Overview
- Technology
- 1β LPDDR5X DRAM in WLCSP
- Geography
- Global average data from equipment vendor specifications, academic papers, and assembly industry data
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Equipment vendor specifications, academic papers, HBM/DRAM industry literature
- Coverage status
- Composed from linked REEL datasets
- Pedigree-scored source files
- 42 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
5 flows. Quantities are not published; they ship with the dataset on Circa.
1β DRAM (12-14nm half-pitch) REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 1-beta DRAM wafer, 300mm, moderate scenario
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Yield-adjusted wafer fraction
- Uncertainty
- No range defined.
- Unit
- wafer
WLCSP REEL datasetpackage
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Wafer-Level Chip-Scale Package 5x5mm package
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for packaging yield.
- Uncertainty
- No range defined.
- Unit
- package
Wafer transport, KR fab to packaging site - Road Freight transporttkm · -100% / +172%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Additional Investment in Onyang Campus... Expanding Back-End Processing Too (Seoul Economic Daily)
- The Elec report, 2026-07: Samsung back-end investment focused on high-bandwidth memory
- DigiTimes report, 2024-11-13: Samsung Cheonan and Onyang back-end hubs
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, lorry, unspecified
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from memory fab to domestic back end. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses the route-class distance envelope, and its upper endpoint also adds the separate reusable-carrier return service.
- Uncertainty
- -100% / +172% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Electricity, South Korea (KR) ElectricitykWh · ±25%
- Derivation basis
-
- Single blade wafer-dicing step, allocated to this die from the wafer-level inventory by die area and wafer diameter, grossed up for the packaging yield loss and multiplied by die count. Owned at the IC level because the packaging leaf removed its die-preparation step and the wafer dataset books no singulation. Not an aggregate and carries no facility support.
The sources for this row are listed below.
- Source citations
-
- Disco Corporation DFD6361 dicing saw specifications (blade-dicing process power and wafer throughput)
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, high voltage
- Notes
- Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
- Uncertainty
- ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Water supply (municipal) WaterL · ±23.1%
- Derivation basis
-
- Cutting water for the single blade wafer-dicing step above, on the same per-die allocation. Not an aggregate of process-step water demand.
The sources for this row are listed below.
- Source citations
-
- Disco Corporation DFD6361 dicing saw specifications (blade-dicing cutting-water flow rate)
- Background data
- ecoinvent 3.12
- Background dataset
- tap water
- Notes
- Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
- Uncertainty
- ±23.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- L
Outputs and waste
Failed packages (assembly reject) Solid wasteg · -37.7% / +78.9%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of waste electric and electronic equipment, shredding
- Uncertainty
- -37.7% / +78.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Silicon Kerf Solid wasteg · ±25%
- Source citations
-
- Semiconductor Digest, reported blade-dicing kerf width
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Notes
- Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
- Uncertainty
- ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
No flows are recorded for this dataset without a quantity.
Limitations and unquantified flows (1)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
From the dataset description
- PACKAGE BASIS: in a WLCSP the package footprint is the die footprint, so the redistribution layers, under-bump metallisation and solder-ball chemistry all scale with die area. The largest WLCSP size this database publishes is 5 x 5 mm (25 mm²), so the packaging burden here is linked on that basis and remains under-inclusive by about 1.5x on area against the 36.68 mm² die this component actually ships.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Production covered
Memory component: a single 36.68 mm² DRAM die in a wafer-level chip-scale package.
Modelling choices
CAPACITY LABEL. This dataset is labelled 16 Gb per die, on two direct identifications in the sources it cites. A reverse-engineering analysis of a named 1b-generation LPDDR5X part identifies it as a 16 Gb die and counts eight such dies inside a 16 GB package; and a separate analysis of a named 1b-generation DDR5 part of the same process measures its die at 36.00 mm² and identifies it, likewise, as 16 Gb. Every LPDDR5X and DDR5 die publicly documented at this generation is a 16 Gb part, and no 8 Gb die of this generation appears in any source this dataset cites. The die area is consistent with that label but does not independently establish it. 36.68 mm² was obtained by inverting the measured bit density of the LPDDR5X part above (16,384 Mb ÷ 446.67 Mb/mm² = 36.680 mm², rounded to the shipped 36.68), so multiplying back returns 16,383.9 Mb – 16 Gb to within 0.001% – which confirms the arithmetic rather than the capacity. The independent evidence is the identification of the parts themselves. The label was previously 8 Gb, set against a bit density measured on a graphics-DRAM (GDDR7) die of the same process. A graphics die carries a much wider input/output ring around a comparatively small memory array, so its whole-die bit density understates what a mobile or commodity DRAM die of the same process achieves; it is not a valid ceiling for this part. An 8 Gb reading of this die would require 223 Mb/mm², half the measured density. The label does not affect the inventory, which is calculated per die. It does set the denominator of any per-gigabyte figure a reader derives, and at 16 Gb that figure now agrees with the stacked LPDDR5X datasets in this database, which ship the same die.