Overview

General comment

Finished ABF substrate supplied with solder balls attached, built up from Ajinomoto build-up film laminated over a bismaleimide-triazine core. The product leaves the substrate supplier with its SAC305 solder balls already attached; package assemblers reference that with-balls product and do not add a second substrate-ball material or attach operation.

Technology: Twelve-layer build-up ABF flip-chip BGA substrate manufacturing (four-layer BT core, eight laser-microvia build-up layers)
Geography: Global-average unit-process donors; Taiwan is the reference production geography.

System boundary

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 2.2 Good

Reliability

2.5

Completeness

2.5

Temporal

2.4

Geographic

2.0

Technological

1.9

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure: Equipment vendor specifications, academic papers, and industry literature inherited from donors.
Coverage status: Partial
Pedigree-scored source files: 20 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

32 flows. Quantities are not published; they ship with the dataset on Circa.

Kraft press paper Materialkg · -57.1% / +90.5%

Derivation basis: This flow is a consumable of the manufacturing operation. The model reads it from the operation's own inventory rather than from the product's bill of materials.

The sources for this row are listed below.
Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
Background data: ecoinvent 3.12
Background dataset: kraft paper
Uncertainty: -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Electricity, Taiwan (TW) ElectricitykWh · -29.9% / +52.2%

Derivation basis: Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

Atotech Neoganth X Activator specifications

P2InfoHouse drag-out reduction study

Atotech Neoganth X Activator specifications; A Pollution Prevention Resource Manual for Metal Finishers - A Competitive Advantage Manual

The Electrochemical Recovery of Metallic Palladium from Spent Electroless Plating Solution (JOM, 2009)

AllPCB and RayPCB lamination process documentation

iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.

electronics.org. Copper Electroplating Technology for Microvia Filling.

magazines007.com. The PCB Magazine, February 2012.

epawebapp.epa.ie (date not recorded). IE LICENCE APPLICATION OPERATION REPORT. PDF document.

dravyom.com (date not recorded). Electroless Copper Plating Bath. Web page.

Kewei Industries, "PCB Lamination Press Parameters."

AllPCB, "PCB Lamination Pressure."

MDPI, "PCB fabrication energy audit report," 2021

Kewei Industries, "Schmoll PCB Driller Specifications."

ESI, "5335 Via Drilling System Specifications."

Spectra-Physics, "UV Laser PCB Manufacturing," 2016

insulectro.com (2021). Microfill EVF Copper Via Fill. PDF document.

Chung et al. (2025). A three-dimensional bipolar microneedle electrode array with local ground integrated at each sidewall for enhanced focal electric stimulation. Microsystems & Nanoengineering. DOI: 10.1038/s41378-025-01093-0.

rit.edu (2018). Wilhelm, ACS AM&I (2018). ACS AM&I (2018).

KLA (date not recorded). KLAC BROCHURE Nuvogo 800.

KLA (date not recorded). KLAC BROCHURE Nuvogo 700.

KLA (date not recorded). KLAC BROCHURE Nuvogo Fine.
Background data: ecoinvent 3.12
Background dataset: electricity, medium voltage
Uncertainty: -29.9% / +52.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kWh

Fresh water WaterL · -31% / +40.5%

Derivation basis: Calculated from process-water and ultrapure-water demand across all manufacturing operations. This model includes no facility support, so the demand is the manufacturing operations alone. The fresh intake shown is that demand less the share reused under the water-recycling scenario this dataset assumes, and wastewater follows the same balance.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

ResearchGate, Water use in PCB manufacturing

Envirowise, Water use in PCB manufacturing

Patent CN102286761B, Acid Copper Additives

Patent US5151170A, Brightener Consumption

SysPCB, Inner Layer Process

NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: tap water
Notes: Process and cleaning water
Uncertainty: -31% / +40.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: L

Compressed air Process gasg · -23.6% / +31.9%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: compressed air, 700 kPa gauge
Uncertainty: -23.6% / +31.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

N₂ Process gasg · -19.7% / +21.4%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: nitrogen, liquid
Uncertainty: -19.7% / +21.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Potassium permanganate Process chemicalg · -81.3% / +34.1%

Source citations: patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment - Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results (grant #X 823856; update to EPA 744-R-95-006). Government report.
zsepb.zs.gov.cn (date not recorded). Zhongshan Dajin Electronics Co. Ltd, annual 5 million m2 circuit-board expansion and retrofit project, environmental impact report form (zhong shan shi da jin dian zi you xian gong si nian chan 500 wan ping fang mi xian lu ban gai kuo jian xiang mu huan jing ying xiang bao gao biao), December 2024, project code 2404-442000-04-01-964388. PDF document.
Background data: ecoinvent 3.12
Background dataset: potassium permanganate
Uncertainty: -81.3% / +34.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium hydroxide Process chemicalg · -33% / +49.8%

Derivation basis: calculated from pH maintenance requirements

The sources for this row are listed below.
Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: sodium hydroxide, without water, in 50% solution state
Uncertainty: -33% / +49.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Neutralizer (sulfuric acid or HCl) Process chemicalg · -20% / +50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: sulfuric acid
Uncertainty: -20% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper sulfate pentahydrate Process chemicalg · -31.8% / +35.5%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: copper sulfate
Uncertainty: -31.8% / +35.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Formaldehyde Process chemicalg · -39.2% / +78.8%

Source citations: Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.
pcdandf.com (date not recorded). Practices for Sustainability in PCB Metallization. Web page.
nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (1997). Design for the Environment Printed Wiring Board Project: Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1 (Draft). Web page.
nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (1998). Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1. Web page.
2003. US3532519A - Electroless copper plating process. Metal Finishing. DOI: 10.1016/s0026-0576(99)80316-x.
dravyom.com (date not recorded). Electroless Copper Plating Bath. Web page.
Altynbaeva et al. (2023). Eco-Friendly Electroless Template Synthesis of Cu-Based Composite Track-Etched Membranes for Sorption Removal of Lead(II) Ions. Membranes. DOI: 10.3390/membranes13050495.
Trouble in Your Tank: A Process Engineer's Guide to Electroless Copper
Background data: ecoinvent 3.12
Background dataset: formaldehyde
Uncertainty: -39.2% / +78.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Palladium catalyst Process chemicalg · -40% / +60%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: palladium
Notes: Proxy mapping uses 60% of the material mass.
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sulfuric acid Process chemicalg · -41.8% / +86.3%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: sulfuric acid
Uncertainty: -41.8% / +86.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Dry Film Resist Process chemicalg · -7.4% / +11.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: methyl methacrylate
Uncertainty: -7.4% / +11.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium carbonate developer Process chemicalg · -33.3% / +50%

Source citations: electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
Background data: ecoinvent 3.12
Background dataset: soda ash, dense
Uncertainty: -33.3% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium hydroxide stripper Process chemicalg · -50% / +66.7%

Source citations: electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
Background data: ecoinvent 3.12
Background dataset: sodium hydroxide, without water, in 50% solution state
Uncertainty: -50% / +66.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Hydrochloric acid Process chemicalg · -34.6% / +74.3%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: hydrochloric acid, without water, in 30% solution state
Uncertainty: -34.6% / +74.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Hydrogen peroxide Process chemicalg · -35.4% / +77.7%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: hydrogen peroxide, without water, in 50% solution state
Uncertainty: -35.4% / +77.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

EDTA chelator Process chemicalg

Source citations: Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.
Background data: ecoinvent 3.12
Background dataset: EDTA, ethylenediaminetetraacetic acid
Uncertainty: No range defined.
Unit: g

Sodium hydroxide (pH control) Process chemicalg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: sodium hydroxide, without water, in 50% solution state
Uncertainty: No range defined.
Unit: g

Hydrochloric acid (chloride source) Process chemicalg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: hydrochloric acid, without water, in 30% solution state
Uncertainty: No range defined.
Unit: g

Solder mask solvent carrier Process chemicalg · -62.9% / +20%

Source citations: epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP), Volume II Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, February 1999. Government report.
taiyo-america.com (date not recorded). TAIYO PSR-4000 LEW1 (US) Liquid Photoimageable Solder Mask, Technical Data Sheet, revised July 2013. Vendor datasheet.
electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Background data: proxy-mapped
Background dataset: chemical, organic, unspecified
Uncertainty: -62.9% / +20% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Nickel sulfate Process chemicalg · -25% / +37.5%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: nickel sulfate
Uncertainty: -25% / +37.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium hypophosphite Process chemicalg · -22% / +33.1%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: proxy-mapped
Background dataset: sodium phosphate
Uncertainty: -22% / +33.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Gold potassium cyanide Process chemicalg · -33.3% / +33.4%

Source citations: Dow AUROLECTROLESS SMT 525G TDS; Florida CirTech IG300 TDS
Background data: proxy-mapped
Background dataset: gold
Notes: Proxy mapping uses 68.4% of the material mass.
Uncertainty: -33.3% / +33.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Potassium cyanide Process chemicalg · -40% / +60%

Source citations: IPC-4552B; industry immersion gold specifications
Background data: proxy-mapped
Background dataset: sodium cyanide
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Stencil cleaner (IPA) Process chemicalg · -49.9% / +100.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: isopropanol
Uncertainty: -49.9% / +100.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Flux (water soluble) Process chemicalg · -39.9% / +100.1%

Derivation basis: Flux type for FOWLP solder ball attach

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: flux, for wave soldering
Uncertainty: -39.9% / +100.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

BT (Bismaleimide Triazine) resin core Materialkg · -4.4% / +16.6%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: glass fibre reinforced plastic, polyester resin, hand lay-up
Notes: Purchased input grossed to fund the authored process loss booked as Resin bleed-out, Dicing slurry (Si/EMC/Cu particles) (mass-closure funding; the retained mass is the product-side figure).
Uncertainty: -4.4% / +16.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Ajinomoto Build-up Film (ABF GX-92R) Materialkg · -1.1% / +3%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: epoxy resin insulator, SiO2
Notes: Purchased input grossed to fund the authored process loss booked as Epoxy smear residue, Ablated dielectric debris (mass-closure funding; the retained mass is the product-side figure).
Uncertainty: -1.1% / +3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Copper Materialkg · -1.4% / +0.8%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: copper, cathode
Notes: Purchased input grossed to fund the authored process loss booked as Copper from treated etchant drag-out, Copper sludge (recovered), Spent etchant copper (post-electrowinning), Dicing slurry (Si/EMC/Cu particles) (mass-closure funding; the retained mass is the product-side figure).
Uncertainty: -1.4% / +0.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Solder Mask Materialkg · ±5.2%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: epoxy resin, liquid
Notes: Purchased input grossed to fund the authored process loss booked as Solder mask solids (developed) (mass-closure funding; the retained mass is the product-side figure).
Uncertainty: ±5.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

SAC305 Materialkg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: composite
Background dataset: Modelled as a composite of its constituent materials.
Uncertainty: No range defined.
Unit: kg

Outputs and waste

Wastewater Wastewaterm3 · -31% / +40.5%

Derivation basis: Calculated from the water balance: fresh-water input minus evaporation.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

ResearchGate, Water use in PCB manufacturing

Envirowise, Water use in PCB manufacturing

Patent CN102286761B, Acid Copper Additives

Patent US5151170A, Brightener Consumption

SysPCB, Inner Layer Process

NMFRC, Electroless Nickel Stoichiometry
Background data: carried, no background dataset
Background dataset: No treatment route recorded for this output.
Uncertainty: -31% / +40.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: m3

Resin bleed-out Solid wasteg · -80% / +299.7%

Source citations: electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17, "Resin Flow Percent of Prepreg", Revision D, dated 8/97 (Originating Task Group: MIL-P-13949 Test Methods Task Group 7-11b). PDF document.
electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17.2, "Resin Flow of 'No Flow' Prepreg", Revision B, dated 8/97. PDF document.
electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.4.38, "Prepreg Scaled Flow Testing", Revision A, dated 6/91. PDF document.
kinwong.com (date not recorded). Kinwong Electronic Technology (Longchuan) - expansion and retrofit project completion environmental-protection acceptance monitoring report, form version (jian she xiang mu jun gong huan bao yan shou jian ce bao gao (biao)), 2021-08, 129 pp. (monitoring by Shenzhen Zhengyan Testing Technology Co., Ltd.). PDF document.
zjjcmspublic.oss-cn-hangzhou-zwynet-d01-a.internet.cloud.zj.gov.cn (date not recorded). Zhejiang Luoqitaike (Rocktek) Technology Co., Ltd. - annual 0.8M m2 double-sided and multilayer circuit board project, construction-project environmental impact report form, pollution-impact class (jian she xiang mu huan jing ying xiang bao gao biao), April 2023, 167 pp. (prepared by Jinhua Huanke Environmental Technology Co., Ltd.). PDF document.
patents.google.com (date not recorded). Hexion Specialty Chemicals Inc., US7592067B2, "Epoxy resin compositions, processes utilizing same and articles made therefrom", priority 2003-09-22, issued 2009-09-22. Patent.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -80% / +299.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Kraft press paper Solid wasteg · -57.1% / +90.5%

Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for waste paperboard, sorted
Uncertainty: -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Epoxy smear residue Solid wasteg · -73.9% / +195.5%

Source citations: patents.google.com (date not recorded). Electrochemicals Inc., US6454868B1, "Permanganate desmear process for printed wiring boards", issued 2002-09-24. Patent.
isola-group.com (date not recorded). Young, T. (Isola); Polakovic, F. and Carano, M. (Electrochemicals Inc.), "Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing", paper S09-6-1. PDF document.
link.springer.com (date not recorded). Cheng, Y.-H.; Hsu, C.-C.; Lan, C.-J.; Munoz, S.; Caparanga, A.; Soriano, A.N.; Li, M.-H., "Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller", Journal of Electronic Materials, 2009, 38(11): 2368-2375. Journal article.
sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
17260206.s21i.faiusr.com (date not recorded). Victory Giant Technology (Huizhou) Co., Ltd. - Plant 9 Intelligent CNC Machining Centre Project (Phase 1), completion environmental-protection acceptance monitoring report, March 2026 (prepared by Huizhou Landing Environmental Technology Co., Ltd.). PDF document.
aivon.com (date not recorded). Aivon, "How We Resolved PCB Solder Mask Opening Design Conflicts in a 2-Layer FR4 PCB" (engineering case, production record #FR4-20260708-079).
kinjipcb.com (date not recorded). Kinji Group (KinjiPCB), product page "10 Layer FR4 ENIG Mass Production PCB" (product/142).
jlcpcb.com (date not recorded). JLCPCB Help Centre, "In what cases will there be charged extra?", section 9 "Too Many Drilling Holes" (page dated "Last updated on Aug 13, 2026").
pcbtok.com (date not recorded). PCBTok (Sony He), "Complete PCB Via Size Guideline", 5 November 2024, section "PCB Density".
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -73.9% / +195.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Manganese sludge (filter cake) Solid wasteg · -86% / +101.2%

Source citations (dataset-level): sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
epa.gov (date not recorded). U.S. EPA Office of Water - Preliminary Study of the Electrical and Electronic Components Point Source Category (40 CFR Part 469), EPA-821-R-22-005, DCN 11197, November 2022. Government report.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -86% / +101.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper in wastewater-treatment sludge/recovery Solid wasteg · -2.5% / +0.6%

Source citations (dataset-level): mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.

epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.

19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -2.5% / +0.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper recovered before outfall discharge Solid wasteg · -100% / +177.7%

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -100% / +177.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Anode sludge (phosphorus) Solid wasteg · -25% / +50.1%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

ResearchGate, Water use in PCB manufacturing

Envirowise, Water use in PCB manufacturing

Patent CN102286761B, Acid Copper Additives

Patent US5151170A, Brightener Consumption

SysPCB, Inner Layer Process

NMFRC, Electroless Nickel Stoichiometry

nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (2000). Printed Wiring Board Surface Finishes: Volume 2 Appendices, Draft Cleaner Technologies Substitutes Assessment. Web page.

insulectro.com (2021). Microfill EVF Copper Via Fill. PDF document.

enviolet.com (2004). Copper Bath Recycling in PCB by Atotech 2004. PDF document.

insulectro.com (2021). Electroposit 1000 acid Copper. PDF document.

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -25% / +50.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

DFR cover film (peeled before exposure) Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Spent / lock-in DFR rejects Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: No range defined.
Unit: g

Develop sludge (filtered DFR particulate) Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

electronics.org. The Latest Technical Trend of Dry Film Photo Resist.

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: No range defined.
Unit: g

Stripped DFR (post-plate) Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: No range defined.
Unit: g

Copper from treated etchant drag-out Solid wasteg · -89.2% / +125.3%

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -89.2% / +125.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper sludge (recovered) Solid wasteg · -2.5% / +0.5%

Source citations (dataset-level): sthjj.ganzhou.gov.cn (date not recorded). Ganzhou Municipal Ecology and Environment Bureau, Guideline for standardised environmental management of hazardous waste in the printed circuit board industry of Ganzhou (trial) (gan zhou shi yin zhi dian lu ban hang ye wei xian fei wu gui fan hua huan jing guan li zhi nan (shi xing)), document Gan Shi Huan Sheng Tai [2025] No. 5, issued 2025-12-26, effective 2026-01-31. PDF document.
Kinwong Electronic Technology (Longchuan) Co. Ltd - expansion and retrofit project completion environmental-protection acceptance monitoring report, form version (jian she xiang mu jun gong huan bao yan shou jian ce bao gao (biao)), 2021-08, 129 pp
Zhejiang Luoqitaike (Rocktek) Technology Co. Ltd - annual 0.8 million m2 double-sided and multilayer circuit board project, construction-project environmental impact report form, pollution-impact class, April 2023, 167 pp
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

sthjj.ganzhou.gov.cn (date not recorded). Ganzhou Municipal Ecology and Environment Bureau, Guideline for standardised environmental management of hazardous waste in the printed circuit board industry of Ganzhou (trial) (gan zhou shi yin zhi dian lu ban hang ye wei xian fei wu gui fan hua huan jing guan li zhi nan (shi xing)), document Gan Shi Huan Sheng Tai [2025] No. 5, issued 2025-12-26, effective 2026-01-31. PDF document.

Kinwong Electronic Technology (Longchuan) Co. Ltd - expansion and retrofit project completion environmental-protection acceptance monitoring report, form version (jian she xiang mu jun gong huan bao yan shou jian ce bao gao (biao)), 2021-08, 129 pp

Zhejiang Luoqitaike (Rocktek) Technology Co. Ltd - annual 0.8 million m2 double-sided and multilayer circuit board project, construction-project environmental impact report form, pollution-impact class, April 2023, 167 pp
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -2.5% / +0.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Ablated dielectric debris Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Spent bath bail-out (sludge + Cu precipitate) Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.

Trouble in Your Tank: A Process Engineer's Guide to Electroless Copper

pcdandf.com (date not recorded). Practices for Sustainability in PCB Metallization. Web page.

nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (1997). Design for the Environment Printed Wiring Board Project: Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1 (Draft). Web page.

nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (1998). Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1. Web page.

2003. US3532519A - Electroless copper plating process. Metal Finishing. DOI: 10.1016/s0026-0576(99)80316-x.

dravyom.com (date not recorded). Electroless Copper Plating Bath. Web page.

Altynbaeva et al. (2023). Eco-Friendly Electroless Template Synthesis of Cu-Based Composite Track-Etched Membranes for Sorption Removal of Lead(II) Ions. Membranes. DOI: 10.3390/membranes13050495.

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: No range defined.
Unit: g

Anode bag sludge (phosphorus + organic adsorbates) Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.

research.sabanciuniv.edu (date not recorded). PROCESS INTEGRATION AND TECHNOLOGY DEVELOPMENT FOR LOW-COST, ACCESSIBLE HIGH DENSITY INTERCONNECT (HDI) PRINTED CIRCUIT BOARDS (PCBs). PDF document.

patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: No range defined.
Unit: g

Spent etchant copper (post-electrowinning) Solid wasteg

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: No range defined.
Unit: g

Solder mask solids (developed) Solid wasteg · ±25%

Source citations: electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of waste plastic, mixture, municipal incineration
Uncertainty: ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Nickel hydroxide sludge Solid wasteg · -33.8% / +48.6%

Derivation basis: calculated from Ni precipitation stoichiometry

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

ResearchGate, Water use in PCB manufacturing

Envirowise, Water use in PCB manufacturing

Patent CN102286761B, Acid Copper Additives

Patent US5151170A, Brightener Consumption

SysPCB, Inner Layer Process

NMFRC, Electroless Nickel Stoichiometry

Dow AUROLECTROLESS SMT 525G TDS; Florida CirTech IG300 TDS

IPC-4552B; industry immersion gold specifications

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: market for metalliferous hydroxide sludge
Uncertainty: -33.8% / +48.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Phosphorus in wastewater-treatment sludge Solid wasteg · -26.9% / +38.5%

Derivation basis: Derived: elemental phosphorus balance, the phosphorus reaching treatment less the post-treatment residual

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

ResearchGate, Water use in PCB manufacturing

Envirowise, Water use in PCB manufacturing

Patent CN102286761B, Acid Copper Additives

Patent US5151170A, Brightener Consumption

SysPCB, Inner Layer Process

NMFRC, Electroless Nickel Stoichiometry

Dow AUROLECTROLESS SMT 525G TDS; Florida CirTech IG300 TDS

IPC-4552B; industry immersion gold specifications

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -26.9% / +38.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Dicing slurry (Si/EMC/Cu particles) Solid wasteg

Derivation basis: No retrievable public document identified

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: No range defined.
Unit: g

Flux residue on stencil Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: No range defined.
Unit: g

Scrapped material (line yield) Solid wastekg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.

ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).

syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.

insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.

ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.

greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Notes: Calculated reject material after accounting for a manufacturing yield of 90%.
Uncertainty: No range defined.
Unit: kg

Emissions to air

5 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Volatile organic compounds (VOC) Emission to airg

Source citations: electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: No range defined.
Unit: g

HCl Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
CAS number: 7647-01-0
ecoinvent 3.12 elementary flow: Hydrochloric acid
Uncertainty: No range defined.
Unit: g

HCHO Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
CAS number: 50-00-0
ecoinvent 3.12 elementary flow: Formaldehyde
Uncertainty: No range defined.
Unit: g

Volatile organic compounds (VOCs) Emission to airg

Source citations: epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP), Volume II Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, February 1999. Government report.
taiyo-america.com (date not recorded). TAIYO PSR-4000 LEW1 (US) Liquid Photoimageable Solder Mask, Technical Data Sheet, revised July 2013. Vendor datasheet.
electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Flux volatiles Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: No range defined.
Unit: g

Emissions to water

11 elementary flows released to water by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Mn2+ Emission to waterg

Source citations: epa.gov (date not recorded). U.S. EPA Office of Water - Preliminary Study of the Electrical and Electronic Components Point Source Category (40 CFR Part 469), EPA-821-R-22-005, DCN 11197, November 2022. Government report.
Compartment: Water (surface water)
CAS number: 16397-91-4
ecoinvent 3.12 elementary flow: Manganese II
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Potassium Emission to waterg

Source citations: p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
Compartment: Water (surface water)
Formula: K+
CAS number: 24203-36-9
ecoinvent 3.12 elementary flow: Potassium I
Notes: K2SO4 → 2K⁺ + SO4²⁻ (ionic dissociation)
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Sulfate Emission to waterg

Source citations: p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
Compartment: Water (surface water)
Formula: SO42-
CAS number: 14808-79-8
ecoinvent 3.12 elementary flow: Sulfate
Notes: Aggregated from 3 contributing steps: K2SO4 → 2K⁺ + SO4²⁻ (ionic dissociation) + H2SO4 dissociates in water → 2H⁺ + SO4²⁻
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

HCHO Emission to waterg

Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology Co. Ltd - annual 1.10 million m2 automotive-electronics supporting-industry project, phase 1 stage 1, construction-project completion environmental-protection acceptance report (jian she xiang mu jun gong huan jing bao hu yan shou bao gao). PDF document.
sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
mee.gov.cn (date not recorded). GB 8978-1996 Integrated wastewater discharge standard (wu shui zong he pai fang biao zhun), Table 4 maximum allowable discharge concentrations of Class II pollutants for units built on or after 1998-01-01. PDF document.
inchem.org (date not recorded). IPCS/WHO, Concise International Chemical Assessment Document 40: Formaldehyde, World Health Organization, Geneva, 2002.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197, November 2022. PDF document.
Compartment: Water (surface water)
CAS number: 50-00-0
ecoinvent 3.12 elementary flow: Formaldehyde
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

EDTA Emission to waterg

Source citations: cjournal.hep.com.cn (date not recorded). MEI Yining, WEI Zhe, WEI Li'an, Study on resource recycling of copper from spent PCB electroless copper plating bath, Electroplating & Finishing, 2024, 43(2): 149-154 (School of Environmental and Chemical Engineering, Nanchang Hangkong University). Journal article.
p2infohouse.org (date not recorded). Pagel, P., "Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies", Minnesota Technical Assistance Program (MnTAP) under the U.S. EPA WRITE Program, pp. 483-492. PDF document.
patents.google.com (date not recorded). C. Uyemura & Co. Ltd, EP0142356B1, "Analytical method for determining formaldehyde in electroless copper plating bath", priority 1983-11-11. Patent.
gesetze-im-internet.de (date not recorded). Abwasserverordnung (AbwV) Anhang 40 "Metallbearbeitung, Metallverarbeitung" (German Waste Water Ordinance, Annex 40).
Compartment: Water (unspecified)
Formula: C₁₀H₁₆N₂O₈
CAS number: 60-00-4
ecoinvent 3.12 elementary flow: EDTA, Ethylenediaminetetraacetic Acid
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Cu Emission to waterg

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Compartment: Water (surface water)
CAS number: 7440-50-8
ecoinvent 3.12 elementary flow: Copper ion
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Mixed organics (COD) Emission to waterg

Derivation basis: Calculated as a release to water, from a contaminant mass balance on the process chemistry.

No source is attached to this row.
Source citations: Not stated
Compartment: Water (surface water)
ecoinvent 3.12 elementary flow: COD, Chemical Oxygen Demand
Uncertainty: No range defined.
Unit: g

H₂O₂ Emission to waterg

Derivation basis: Calculated as a release to water, from a contaminant mass balance on the process chemistry.

No source is attached to this row.
Source citations: Not stated
Compartment: Water (surface water)
CAS number: 7722-84-1
ecoinvent 3.12 elementary flow: Hydrogen peroxide
Uncertainty: No range defined.
Unit: g

Ni Emission to waterg

Source citations: China GB 39731-2020, Emission standard of water pollutants for the electronics industry, Table 1 item 20 total nickel 0.5 mg/L (archived MEE PDF, read verbatim); corroborated by GB 21900-2008 electroplating total nickel 0.5 mg/L; band endpoints from EU STM BREF 2006 Table 3.18 (nine Swedish installations) and Table 3.20 (nickel levels associated with potential BAT)
Compartment: Water (surface water)
Formula: Ni2+
CAS number: 14701-22-5
ecoinvent 3.12 elementary flow: Nickel II
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

CN⁻ Emission to waterg

Source citations: bureau-industrial-transformation.jrc.ec.europa.eu (2019). Reference Document on Best Available Techniques for the Surface Treatment of Metals and Plastics. PDF document.
law.cornell.edu (date not recorded). 40 CFR § 433.15 - Pretreatment standards for existing sources (PSES). | Electronic Code of Federal Regulations (e-CFR) | US Law | LII / Legal Information Institute.
Compartment: Water (surface water)
Formula: CN-
CAS number: 57-12-5
ecoinvent 3.12 elementary flow: Cyanide
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Phosphorus (from hypophosphite) Emission to waterg

Derivation basis: Calculated as a release to water, from a contaminant mass balance on the process chemistry.

No source is attached to this row.
Source citations: Not stated
Compartment: Water (surface water)
Formula: P
CAS number: 7723-14-0
ecoinvent 3.12 elementary flow: Phosphorus
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Flows not quantified

7 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.

Cut off - below the significance threshold (1)

Chloride ions Process chemicalg · -70% / +170%

Source citations: nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (2000). Printed Wiring Board Surface Finishes: Volume 2 Appendices, Draft Cleaner Technologies Substitutes Assessment. Web page.
insulectro.com (2021). Microfill EVF Copper Via Fill. PDF document.
enviolet.com (2004). Copper Bath Recycling in PCB by Atotech 2004. PDF document.
insulectro.com (2021). Electroposit 1000 acid Copper. PDF document.
Background data: cut off
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Chloride quantity is calculated from the vendor working-bath concentration and the existing process-specific bath allocation. The flow is left unlinked to a background production dataset because no representative one is available.
Uncertainty: -70% / +170% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Not modelled (6)

Complexing agent (EDTA or Rochelle salt) Process chemicalg · -19.9% / +50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating-bath additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -19.9% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Plating additives Process chemicalg · ±33.3%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Suppressor (PEG) Process chemicalg · -40% / +60.1%

Source citations: iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
research.sabanciuniv.edu (date not recorded). PROCESS INTEGRATION AND TECHNOLOGY DEVELOPMENT FOR LOW-COST, ACCESSIBLE HIGH DENSITY INTERCONNECT (HDI) PRINTED CIRCUIT BOARDS (PCBs). PDF document.
patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -40% / +60.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Accelerator (SPS) Process chemicalg · -33.3% / +66.7%

Source citations: iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -33.3% / +66.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Leveler (Janus Green B class) Process chemicalg · -50.2% / +49.8%

Source citations: iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -50.2% / +49.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Complexing agent (citrate, malate, or lactate) Process chemicalg · -39.9% / +60.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating-bath additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -39.9% / +60.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Limitations and unquantified flows (4)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

Waste

Anode sludge (phosphorus) leaves the boundary as waste but is not funded by any material input on this bill; see that row for the quantity. The phosphorus in this sludge comes off the plating anode as it dissolves, and this bill carries no purchase for that anode, so the mass leaves the boundary without an input to fund it and is declared open here rather than being attributed to a purchase that does not represent it.
Anode bag sludge (phosphorus + organic adsorbates) leaves the boundary as waste but is not funded by any material input on this bill; see that row for the quantity. The phosphorus in this sludge comes off the plating anode as it dissolves, and this bill carries no purchase for that anode, so the mass leaves the boundary without an input to fund it and is declared open here rather than being attributed to a purchase that does not represent it.

General

These materials are used at a step of the modelled flow and are also carried by this dataset's own material list. Each is counted once, on that list, and the step does not book it again: Core through-hole copper plating uses Copper anode (phosphorized soluble); SAP microvia fill plating uses Copper anode (phosphorized soluble); Substrate solder-ball flux, reflow and cleaning uses SAC305 solder balls.
Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase: Product operation is outside the cradle-to-gate scope.
End-of-life treatment: Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail: The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials: Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers: Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication: A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead: Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods: Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits: Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim: Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing: Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages: Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
Volatile organics (photoresist solvents, PGMEA) - air quality
Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol