United States
Specialty wafers · United States (WECC region)
1 wafer
1 variant · Geography
InP Laser Wafer 1550nm wafer, 100mm, United States
Specialty wafers · United States (WECC region)
1 wafer
1 variant · Geography
InP Laser wafer, 100mm, United States
Specialty wafers · United States (WECC region)
1 wafer
1 variant · Geography
LED GaN 100mm wafer, 100mm, China
Specialty wafers · China
1 wafer
MEMS Inertial 200mm wafer, 200mm, Germany
Specialty wafers · Germany
1 wafer
1 wafer
SiC 150mm wafer, 150mm, Germany
Specialty wafers · Germany
1 wafer
1 variant · Geography
ABF Substrate
Substrates · Taiwan
1 unit
BT Substrate
Substrates · Taiwan
1 unit
Heat Pipe Copper
Thermal · China
1 component
Heatsink Extruded Aluminum
Thermal · China
1 component
Thermal Grease Silicone
Thermal · China
1 g
Thermal Pad Silicone
Thermal · China
1 piece
Vapor Chamber Copper
Thermal · China
1 component
ArF Photoresist (193nm)
Upstream · Global
1 kg photoresist (ready-to-use)
Carbon tetrafluoride (CF4)
Upstream · Global
1 kg CF4 (electronic grade, >99.99%)
Copper CMP Slurry
Upstream · Global
1 kg
Fluorine (F2)
Upstream · Global
1 kg F2 (industrial grade, >99.5%)
Germane (GeH4)
Upstream · Global
1 kg GeH4 (electronic grade, >99.999%)
Hexafluoro-1,3-butadiene (C4F6)
Upstream · Global
1 kg C4F6 (electronic grade, >99.5%)
Nitrogen trifluoride (NF3)
Upstream · Global
1 kg NF3 (electronic grade, >99.9%)
Octafluorocyclobutane (c-C4F8)
Upstream · Global
1 kg C4F8 (electronic grade, >99.9%)
Oxide CMP Slurry
Upstream · Global
1 kg
1 kg polyimide (PMDA/ODA type, cured film)
Sulfur hexafluoride (SF6)
Upstream · Global
1 kg
1 kg developer solution (2.38% TMAH in water, electronic grade)
1 kg TMAH (pure, 100% basis; electronic grade)
Trimethylaluminum (Al(CH3)3)
Upstream · Global
1 kg TMAl (electronic grade)
Trimethylgallium (Ga(CH3)3)
Upstream · Global
1 kg TMGa (electronic grade, 6N)
Trimethylindium (In(CH3)3)
Upstream · Global
1 kg TMIn (electronic grade, 6N)
Tungsten CMP Slurry
Upstream · Global
1 kg
Tungsten hexafluoride (WF6)
Upstream · Global
1 kg WF6 (semiconductor grade, >99.999%)
1 m³
Water Supply (Municipal)
Upstream · Global
1 m³
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
3nm FinFET/GAA wafer, 300mm, Arizona, baseline scenario
Wafers · United States (WECC region)
1 wafer
5 variants · Operational scenario, Geography
1 wafer
2 variants · Operational scenario
5nm FinFET wafer, 300mm, Arizona, baseline scenario
Wafers · United States (WECC region)
1 wafer
5 variants · Operational scenario, Geography
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario
1 wafer
2 variants · Operational scenario