Overview

General comment

Classic through-hole transistor package. Most common THT package for small signal transistors (2N2222, 2N3904, BC547, etc.). Epoxy transfer molded with formed leads. Still widely used despite SMD transition due to ease of prototyping and high power handling for size.

Technology: Standard manufacturing process
Geography: Global average data from equipment vendor specifications and industry literature

System boundary

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 1.8 Very good

Reliability

2.5

Completeness

2.1

Temporal

1.6

Geographic

2.0

Technological

1.0

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure: Component vendor specifications, academic papers, industry literature
Coverage status: Partial
Pedigree-scored source files: 5 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

15 flows. Quantities are not published; they ship with the dataset on Circa.

200mm Bipolar/MOS Discrete REEL datasetwafer

Derivation basis: Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.
Source citations: Not stated
Upstream REEL dataset: Discrete Silicon 200mm wafer, 200mm, China
Background dataset: Modelled by REEL; see the upstream dataset above.
Notes: Yield-adjusted wafer fraction; carries the suppressed wafer-fab elementary flows
Uncertainty: No range defined.
Unit: wafer

CF₄ production Process gasg · -49.2% / +69.5%

Derivation basis: No retrievable public document identified

No source is attached to this row.
Source citations: Not stated
Upstream REEL dataset: Carbon tetrafluoride (CF4)
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: -49.2% / +69.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

SF₆ production Process gasg · -49% / +53%

Derivation basis: No retrievable public document identified

No source is attached to this row.
Source citations: Not stated
Upstream REEL dataset: Sulfur hexafluoride (SF6)
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: -49% / +53% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Water supply (municipal) Waterm3 · ±22.7%

Derivation basis: This quantity is the sum of two terms: the package-assembly share of the model aggregated demand, and the wafer dicing the model records as component-owned, which no other dataset referenced by this dataset carries. Where the two terms were authored in different volume units, the dicing term was converted to the unit already in use on this row before they were added.

The sources for this row are listed below.
Source citations: Disco Corporation DFD6361 dicing saw specifications (blade-dicing cutting-water flow rate)
Upstream REEL dataset: Water Supply (Municipal)
Background dataset: Modelled by REEL; see the upstream dataset above.
Notes: Net fresh-water intake, supplied as municipal water; package-level only; wafer-fab water carried by the wafer reference. The uncertainty range is the pre-split range scaled by the same package share, not a range derived for the package step on its own. The package share is stated net of wafer fabrication, which the wafer reference carries; the component-owned dicing term is additional to it and is not part of that share, so the qualifier above applies to the package term alone.
Uncertainty: ±22.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: m3

Wafer transport, CN fab to packaging site - Air (short haul) Freight transporttkm · -47.4% / +80%

Derivation basis: Specified for this manufacturing operation and scaled to the dataset's functional unit.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: transport, freight, aircraft, dedicated freight, short haul
Notes: Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from fab to packaging site, cross-border. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable wafer shipping box for this wafer diameter and its secondary carton. The factor for this diameter is derived from two published container masses, one of which is taken from an online marketplace listing rather than a manufacturer datasheet; that lighter figure pulls the factor down, so the value used is the lower of the two readings available rather than the cautious one, and the box it describes is not the front-opening shipping box used at the larger wafer diameter; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Air freight is allocated on chargeable weight rather than actual shipped mass. The authored band holds the fixed route distance: its lower endpoint uses actual shipped mass, its central uses chargeable-weight allocation, and its upper endpoint adds the separate reusable-carrier return service, not aircraft backhaul.
Uncertainty: -47.4% / +80% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: tkm — tonne-kilometres, a transport effort rather than a mass

Electricity, Taiwan (TW) ElectricitykWh · -18.6% / +24.7%

Derivation basis: Calculated from equipment energy across all manufacturing operations, plus facility support such as cleanroom HVAC, ultrapure water, cooling, gas abatement, and bulk gases.
This quantity is the sum of two terms: the package-assembly share of the model aggregated demand, and the wafer dicing the model records as component-owned, which no other dataset referenced by this dataset carries.

The sources below are this row's own, and those of the manufacturing operations behind it.
Source citations: Disco Corporation DFD6361 dicing saw specifications (blade-dicing process power and wafer throughput)
Sources (inherited): Inherited, rolled up from the contributing process steps:

despatch.com (date not recorded). Despatch - LCC/LCD clean process ovens datasheet (PDF). Vendor specification.

Guste, Marinas & Ong, Machines 12 (2024) 467, Table 3; Besi Datacon 2200 evo product page

sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Package-on-package (PoP) with Through-mold Vias (2008). Trade press article.

directindustry.com (date not recorded). DirectIndustry - Kulicke & Soffa IConn (ProCu) PLUS wire bonder listing (1.5 kVA nominal / 2.6 kVA max).

c2mi.ca (date not recorded). C2MI - IConn ProCu Plus LA equipment listing.

electronicspecifier.com (date not recorded). electronicspecifier - ASMPT unveils latest wire bonder (Eagle AERO, up to 24 2-mm connections/s), 26 Sep 2022. Trade press article.
Background data: ecoinvent 3.12
Background dataset: electricity, high voltage
Notes: package-level only; wafer-fab electricity carried by the wafer reference. The uncertainty range is the pre-split range scaled by the same package share, not a range derived for the package step on its own. The package share is stated net of wafer fabrication, which the wafer reference carries; the component-owned dicing term is additional to it and is not part of that share, so the qualifier above applies to the package term alone.
Uncertainty: -18.6% / +24.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kWh

N₂ Process gasg · -0.4% / +0.8%

Source citations: uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
Background data: ecoinvent 3.12
Background dataset: nitrogen, liquid
Notes: package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
Uncertainty: -0.4% / +0.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Compressed air Process gasg · -28% / +30.6%

Source citations: CAE Online: Teradyne Catalyst Specifications
EE Journal: "Advantest Unveils New Ultra-High-Current Power Supply" (2024)
4Semi: TEL Precio Wafer Prober Specifications
FormFactor Summit 11000/12000 Facility Planning Guide
3D InCites: "ERS Electronic Introduces High Power Dissipation Thermal Chuck" (2023)
Abachy: "How Much Energy and Water Are Required for Wafer Fabrication" (2025)
Background data: ecoinvent 3.12
Background dataset: compressed air, 700 kPa gauge
Notes: package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
Uncertainty: -28% / +30.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

H₂ Process gasg · -40.7% / +80.9%

Derivation basis: No retrievable public document identified

The sources for this row are listed below.
Source citations: uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
Background data: ecoinvent 3.12
Background dataset: hydrogen, gaseous, low pressure
Uncertainty: -40.7% / +80.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Silver Process chemicalg

Source citations: aitechnology.com (date not recorded). AI Technology, Inc., "ME8650-RC Inline Die-Attach" product data sheet, Ver. 2.0, 2 April 2018 (single-component silver-filled die-attach paste for needle dispensing and screen printing on leadframes). PDF document.
meridianadhesives.com (date not recorded). Epoxy Technology (Meridian Adhesives Group), Tech Tip 6, "The Importance of Minimum Bond Line in Epoxy Curing and Adhesion" (minimum and ideal bond-line thickness by adhesive type).
Background data: ecoinvent 3.12
Background dataset: silver
Notes: From Die attach epoxy (Ag-filled conductive) (84.5% silver)
Uncertainty: No range defined.
Unit: g

Epoxy resin, liquid Process chemicalg

Source citations: aitechnology.com (date not recorded). AI Technology, Inc., "ME8650-RC Inline Die-Attach" product data sheet, Ver. 2.0, 2 April 2018 (single-component silver-filled die-attach paste for needle dispensing and screen printing on leadframes). PDF document.
meridianadhesives.com (date not recorded). Epoxy Technology (Meridian Adhesives Group), Tech Tip 6, "The Importance of Minimum Bond Line in Epoxy Curing and Adhesion" (minimum and ideal bond-line thickness by adhesive type).
Background data: ecoinvent 3.12
Background dataset: epoxy resin, liquid
Notes: From Die attach epoxy (Ag-filled conductive) (15.5% epoxy)
Uncertainty: No range defined.
Unit: g

Leadframe Cu Materialg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.
Source citations (dataset-level): ASM Pacific Technology. IDEALmold Specifications
Disco Corporation. DFL7161 Laser Saw Specifications
AAM International (Strip sizes 100x300mm)
US Patent 5945259A (Etching photoresist thickness)
US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
Bruderer BSTA 510 Specs (510kN, 22kW)
Samhoor Press Specs (200-800 SPM)
Background data: ecoinvent 3.12
Background dataset: copper, cathode
Uncertainty: No range defined.
Unit: g

Epoxy Mold Materialg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.
Source citations (dataset-level): ASM Pacific Technology. IDEALmold Specifications
Disco Corporation. DFL7161 Laser Saw Specifications
AAM International (Strip sizes 100x300mm)
US Patent 5945259A (Etching photoresist thickness)
US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
Bruderer BSTA 510 Specs (510kN, 22kW)
Samhoor Press Specs (200-800 SPM)
Background data: ecoinvent 3.12
Background dataset: epoxy resin insulator, SiO2
Uncertainty: No range defined.
Unit: g

Al Wire Materialg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.
Source citations (dataset-level): ASM Pacific Technology. IDEALmold Specifications
Disco Corporation. DFL7161 Laser Saw Specifications
AAM International (Strip sizes 100x300mm)
US Patent 5945259A (Etching photoresist thickness)
US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
Bruderer BSTA 510 Specs (510kN, 22kW)
Samhoor Press Specs (200-800 SPM)
Background data: proxy-mapped
Background dataset: aluminium, cast alloy
Uncertainty: No range defined.
Unit: g

Sn Plating Materialg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.
Source citations (dataset-level): ASM Pacific Technology. IDEALmold Specifications
Disco Corporation. DFL7161 Laser Saw Specifications
AAM International (Strip sizes 100x300mm)
US Patent 5945259A (Etching photoresist thickness)
US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
Bruderer BSTA 510 Specs (510kN, 22kW)
Samhoor Press Specs (200-800 SPM)
Background data: ecoinvent 3.12
Background dataset: tin
Uncertainty: No range defined.
Unit: g

Outputs and waste

Silicon Kerf Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

ASM Pacific Technology. IDEALmold Specifications

Disco Corporation. DFL7161 Laser Saw Specifications

AAM International (Strip sizes 100x300mm)

US Patent 5945259A (Etching photoresist thickness)

US Patent 6008068A (Leadframe thickness 0.125-0.25mm)

Strano 2025 (Lubricant 0.8-5 g/m²)

Bruderer BSTA 510 Specs (510kN, 22kW)

Samhoor Press Specs (200-800 SPM)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Mixed process waste Solid wasteg · ±0.9%

Source citations: p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Drag-Out Reduction (2000). Report.
p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Rinse Water Reduction (2000). Report.
Park et al. - Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn-Ag alloy solders for flip-chip interconnections, RSC Advances, 2017
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: ±0.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Emissions to air

1 elementary flow released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

VOCs (from epoxy cure) Emission to airg

Source citations (dataset-level): etd.gsfc.nasa.gov (date not recorded). NASA Goddard Space Flight Center, Engineering and Technology Directorate, "Outgassing Data for Selecting Spacecraft Materials" online database, complete CSV export (13,582 records; ASTM E595 total mass loss, collected volatile condensable material and water vapour regained by material, manufacturer and application).
etd.gsfc.nasa.gov (date not recorded). NASA Goddard Space Flight Center, Engineering and Technology Directorate, "Outgassing Database - User Guide" (ASTM E595 apparatus and conditions, TML / CVCM / WVR definitions, and the low-outgassing pass criteria).
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

ASM Pacific Technology. IDEALmold Specifications

Disco Corporation. DFL7161 Laser Saw Specifications

besi.com (date not recorded). Besi / Fico AMS-i transfer molding system - product page. Vendor specification.

besi.com (date not recorded). Besi / Fico AMS-LM transfer molding system - product page. Vendor specification.

besi.com (date not recorded). Besi / Fico Molding Line (wafer/panel compression-transfer) - product page. Vendor specification.

towajapan.co.jp (date not recorded). TOWA Corporation - Molding Equipment (YPM series transfer presses). Vendor specification.

sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Materials and Methods for IC Package Assemblies (2005). Trade press article.

sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Step 10: Encapsulation - Materials, Processes and Equipment (2004). Trade press article.

Investigation on Material Removal Rate in Rotation Grinding

SVM. "Wafer Thinning Services & Removal Rates."

Hapoin. "Okamoto GNX200B Specifications."

DISCO Corp. "DGP8761 Fully Automatic Grinder/Polisher Datasheet."

IMAPS/Scispace. "Optimized Die Preparation for High Yield Hybrid Bonding."
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Emissions to water

1 elementary flow released to water by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Si Emission to waterg

Source citations: p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Drag-Out Reduction (2000). Report.
p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Rinse Water Reduction (2000). Report.
Park et al. - Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn-Ag alloy solders for flip-chip interconnections, RSC Advances, 2017
Compartment: Water (surface water)
CAS number: 7440-21-3
ecoinvent 3.12 elementary flow: Silicon
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Flows not quantified

1 flow is recorded for this dataset but carries no quantity — cut off below the significance threshold, or with no background dataset available. It remains inside the declared system boundary; each is listed with its reason.

Cut off - below the significance threshold (1)

Silicon Die Materialg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.
Source citations (dataset-level): ASM Pacific Technology. IDEALmold Specifications
Disco Corporation. DFL7161 Laser Saw Specifications
AAM International (Strip sizes 100x300mm)
US Patent 5945259A (Etching photoresist thickness)
US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
Bruderer BSTA 510 Specs (510kN, 22kW)
Samhoor Press Specs (200-800 SPM)
Background data: cut off
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: This die or wafer input is carried as a reference to its own upstream dataset elsewhere in this inventory. This mass-tracking row is excluded from upstream linkage so the same input is not counted twice.
Uncertainty: No range defined.
Unit: g

Process steps deferred in this release (2)

Steps of this dataset's process flow that are declared but carry no quantified inventory in this release. Each is listed with its reason.

Lead form (utility only): Lead form: the electricity this step draws is included in this dataset, from a figure pinned on the step itself. Everything else the step consumes or releases is deferred pending public data.
Test (utility only): Test: the electricity this step draws is included in this dataset, from a figure pinned on the step itself. Everything else the step consumes or releases is deferred pending public data.

Limitations and unquantified flows (3)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

The conductive die-attach adhesive dose on this dataset is scaled from the die-attach process file's reference die by declared die area, which is that file's own published rule. This product's die is far smaller than any die that rule was published for, so the dose is an extrapolation below the evidence: the rule is slightly under-linear at the smallest published point, and below some die size the dose stops being set by area at all and becomes the dispenser's minimum reliable dot volume, which the process file does not publish. The shipped dose is therefore a lower bound on the adhesive, and on the silver it carries.
For these process steps the modelled flow includes the electricity they draw and nothing else; their materials, their consumables and any release they make are not modelled and are deferred pending public data: Lead form; Test.
Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase: Product operation is outside the cradle-to-gate scope.
End-of-life treatment: Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail: The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials: Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers: Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication: A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead: Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods: Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits: Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim: Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing: Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages: Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
Volatile organics (photoresist solvents, PGMEA) - air quality
Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol