Overview
- Technology
- HBM4 12-high, 48 GB
- Geography
- Global average – Samsung (Korea), SK Hynix (Korea), Micron (US/Japan/Taiwan); base die from TSMC (Taiwan)
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- JEDEC JESD270-4A public summary, vendor press releases, ISSCC 2026 Samsung HBM4 paper, Wing Venture Capital HBM4 deep dive, Korea Herald 16-layer disclosure, TrendForce 16-layer roadmap, NomadSemi yield analysis, and the REEL DRAM core-die, logic base-die and TSV-stacking datasets this dataset links as inputs.
- Coverage status
- Composed from linked REEL datasets
- Pedigree-scored source files
- 49 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
7 flows. Quantities are not published; they ship with the dataset on Circa.
DRAM Core Dies REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 1-gamma DRAM wafer, 300mm, moderate scenario
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Wafer demand calculated from die count, rectangular wafer packing, die yield and assembly yield. Wafer manufacturing yield is already included upstream.
- Uncertainty
- No range defined.
- Unit
- wafer
Base Logic Die REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 5nm FinFET wafer, 300mm, Taiwan, moderate scenario
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Wafer demand calculated from die count, rectangular wafer packing, die yield and assembly yield. Wafer manufacturing yield is already included upstream. The sort yield that sizes this row is not published for this die on its own, so it follows the sort yield of the memory core dies stacked above it; a scenario that varies the core-die yield therefore moves this row with it.
- Uncertainty
- No range defined.
- Unit
- wafer
TSV Stacking REEL datasetpackage
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- HBM4 TSV Stacking and Assembly package, 12-Hi
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for packaging yield.
- Uncertainty
- No range defined.
- Unit
- package
Cu pillar + SnAg solder cap Materialkg · -55.6% / +77.8%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- composite
- Background dataset
- Modelled as a composite of its constituent materials.
- Uncertainty
- -55.6% / +77.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Molding Compound Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- epoxy resin insulator, SiO2
- Uncertainty
- No range defined.
- Unit
- kg
Wafer transport, KR fab to packaging site - Road Freight transporttkm · -100% / +172%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Additional Investment in Onyang Campus... Expanding Back-End Processing Too (Seoul Economic Daily)
- The Elec report, 2026-07: Samsung back-end investment focused on high-bandwidth memory
- DigiTimes report, 2024-11-13: Samsung Cheonan and Onyang back-end hubs
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, lorry, unspecified
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from memory fab to domestic back end. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses the route-class distance envelope, and its upper endpoint also adds the separate reusable-carrier return service.
- Uncertainty
- -100% / +172% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Wafer transport, TW fab to packaging site - Air (short haul) Freight transporttkm · -47.4% / +80%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, aircraft, dedicated freight, short haul
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from foundry logic die to memory stacking site, cross-border. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Air freight is allocated on chargeable weight rather than actual shipped mass. The authored band holds the fixed route distance: its lower endpoint uses actual shipped mass, its central uses chargeable-weight allocation, and its upper endpoint adds the separate reusable-carrier return service, not aircraft backhaul.
- Uncertainty
- -47.4% / +80% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Outputs and waste
Failed packages (assembly reject) Solid wasteg · -10.1% / +21.1%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of waste electric and electronic equipment, shredding
- Uncertainty
- -10.1% / +21.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
1 flow is recorded for this dataset but carries no quantity — cut off below the significance threshold, or with no background dataset available. It remains inside the declared system boundary; each is listed with its reason.
Not quantified - no background dataset available (1)
NCF Adhesive Materialkg · ±4.3%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- no background dataset
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- A specialty thermosetting epoxy bonding film used in wafer-level stacking. No production dataset for it exists in the background database used for linkage; plain epoxy resin is the closest constituent but leaves out the cure system that defines this film, so it is not substituted. The quantity is recorded here and its upstream production is left unlinked.
- Uncertainty
- ±4.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Limitations and unquantified flows (5)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
From the dataset description
- All values are estimate-grade pending public HBM4 mass-production yields and disclosed bills of materials.
General
- The mould-compound mass booked on this stack is an authored estimate that the stack's own packaging inventory contradicts. Three separate figures for the same encapsulant are in play across the files that describe this stack: the mass booked here as purchased demand, the mass the stacking inventory derives from the package envelope and the die stack inside it when it prices a scrapped stack, and the encapsulant basis the mould-waste allocation uses to size the flash it trims. They do not agree, and the flash waste this dataset ships is sized on the third of them. Reconciling them needs a package height and a base-die thickness that no file on this path declares consistently across stack heights - above the reference stack height the declared die and gap thicknesses no longer fit inside the declared envelope - and no public dimension for the taller rungs was found. The mass is therefore left as authored and disclosed here rather than re-derived on an assumed envelope.
- The post-mould grinding slurry leaves this stack as waste with no matching input. It is a consumable of the moulding cycle, and the inventory that books its disposal does not book its purchase, so the mass it carries out is not balanced by a mass carried in. The single-use release film beside it, which had the same gap, is now booked as an input at the mass it leaves as waste. The slurry is not, because that same inventory records an unresolved question about whether the raw slurry and the treatment residues already booked as outputs in this dataset describe the same material twice; booking the raw slurry as an input before that is settled would compound it rather than close it.
- The microbump mass on this stack is proportional to the square of the bump pitch this dataset declares, and that pitch is not traced to a vendor statement - it is an authored design point. The derivation is sound on the declaration, and the declaration is the weaker half: a coarser pitch at the same bump count would raise the metal mass in proportion. The pillar diameter behind the derivation is not declared on this dataset either; it is taken as the same fraction of the pitch that the high-bandwidth flash stack in this family declares, and the band on the row spans a pillar from half the pitch to one touching its neighbour.
- The microbump count on this dataset is derived, not declared by a vendor: this generation's files state no count, only that it follows the doubled interface width, so the count is carried over from the previous generation on this path at the same number of bumps per data bit. The bump metal mass is proportional to it.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Production covered
HBM4 12-high 48 GB stack – mainstream SKU. Closes a JEDEC-generation coverage gap.
All three HBM4 stack heights are built on one declared core die (11 x 11 mm, 121 mm², 1γ) carrying 32 Gbit, so per-die capacity is identical across the axis and only the die count changes: 32 Gbit on 121 mm² is 0.264 Gb/mm², a 10% gain on the HBM3E core die (24 Gbit on 99.75 mm²) and below the 0.412 Gb/mm² 1c array density an HBM core die cannot reach because of its TSV farm and per-channel logic. System boundary: this dataset ends at the assembled and tested stack. Silicon interposer, 2.5D redistribution (CoWoS-class), organic package substrate, and package-level assembly are deliberately excluded - those are owned by the consuming 2.5D-packaging dataset under the count-once convention, so composing this stack with a package dataset does not double-count. Accelerator/module-level assembly is likewise outside this dataset's boundary and is not modeled in REEL v1.0. This variant represents mature HBM4 production at the ~80% industry mature-yield threshold (TrendForce 2026-04-15).
Modelling choices
Modelled as a component assembly with a TSMC N5 base die.