Overview

General comment

Production covered

RJ45 modular jack connector with integrated Ethernet magnetics (isolation transformers and common mode chokes). Also known as MagJack, LAN transformer jack, or integrated connector module (ICM). Provides galvanic isolation between PHY and network cable per IEEE 802.3 requirements. Available in single, dual (2x1), and quad (2x2) port configurations with optional LED indicators.

Modelling choices

This dataset is modelled with no water reuse. No reclaim rate is published for this kind of plant, so the water shown is the full fresh intake and no recycling credit has been deducted from it.

Technology: Modular Connector with Integrated Magnetics, Ethernet I/O
Geography: Global average data from equipment vendor specifications and industry literature

System boundary

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 2.1 Good

Reliability

3.1

Completeness

1.8

Temporal

2.1

Geographic

2.3

Technological

1.6

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure: Component vendor specifications, academic papers, industry literature
Coverage status: Partial
Pedigree-scored source files: 10 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

30 flows. Quantities are not published; they ship with the dataset on Circa.

Electricity, China (CN) ElectricitykWh · -40.5% / +104.1%

Derivation basis: Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: electricity, medium voltage
Uncertainty: -40.5% / +104.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kWh

Fresh water WaterL · ±25%

Derivation basis: Calculated from process-water and ultrapure-water demand across all manufacturing operations. This model includes no facility support, so the demand is the manufacturing operations alone. The fresh intake shown is that whole demand: the water-recycling scenario this dataset assumes reuses none of it, so nothing has been deducted, and wastewater follows the same balance.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: tap water
Notes: Process and cleaning water
Uncertainty: ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: L

Sodium carbonate developer Process chemicalg · -59.9% / +350.6%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: soda ash, dense
Uncertainty: -59.9% / +350.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Dry Film Resist Process chemicalg · ±25%

Source citations: dupont.com (date not recorded). DuPont, "Riston PlateMaster PM200" dry film photoresist product page. Vendor web page.
allenwoodsgroup.com (date not recorded). DuPont Riston PlateMaster PM200 Data Sheet, DS02-94 Rev 6.0 (07/07) (allenwoodsgroup-hosted). Technical data sheet.
allenwoodsgroup.com (date not recorded). DuPont, "Riston 200 Series" dry film photoresist data sheet, DS95-17 Rev 6.0 (07/07). Technical data sheet.
Background data: proxy-mapped
Background dataset: methyl methacrylate
Uncertainty: ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Hydrochloric acid Process chemicalg · -34.6% / +74.3%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: hydrochloric acid, without water, in 30% solution state
Uncertainty: -34.6% / +74.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Hydrogen peroxide Process chemicalg · -34.6% / +74.3%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: hydrogen peroxide, without water, in 50% solution state
Uncertainty: -34.6% / +74.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Potassium permanganate Process chemicalg · -81.3% / +34.1%

Source citations: patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment - Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results (grant #X 823856; update to EPA 744-R-95-006). Government report.
zsepb.zs.gov.cn (date not recorded). Zhongshan Dajin Electronics Co. Ltd, annual 5 million m2 circuit-board expansion and retrofit project, environmental impact report form (zhong shan shi da jin dian zi you xian gong si nian chan 500 wan ping fang mi xian lu ban gai kuo jian xiang mu huan jing ying xiang bao gao biao), December 2024, project code 2404-442000-04-01-964388. PDF document.
Background data: ecoinvent 3.12
Background dataset: potassium permanganate
Uncertainty: -81.3% / +34.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium hydroxide Process chemicalg · -31.7% / +41.5%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: ecoinvent 3.12
Background dataset: sodium hydroxide, without water, in 50% solution state
Uncertainty: -31.7% / +41.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Neutralizer (sulfuric acid or HCl) Process chemicalg · -20% / +50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: sulfuric acid
Uncertainty: -20% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper sulfate pentahydrate Process chemicalg · -28.6% / +28.7%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: copper sulfate
Uncertainty: -28.6% / +28.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Formaldehyde Process chemicalg · -20% / +40%

Source citations: Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.
pcdandf.com (date not recorded). Practices for Sustainability in PCB Metallization. Web page.
nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (1997). Design for the Environment Printed Wiring Board Project: Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1 (Draft). Web page.
nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (1998). Printed Wiring Board Cleaner Technologies Substitutes Assessment: Making Holes Conductive, Volume 1. Web page.
2003. US3532519A - Electroless copper plating process. Metal Finishing. DOI: 10.1016/s0026-0576(99)80316-x.
Background data: ecoinvent 3.12
Background dataset: formaldehyde
Uncertainty: -20% / +40% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Palladium catalyst Process chemicalg · -40% / +60%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: palladium
Notes: Proxy mapping uses 60% of the material mass.
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sulfuric acid Process chemicalg · -50% / +100%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: sulfuric acid
Uncertainty: -50% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Solder mask solvent carrier Process chemicalg · -62.9% / +20%

Source citations: epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP), Volume II Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, February 1999. Government report.
taiyo-america.com (date not recorded). TAIYO PSR-4000 LEW1 (US) Liquid Photoimageable Solder Mask, Technical Data Sheet, revised July 2013. Vendor datasheet.
electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Background data: proxy-mapped
Background dataset: chemical, organic, unspecified
Uncertainty: -62.9% / +20% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Trisodium phosphate Process chemicalg · -40% / +60%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: trisodium phosphate
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Nickel sulfate Process chemicalg · -25% / +37.5%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: nickel sulfate
Uncertainty: -25% / +37.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium hypophosphite Process chemicalg · -22% / +33.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: sodium phosphate
Uncertainty: -22% / +33.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Gold potassium cyanide Process chemicalg · -33.3% / +33.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: gold
Notes: Proxy mapping uses 68.4% of the material mass.
Uncertainty: -33.3% / +33.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Potassium cyanide Process chemicalg · -40% / +60%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: sodium cyanide
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

PA66 GF30 Materialkg · -21.8% / +24.8%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: nylon 6-6
Uncertainty: -21.8% / +24.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Nickel-Plated Steel Materialkg · -21.9% / +21.5%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: steel, low-alloyed, hot rolled
Uncertainty: -21.9% / +21.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

C5191 Phosphor Bronze Materialkg · -27.9% / +26.2%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: bronze
Uncertainty: -27.9% / +26.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Iron ore concentrate Materialkg · -20.2% / +19.8%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: proxy-mapped
Background dataset: iron ore concentrate
Notes: From Mn-Zn Ferrite (70.0% iron oxide). Fe2O3 - primary component (~70%)
Uncertainty: -20.2% / +19.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

manganese(III) oxide Materialkg · -20.2% / +19.8%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: manganese(III) oxide
Notes: From Mn-Zn Ferrite (15.0% manganese oxide). MnO source (~15%)
Uncertainty: -20.2% / +19.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Zinc oxide Materialkg · -20.2% / +19.8%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: zinc oxide
Notes: From Mn-Zn Ferrite (15.0% zinc oxide). ZnO source (~15%)
Uncertainty: -20.2% / +19.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Copper, cathode Materialkg · -33.9% / +32.3%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: copper, cathode
Notes: From Enameled Copper (AWG 36-40) (97.0% copper)
Uncertainty: -33.9% / +32.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Nylon 6-6 Materialkg · -33.9% / +32.3%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: nylon 6-6
Notes: From Enameled Copper (AWG 36-40) (3.0% enamel). Polyimide/polyamide enamel coating (~3% by mass)
Uncertainty: -33.9% / +32.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Hard Gold Materialkg · ±50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: proxy-mapped
Background dataset: gold
Notes: Proxy mapping uses 99.7% of the material mass.
Uncertainty: ±50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Nickel Materialkg · -37.5% / +50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: ecoinvent 3.12
Background dataset: nickel, class 1
Uncertainty: -37.5% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Solder Mask Materialkg · -22.9% / +27.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

The sources for this row are listed below.
Source citations (dataset-level): Pulse Electronics JXD Series MagJack
TE Connectivity Integrated Magnetics RJ45
IEEE 802.3 Ethernet Standard
Background data: proxy-mapped
Background dataset: epoxy resin, liquid
Notes: Purchased input grossed to fund the authored process loss booked as Solder mask solids (developed) (mass-closure funding; the retained mass is the product-side figure).
Uncertainty: -22.9% / +27.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Outputs and waste

Wastewater Wastewaterm3 · ±25%

Derivation basis: Calculated from the water balance: fresh-water input minus evaporation.

No source is attached to this row.
Source citations: Not stated
Background data: carried, no background dataset
Background dataset: No treatment route recorded for this output.
Uncertainty: ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: m3

Steel Shell Stamping Solid wastekg · ±21.1%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: market for iron scrap, sorted, pressed
Uncertainty: ±21.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Phosphor Bronze Contacts Solid wastekg · ±33.3%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Rejected Assemblies Solid wasteg · -44.4% / +55.6%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -44.4% / +55.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Powder Loss Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

US Patent 2022/0009837 A1. MnZn Ferrite Material with Wide Temperature Range. (Referencing principal and auxiliary component weight percentages)

US Patent 6,547,984 B2. Mn-Zn Ferrite having low power loss. (Referencing molar proportions of Fe2O3, ZnO, MnO)

Effect of Additives on Mn-Zn Ferrites. (Referencing 52 mol% Fe2O3, 34 mol% MnO, 14 mol% ZnO baseline)

Badaik. (2015). Study of Mn-Zn Ferrite. NIT Rourkela e-Thesis. (Referencing pressing loads of 4.2 US Tons for 10.1 mm pellets)

NIT Rourkela. Influence of B2O3 and V2O5 on Mn-Zn Ferrites
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Cracked Cores Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

US Patent 2022/0009837 A1. MnZn Ferrite Material with Wide Temperature Range. (Referencing principal and auxiliary component weight percentages)

US Patent 6,547,984 B2. Mn-Zn Ferrite having low power loss. (Referencing molar proportions of Fe2O3, ZnO, MnO)

Effect of Additives on Mn-Zn Ferrites. (Referencing 52 mol% Fe2O3, 34 mol% MnO, 14 mol% ZnO baseline)

Badaik. (2015). Study of Mn-Zn Ferrite. NIT Rourkela e-Thesis. (Referencing pressing loads of 4.2 US Tons for 10.1 mm pellets)

NIT Rourkela. Influence of B2O3 and V2O5 on Mn-Zn Ferrites
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Wire Scrap Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

US Patent 2022/0009837 A1. MnZn Ferrite Material with Wide Temperature Range. (Referencing principal and auxiliary component weight percentages)

US Patent 6,547,984 B2. Mn-Zn Ferrite having low power loss. (Referencing molar proportions of Fe2O3, ZnO, MnO)

Effect of Additives on Mn-Zn Ferrites. (Referencing 52 mol% Fe2O3, 34 mol% MnO, 14 mol% ZnO baseline)

Badaik. (2015). Study of Mn-Zn Ferrite. NIT Rourkela e-Thesis. (Referencing pressing loads of 4.2 US Tons for 10.1 mm pellets)

NIT Rourkela. Influence of B2O3 and V2O5 on Mn-Zn Ferrites

KZL Industrial Automation. "KZL-224 Automatic Stator Coil Winding Machine." (Details 13.6 kW power consumption and 0.5 Mpa air pressure)

KZL Industrial Automation. "KZL-228 & KZL-310 Stator Winding Machines." (10 kW and 1.5 kVA consumption profiles)

Riley et al. (1996). "Journal of Applied Physics 79:6342." (Empirical 1.72 kJ discharge on 4-pole NdFeB, 3380 A peak)
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: No range defined.
Unit: g

Failed Units Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

US Patent 2022/0009837 A1. MnZn Ferrite Material with Wide Temperature Range. (Referencing principal and auxiliary component weight percentages)

US Patent 6,547,984 B2. Mn-Zn Ferrite having low power loss. (Referencing molar proportions of Fe2O3, ZnO, MnO)

Effect of Additives on Mn-Zn Ferrites. (Referencing 52 mol% Fe2O3, 34 mol% MnO, 14 mol% ZnO baseline)

Badaik. (2015). Study of Mn-Zn Ferrite. NIT Rourkela e-Thesis. (Referencing pressing loads of 4.2 US Tons for 10.1 mm pellets)

NIT Rourkela. Influence of B2O3 and V2O5 on Mn-Zn Ferrites

KZL Industrial Automation. "KZL-224 Automatic Stator Coil Winding Machine." (Details 13.6 kW power consumption and 0.5 Mpa air pressure)

KZL Industrial Automation. "KZL-228 & KZL-310 Stator Winding Machines." (10 kW and 1.5 kVA consumption profiles)

Riley et al. (1996). "Journal of Applied Physics 79:6342." (Empirical 1.72 kJ discharge on 4-pole NdFeB, 3380 A peak)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Plating Sludge Solid wasteg

Source citations: Characterization of electroplating wastewater sludges. Identifies 547 mg/L raw Ni in wastewater and 140-160 g/m2 filter cloth dewatering
Removal kinetics of heavy metals from electroplating effluents
Background data: ecoinvent 3.12 treatment route
Background dataset: market for metalliferous hydroxide sludge
Uncertainty: No range defined.
Unit: g

Drag Out Recovery Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

Nordelöf et al. Scalable LCI of automotive power electronics. (Electroplating generic energy modeling and functional LCA scaling)

EPA documentation on cyanide destruction and gold plating classifications (Acid Gold Cyanide specifics)
Background data: ecoinvent 3.12 treatment route
Background dataset: market for precious metal from electronics scrap, in anode slime
Uncertainty: No range defined.
Unit: g

Stripped photoresist Solid wasteg · ±20%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Developer sludge Solid wasteg · ±20%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper from treated etchant drag-out Solid wasteg · -89.2% / +125.1%

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -89.2% / +125.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Resin bleed-out Solid wasteg · -80% / +300%

Source citations: electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17, "Resin Flow Percent of Prepreg", Revision D, dated 8/97 (Originating Task Group: MIL-P-13949 Test Methods Task Group 7-11b). PDF document.
electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17.2, "Resin Flow of 'No Flow' Prepreg", Revision B, dated 8/97. PDF document.
electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.4.38, "Prepreg Scaled Flow Testing", Revision A, dated 6/91. PDF document.
kinwong.com (date not recorded). Kinwong Electronic Technology (Longchuan) - expansion and retrofit project completion environmental-protection acceptance monitoring report, form version (jian she xiang mu jun gong huan bao yan shou jian ce bao gao (biao)), 2021-08, 129 pp. (monitoring by Shenzhen Zhengyan Testing Technology Co., Ltd.). PDF document.
zjjcmspublic.oss-cn-hangzhou-zwynet-d01-a.internet.cloud.zj.gov.cn (date not recorded). Zhejiang Luoqitaike (Rocktek) Technology Co., Ltd. - annual 0.8M m2 double-sided and multilayer circuit board project, construction-project environmental impact report form, pollution-impact class (jian she xiang mu huan jing ying xiang bao gao biao), April 2023, 167 pp. (prepared by Jinhua Huanke Environmental Technology Co., Ltd.). PDF document.
patents.google.com (date not recorded). Hexion Specialty Chemicals Inc., US7592067B2, "Epoxy resin compositions, processes utilizing same and articles made therefrom", priority 2003-09-22, issued 2009-09-22. Patent.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -80% / +300% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Kraft press paper Solid wasteg · -57.1% / +90.5%

Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for waste paperboard, sorted
Uncertainty: -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

FR-4 drill dust Solid wasteg · ±95.1%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: ±95.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Spent drill bits Solid wasteg · -86.8% / +32.1%

Source citations: uniontool.co.jp (date not recorded). Union Tool Co., Technical Information Issue No. AT0062, "Drill Bit Wearing Investigation between D/S to 10Layers PWB", Union Tool Co. Technical Research, Nagaoka Factory, Nagaoka, Japan. PDF document.
Union Tool Co., "FR-4 / Double sided & 4-layer (phi 0.05 mm - phi 6.5 mm), Maximum spindle speed 200 krpm" drilling conditions chart, Copyright (C) 2005 Union Tool Co
cdn.grovesindustrial.com (date not recorded). Harvey Tool Company LLC, Safety Data Sheet "CEMENTED TUNGSTEN CARBIDE CUTTING TOOLS, UNCOATED, SDS GROUP 21", Date of Issue 01/28/2020, Version 1.0. PDF document.
ipcb.com (date not recorded). iPCB, "Causes of PCB Process Defects and Elimination Methods---Drilling", technical article.
carbiderecycling.com (date not recorded). Carbide Recycling Company, "We Buy Scrap Carbide Drills".
rrcarbide.com (date not recorded). RR Carbide, "Current Scrap Prices" (carbide, tungsten, cobalt and high-speed steel buy prices), page dated 08/18/2026.
kennametal.com (date not recorded). Kennametal Inc., "Carbide Recycling" service page.
17260206.s21i.faiusr.com (date not recorded). Victory Giant Technology (Huizhou) Co., Ltd. - Plant 9 Intelligent CNC Machining Centre Project (Phase 1), completion environmental-protection acceptance monitoring report, March 2026 (prepared by Huizhou Landing Environmental Technology Co., Ltd.). PDF document.
zsepb.zs.gov.cn (date not recorded). Zhongshan PCB plant capacity-expansion project environmental impact report (265 to 500 wan m2/a line-circuit-board expansion), stream S8 spent drill bits. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -86.8% / +32.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Entry sheet (aluminum) Solid wasteg · -75% / +50%

Source citations: circuitss.com (date not recorded). Hans Vandervelde (LCOA), "Chapter 24: Drilling Processes", in Printed Circuits Handbook (McGraw-Hill), chapter pages 24.3-24.22. PDF document.
electronics.org (date not recorded). Rocky Hilburn, Paul St. John, Joe Bevan (Laminate Company of America), "Drilling of Printed Circuit Boards: An Innovative, Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills". Conference paper.
cpca.org.cn (date not recorded). Zhu Min (CPCA Vice Secretary-General), China Printed Circuit Association - survey of the current state and development of China's PCB special-material suppliers: drilling entry and backup boards, 2026 edition.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for aluminium scrap, new
Uncertainty: -75% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Backup board (phenolic) - amortized Solid wasteg · -67.9% / +3.7%

Source citations: kllaminates.si (date not recorded). KL Laminates, "Entry and back boards (E&B)" product page. Vendor web page.
kllaminates.si (date not recorded). K.L. Laminates d.o.o., "TECHNICAL DATA - PH - PAPER PHENOLIC BROWN DRILLBOARD". Technical data sheet.
kllaminates.si (date not recorded). K.L. Laminates d.o.o., "W-BACK UP. W20 AND W25" technical data sheet. Technical data sheet.
noltewerk.de (date not recorded). noltewerk GmbH & Co. KG, "Technical datasheet HP 2061 (Phenolic resin cellulose paper 201/paper-based plastics)", as of 12/2019. Technical data sheet.
laminatedplastics.com (date not recorded). Laminated Plastics, "Technical Data Sheet - Paper Phenolic". Technical data sheet.
circuitss.com (date not recorded). Hans Vandervelde (LCOA), "Chapter 24: Drilling Processes", in Printed Circuits Handbook (McGraw-Hill), chapter pages 24.3-24.22. PDF document.
cpca.org.cn (date not recorded). Zhu Min (CPCA Vice Secretary-General), China Printed Circuit Association - survey of the current state and development of China's PCB special-material suppliers: drilling entry and backup boards, 2026 edition.
ccieurolam.com (date not recorded). CCI Eurolam / Alltech, "Entry Phenodrill" material datasheet, Rev. 08/2025. Technical data sheet.
ventec-group.com (date not recorded). Ventec International Group, "Material Datasheet: Phenolic Paper Based Drill Entry and Exit Board" (Nov 2016). Technical data sheet.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -67.9% / +3.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Epoxy smear residue Solid wasteg · -73.8% / +195.2%

Source citations: patents.google.com (date not recorded). Electrochemicals Inc., US6454868B1, "Permanganate desmear process for printed wiring boards", issued 2002-09-24. Patent.
isola-group.com (date not recorded). Young, T. (Isola); Polakovic, F. and Carano, M. (Electrochemicals Inc.), "Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing", paper S09-6-1. PDF document.
link.springer.com (date not recorded). Cheng, Y.-H.; Hsu, C.-C.; Lan, C.-J.; Munoz, S.; Caparanga, A.; Soriano, A.N.; Li, M.-H., "Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller", Journal of Electronic Materials, 2009, 38(11): 2368-2375. Journal article.
sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
17260206.s21i.faiusr.com (date not recorded). Victory Giant Technology (Huizhou) Co., Ltd. - Plant 9 Intelligent CNC Machining Centre Project (Phase 1), completion environmental-protection acceptance monitoring report, March 2026 (prepared by Huizhou Landing Environmental Technology Co., Ltd.). PDF document.
aivon.com (date not recorded). Aivon, "How We Resolved PCB Solder Mask Opening Design Conflicts in a 2-Layer FR4 PCB" (engineering case, production record #FR4-20260708-079).
kinjipcb.com (date not recorded). Kinji Group (KinjiPCB), product page "10 Layer FR4 ENIG Mass Production PCB" (product/142).
jlcpcb.com (date not recorded). JLCPCB Help Centre, "In what cases will there be charged extra?", section 9 "Too Many Drilling Holes" (page dated "Last updated on Aug 13, 2026").
pcbtok.com (date not recorded). PCBTok (Sony He), "Complete PCB Via Size Guideline", 5 November 2024, section "PCB Density".
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -73.8% / +195.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Manganese sludge (filter cake) Solid wasteg · -86% / +101.2%

Source citations: sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
epa.gov (date not recorded). U.S. EPA Office of Water - Preliminary Study of the Electrical and Electronic Components Point Source Category (40 CFR Part 469), EPA-821-R-22-005, DCN 11197, November 2022. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -86% / +101.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper in wastewater-treatment sludge/recovery Solid wasteg · -2.6% / +0.4%

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -2.6% / +0.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper recovered before outfall discharge Solid wasteg · -100% / +177.9%

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -100% / +177.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Anode sludge (phosphorus) Solid wasteg · -25% / +50.2%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -25% / +50.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Solder mask solids (developed) Solid wasteg · ±25%

Source citations: electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of waste plastic, mixture, municipal incineration
Uncertainty: ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Nickel hydroxide sludge Solid wasteg · -39.1% / +49.8%

Derivation basis: calculated from Ni precipitation stoichiometry

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: market for metalliferous hydroxide sludge
Uncertainty: -39.1% / +49.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Phosphorus in wastewater-treatment sludge Solid wasteg · -45.6% / +58.7%

Derivation basis: Derived: elemental phosphorus balance, the phosphorus reaching treatment less the post-treatment residual

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -45.6% / +58.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Routing dust (FR-4 particles) Solid wasteg · -24.6% / +8.1%

Source citations: blog.epectec.com (date not recorded). Epec Engineered Technologies, Chris Perry, "V Score of Printed Circuit Boards in Arrays", blog post 2015-01-14.
circuitnet.com (date not recorded). Oosterhof A. & Nether S. (LPKF), "Depaneling of Circuit Boards", Proc. 20th Pan Pacific Microelectronics Symposium, Kauai, Feb 2-5 2015 (CircuitNet-hosted PDF). Conference paper.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -24.6% / +8.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Spent oxide solution sludge Solid wasteg · -89.8% / +614.3%

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -89.8% / +614.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper Sludge Solid wasteg · -33.3% / +25%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: market for metalliferous hydroxide sludge
Uncertainty: -33.3% / +25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Neutralization Sludge Solid wasteg · -49.4% / +52%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -49.4% / +52% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Runner Sprue Scrap Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Packaging Scrap Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Emissions to air

4 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

CO₂ Emission to airg

Source citations: PVA decomposition
Compartment: Air (non-urban air or from high stacks)
CAS number: 124-38-9
ecoinvent 3.12 elementary flow: Carbon dioxide, fossil
Uncertainty: No range defined.
Unit: g

VOCs Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Volatile organic compounds (VOCs) Emission to airg

Source citations: epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP), Volume II Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, February 1999. Government report.
taiyo-america.com (date not recorded). TAIYO PSR-4000 LEW1 (US) Liquid Photoimageable Solder Mask, Technical Data Sheet, revised July 2013. Vendor datasheet.
electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Flux volatiles Emission to airg

Source citations: circuitinsight.com (date not recorded). Diepstraten, G. (Vitronics Soltec B.V.), How to Manage Material Outgassing in Reflow Oven, SMTA Proceedings (circuitinsight mirror). Symposium paper.
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Emissions to water

9 elementary flows released to water by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Cu2+ Emission to waterg

Source citations: mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
Compartment: Water (surface water)
Formula: Cu
CAS number: 7440-50-8
ecoinvent 3.12 elementary flow: Copper ion
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Mn2+ Emission to waterg

Source citations: epa.gov (date not recorded). U.S. EPA Office of Water - Preliminary Study of the Electrical and Electronic Components Point Source Category (40 CFR Part 469), EPA-821-R-22-005, DCN 11197, November 2022. Government report.
Compartment: Water (surface water)
CAS number: 16397-91-4
ecoinvent 3.12 elementary flow: Manganese II
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Potassium Emission to waterg

Source citations: p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
Compartment: Water (surface water)
Formula: K+
CAS number: 24203-36-9
ecoinvent 3.12 elementary flow: Potassium I
Notes: K2SO4 → 2K⁺ + SO4²⁻ (ionic dissociation)
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Sulfate Emission to waterg

Source citations: p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
Compartment: Water (surface water)
Formula: SO42-
CAS number: 14808-79-8
ecoinvent 3.12 elementary flow: Sulfate
Notes: Aggregated from 2 contributing steps: K2SO4 → 2K⁺ + SO4²⁻ (ionic dissociation) + H2SO4 dissociates in water → 2H⁺ + SO4²⁻
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

HCHO Emission to waterg

Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology Co. Ltd - annual 1.10 million m2 automotive-electronics supporting-industry project, phase 1 stage 1, construction-project completion environmental-protection acceptance report (jian she xiang mu jun gong huan jing bao hu yan shou bao gao). PDF document.
sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
mee.gov.cn (date not recorded). GB 8978-1996 Integrated wastewater discharge standard (wu shui zong he pai fang biao zhun), Table 4 maximum allowable discharge concentrations of Class II pollutants for units built on or after 1998-01-01. PDF document.
inchem.org (date not recorded). IPCS/WHO, Concise International Chemical Assessment Document 40: Formaldehyde, World Health Organization, Geneva, 2002.
epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197, November 2022. PDF document.
Compartment: Water (surface water)
CAS number: 50-00-0
ecoinvent 3.12 elementary flow: Formaldehyde
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

EDTA Emission to waterg

Source citations: cjournal.hep.com.cn (date not recorded). MEI Yining, WEI Zhe, WEI Li'an, Study on resource recycling of copper from spent PCB electroless copper plating bath, Electroplating & Finishing, 2024, 43(2): 149-154 (School of Environmental and Chemical Engineering, Nanchang Hangkong University). Journal article.
p2infohouse.org (date not recorded). Pagel, P., "Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies", Minnesota Technical Assistance Program (MnTAP) under the U.S. EPA WRITE Program, pp. 483-492. PDF document.
patents.google.com (date not recorded). C. Uyemura & Co. Ltd, EP0142356B1, "Analytical method for determining formaldehyde in electroless copper plating bath", priority 1983-11-11. Patent.
gesetze-im-internet.de (date not recorded). Abwasserverordnung (AbwV) Anhang 40 "Metallbearbeitung, Metallverarbeitung" (German Waste Water Ordinance, Annex 40).
Compartment: Water (unspecified)
Formula: C₁₀H₁₆N₂O₈
CAS number: 60-00-4
ecoinvent 3.12 elementary flow: EDTA, Ethylenediaminetetraacetic Acid
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Ni Emission to waterg

Source citations: China GB 39731-2020, Emission standard of water pollutants for the electronics industry, Table 1 item 20 total nickel 0.5 mg/L (archived MEE PDF, read verbatim); corroborated by GB 21900-2008 electroplating total nickel 0.5 mg/L; band endpoints from EU STM BREF 2006 Table 3.18 (nine Swedish installations) and Table 3.20 (nickel levels associated with potential BAT)
Compartment: Water (surface water)
Formula: Ni2+
CAS number: 14701-22-5
ecoinvent 3.12 elementary flow: Nickel II
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

CN⁻ Emission to waterg

Source citations: bureau-industrial-transformation.jrc.ec.europa.eu (2019). Reference Document on Best Available Techniques for the Surface Treatment of Metals and Plastics. PDF document.
law.cornell.edu (date not recorded). 40 CFR § 433.15 - Pretreatment standards for existing sources (PSES). | Electronic Code of Federal Regulations (e-CFR) | US Law | LII / Legal Information Institute.
Compartment: Water (surface water)
Formula: CN-
CAS number: 57-12-5
ecoinvent 3.12 elementary flow: Cyanide
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Phosphorus (from hypophosphite) Emission to waterg

Derivation basis: Calculated as a release to water, from a contaminant mass balance on the process chemistry.

No source is attached to this row.
Source citations: Not stated
Compartment: Water (surface water)
Formula: P
CAS number: 7723-14-0
ecoinvent 3.12 elementary flow: Phosphorus
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Flows not quantified

5 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.

Cut off - below the significance threshold (1)

Chloride ions Process chemicalg · -70% / +169.9%

Source citations: nepis.epa.gov (date not recorded). U.S. Environmental Protection Agency (2000). Printed Wiring Board Surface Finishes: Volume 2 Appendices, Draft Cleaner Technologies Substitutes Assessment. Web page.
insulectro.com (2021). Microfill EVF Copper Via Fill. PDF document.
enviolet.com (2004). Copper Bath Recycling in PCB by Atotech 2004. PDF document.
insulectro.com (2021). Electroposit 1000 acid Copper. PDF document.
Background data: cut off
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Chloride quantity is calculated from the vendor working-bath concentration and the existing process-specific bath allocation. The flow is left unlinked to a background production dataset because no representative one is available.
Uncertainty: -70% / +169.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Not modelled (4)

Complexing agent (EDTA or Rochelle salt) Process chemicalg · -20% / +50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating-bath additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -20% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Plating additives Process chemicalg · ±33.3%

Source citations: ResearchGate, Water use in PCB manufacturing
Envirowise, Water use in PCB manufacturing
Patent CN102286761B, Acid Copper Additives
Patent US5151170A, Brightener Consumption
SysPCB, Inner Layer Process
NMFRC, Electroless Nickel Stoichiometry
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Sodium chlorite Process chemicalg · -16.7% / +11.1%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Consumption is recorded in this inventory. No production dataset for sodium chlorite exists in the public background database used for linkage. Chlorate, chloride, and hypochlorite chemistries are available, but not chlorite, so the upstream burden is left unlinked rather than approximated with a chemically different proxy.
Uncertainty: -16.7% / +11.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Complexing agent (citrate, malate, or lactate) Process chemicalg · -40% / +60%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.
REEL derivation: engineering estimate of connector and electromechanical component mass and material split, built from vendor catalogue and product-page data for representative parts; no single published inventory covers this component class

No source is attached to this row.
Source citations: Not stated
Background data: not modelled
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Proprietary plating-bath additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Limitations and unquantified flows (1)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

Not quantifiedElectricity for inserting the wound magnetics module into the housing and for installing the indicator LEDs is not quantified. Both are mechanical placement operations on the same assembly line as the contact insertion and shell attachment that ARE included, and no measured or published energy for either was located.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase: Product operation is outside the cradle-to-gate scope.
End-of-life treatment: Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail: The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials: Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers: Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication: A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead: Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods: Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits: Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim: Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing: Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages: Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
Volatile organics (photoresist solvents, PGMEA) - air quality
Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol