Overview
- Technology
- Standard manufacturing process
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Component vendor specifications, academic papers, industry literature
- Coverage status
- Partial
- Pedigree-scored source files
- 4 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
13 flows. Quantities are not published; they ship with the dataset on Circa.
200mm Surface MEMS Inertial REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- MEMS Inertial 200mm wafer, 200mm, Germany
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Yield-adjusted wafer fraction; carries the suppressed wafer-fab elementary flows
- Uncertainty
- No range defined.
- Unit
- wafer
SF6 production Process gasg · -41.5% / +76%
- Derivation basis
-
- No retrievable public document identified
The sources for this row are listed below.
- Source citations
-
- J. Vac. Sci. Technol. A 41. "Process optimization for shallow trench isolation."
- US Patent 8,133,817 B2. "Method for etching STI structures."
- Huang et al. (2023). Process optimization for shallow trench isolation etch using computational models. Advanced Etch Technology and Process Integration for Nanopatterning XII. DOI: 10.1117/12.2664977.
- EPA/Semiconductor Industry. "PFC Emissions from Semiconductor Manufacturing."
- J. Vac. Sci. Technol. B. "Dry etching fin process for SOI FinFET manufacturing."
- Dry etching of poly-Si/TaN/HfSiON gate stack for advanced complementary metal-oxide-semiconductor devices
- Upstream REEL dataset
- Sulfur hexafluoride (SF6)
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
- Uncertainty
- -41.5% / +76% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
CF4 production Process gasg · -49.1% / +69.5%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Carbon tetrafluoride (CF4)
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Uncertainty
- -49.1% / +69.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Wafer transport, DE fab to packaging site - Air (long haul) Freight transporttkm · -47.4% / +80%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, aircraft, dedicated freight, long haul
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from European specialty or power fab to its Asian packaging site, intercontinental. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable wafer shipping box for this wafer diameter and its secondary carton. The factor for this diameter is derived from two published container masses, one of which is taken from an online marketplace listing rather than a manufacturer datasheet; that lighter figure pulls the factor down, so the value used is the lower of the two readings available rather than the cautious one, and the box it describes is not the front-opening shipping box used at the larger wafer diameter; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Air freight is allocated on chargeable weight rather than actual shipped mass. The authored band holds the fixed route distance: its lower endpoint uses actual shipped mass, its central uses chargeable-weight allocation, and its upper endpoint adds the separate reusable-carrier return service, not aircraft backhaul. The route distance is a declared proxy: the route evidence carries two independent European fab to back-end air lanes of essentially the same length, but both end at a Southeast Asian back end rather than at the site this dataset declares, so that European long-haul class stands in for a lane no public source states end to end.
- Uncertainty
- -47.4% / +80% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Electricity, Taiwan (TW) ElectricitykWh · -17% / +22.6%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations, plus facility support such as cleanroom HVAC, ultrapure water, cooling, gas abatement, and bulk gases.
- This quantity is the sum of two terms: the package-assembly share of the model aggregated demand, and the wafer dicing the model records as component-owned, which no other dataset referenced by this dataset carries.
The sources below are this row's own, and those of the manufacturing operations behind it.
- Source citations
-
- Disco Corporation DFD6361 dicing saw specifications (blade-dicing process power and wafer throughput)
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Guste, Marinas & Ong, Machines 12 (2024) 467, Table 3; Besi Datacon 2200 evo product page
- despatch.com (date not recorded). Despatch - LCC/LCD clean process ovens datasheet (PDF). Vendor specification.
- sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Package-on-package (PoP) with Through-mold Vias (2008). Trade press article.
- directindustry.com (date not recorded). DirectIndustry - Kulicke & Soffa IConn (ProCu) PLUS wire bonder listing (1.5 kVA nominal / 2.6 kVA max).
- c2mi.ca (date not recorded). C2MI - IConn ProCu Plus LA equipment listing.
- electronicspecifier.com (date not recorded). electronicspecifier - ASMPT unveils latest wire bonder (Eagle AERO, up to 24 2-mm connections/s), 26 Sep 2022. Trade press article.
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, high voltage
- Notes
- package-level only; wafer-fab electricity carried by the wafer reference. The uncertainty range is the pre-split range scaled by the same package share, not a range derived for the package step on its own. The package share is stated net of wafer fabrication, which the wafer reference carries; the component-owned dicing term is additional to it and is not part of that share, so the qualifier above applies to the package term alone.
- Uncertainty
- -17% / +22.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
N2 Process gasg
- Derivation basis
-
- Engineering estimate for batch LPCVD
The sources for this row are listed below.
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- nitrogen, liquid
- Notes
- package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
O2 Process gasg · -21.9% / +36.5%
- Derivation basis
-
- No retrievable public document identified
The sources for this row are listed below.
- Source citations
-
- J. Vac. Sci. Technol. A 41. "Process optimization for shallow trench isolation."
- US Patent 8,133,817 B2. "Method for etching STI structures."
- Huang et al. (2023). Process optimization for shallow trench isolation etch using computational models. Advanced Etch Technology and Process Integration for Nanopatterning XII. DOI: 10.1117/12.2664977.
- EPA/Semiconductor Industry. "PFC Emissions from Semiconductor Manufacturing."
- J. Vac. Sci. Technol. B. "Dry etching fin process for SOI FinFET manufacturing."
- Dry etching of poly-Si/TaN/HfSiON gate stack for advanced complementary metal-oxide-semiconductor devices
- Background data
- ecoinvent 3.12
- Background dataset
- oxygen, liquid
- Notes
- package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
- Uncertainty
- -21.9% / +36.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Compressed air Process gasg · -30.5% / +31.9%
- Source citations
-
- CAE Online: Teradyne Catalyst Specifications
- EE Journal: "Advantest Unveils New Ultra-High-Current Power Supply" (2024)
- 4Semi: TEL Precio Wafer Prober Specifications
- FormFactor Summit 11000/12000 Facility Planning Guide
- 3D InCites: "ERS Electronic Introduces High Power Dissipation Thermal Chuck" (2023)
- Abachy: "How Much Energy and Water Are Required for Wafer Fabrication" (2025)
- Background data
- ecoinvent 3.12
- Background dataset
- compressed air, 700 kPa gauge
- Notes
- package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
- Uncertainty
- -30.5% / +31.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Ar Process gasg · -22.1% / +36.8%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- argon, liquid
- Notes
- package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
- Uncertainty
- -22.1% / +36.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
H2 Process gasg · -46.8% / +93.4%
- Derivation basis
-
- No retrievable public document identified
The sources for this row are listed below.
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- hydrogen, gaseous, low pressure
- Uncertainty
- -46.8% / +93.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Silver Process chemicalg
- Source citations
-
- aitechnology.com (date not recorded). AI Technology, Inc., "ME8650-RC Inline Die-Attach" product data sheet, Ver. 2.0, 2 April 2018 (single-component silver-filled die-attach paste for needle dispensing and screen printing on leadframes). PDF document.
- meridianadhesives.com (date not recorded). Epoxy Technology (Meridian Adhesives Group), Tech Tip 6, "The Importance of Minimum Bond Line in Epoxy Curing and Adhesion" (minimum and ideal bond-line thickness by adhesive type).
- Background data
- ecoinvent 3.12
- Background dataset
- silver
- Notes
- From Die attach epoxy (Ag-filled conductive) (84.5% silver)
- Uncertainty
- No range defined.
- Unit
- g
Epoxy resin, liquid Process chemicalg
- Source citations
-
- aitechnology.com (date not recorded). AI Technology, Inc., "ME8650-RC Inline Die-Attach" product data sheet, Ver. 2.0, 2 April 2018 (single-component silver-filled die-attach paste for needle dispensing and screen printing on leadframes). PDF document.
- meridianadhesives.com (date not recorded). Epoxy Technology (Meridian Adhesives Group), Tech Tip 6, "The Importance of Minimum Bond Line in Epoxy Curing and Adhesion" (minimum and ideal bond-line thickness by adhesive type).
- Background data
- ecoinvent 3.12
- Background dataset
- epoxy resin, liquid
- Notes
- From Die attach epoxy (Ag-filled conductive) (15.5% epoxy)
- Uncertainty
- No range defined.
- Unit
- g
Water supply (municipal) WaterL · ±23.1%
- Derivation basis
-
- Cutting water for the single blade wafer-dicing step above, on the same per-die allocation. Not an aggregate of process-step water demand.
The sources for this row are listed below.
- Source citations
-
- Disco Corporation DFD6361 dicing saw specifications (blade-dicing cutting-water flow rate)
- Background data
- ecoinvent 3.12
- Background dataset
- tap water
- Notes
- Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
- Uncertainty
- ±23.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- L
Outputs and waste
Silicon Kerf Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Emissions to air
1 elementary flow released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.
VOCs (from epoxy cure) Emission to airg
- Source citations (dataset-level)
-
- etd.gsfc.nasa.gov (date not recorded). NASA Goddard Space Flight Center, Engineering and Technology Directorate, "Outgassing Data for Selecting Spacecraft Materials" online database, complete CSV export (13,582 records; ASTM E595 total mass loss, collected volatile condensable material and water vapour regained by material, manufacturer and application).
- etd.gsfc.nasa.gov (date not recorded). NASA Goddard Space Flight Center, Engineering and Technology Directorate, "Outgassing Database - User Guide" (ASTM E595 apparatus and conditions, TML / CVCM / WVR definitions, and the low-outgassing pass criteria).
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- besi.com (date not recorded). Besi / Fico AMS-i transfer molding system - product page. Vendor specification.
- besi.com (date not recorded). Besi / Fico AMS-LM transfer molding system - product page. Vendor specification.
- besi.com (date not recorded). Besi / Fico Molding Line (wafer/panel compression-transfer) - product page. Vendor specification.
- towajapan.co.jp (date not recorded). TOWA Corporation - Molding Equipment (YPM series transfer presses). Vendor specification.
- sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Materials and Methods for IC Package Assemblies (2005). Trade press article.
- sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Step 10: Encapsulation - Materials, Processes and Equipment (2004). Trade press article.
- Investigation on Material Removal Rate in Rotation Grinding
- SVM. "Wafer Thinning Services & Removal Rates."
- Hapoin. "Okamoto GNX200B Specifications."
- DISCO Corp. "DGP8761 Fully Automatic Grinder/Polisher Datasheet."
- IMAPS/Scispace. "Optimized Die Preparation for High Yield Hybrid Bonding."
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- NMVOC, non-methane volatile organic compounds
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
3 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.
Cut off - below the significance threshold (3)
Silicon MEMS Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- cut off
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- This die or wafer input is carried as a reference to its own upstream dataset elsewhere in this inventory. This mass-tracking row is excluded from upstream linkage so the same input is not counted twice.
- Uncertainty
- No range defined.
- Unit
- g
Silicon ASIC Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- cut off
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- This die enters this dataset as an externally fabricated input: no upstream wafer dataset is linked for it, so its fabrication is not carried anywhere in this inventory. The die mass is recorded for transparency.
- Uncertainty
- No range defined.
- Unit
- g
Package Mass Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- cut off
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- Mass-tracking record from the authored model – a package-level mass total, not an individual material input. It is recorded for transparency and excluded from upstream linkage; the package's constituent materials are not itemized in this dataset.
- Uncertainty
- No range defined.
- Unit
- g
Limitations and unquantified flows (2)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- The conductive die-attach adhesive dose on this dataset is scaled from the die-attach process file's reference die by declared die area, which is that file's own published rule. This product's die is far smaller than any die that rule was published for, so the dose is an extrapolation below the evidence: the rule is slightly under-linear at the smallest published point, and below some die size the dose stops being set by area at all and becomes the dispenser's minimum reliable dot volume, which the process file does not publish. The shipped dose is therefore a lower bound on the adhesive, and on the silver it carries. The companion CMOS logic die is not modelled. Its silicon is recorded as a cut-off row that carries no upstream burden, and the only wafer this dataset references is the MEMS wafer, so the logic die's own fabrication is absent from this inventory.
- Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Capacitive MEMS accelerometer with integrated ASIC for signal processing. Surface micromachined polysilicon proof mass with differential capacitive sensing. Used in automotive airbag systems, smartphones, wearables, and industrial vibration monitoring.