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Overview

General comment

Memory-only server module: four stacks of low-power dynamic random-access memory on a compact board, screwed down and held against the host board by a compression connector.

Technology
Not stated
Geography
Global average data from equipment vendor specifications and industry literature

System boundary

System boundary - SOCAMM 128GB LPDDR5X Memory Module (4×32GB 16DP stacks, NVIDIA Grace/GB300)System boundary figure: identity, gate in, entering flows, the dashed system boundary and the unit processes inside it, the reference product, emissions and waste, and below it the flows that are recorded but not quantified. No inventory quantities.SOCAMM 128GB LPDDR5X Memory Module (4×32GB 16DP stacks, NVIDIA Grace/GB300)GATE INSub-component procurementENTERING FLOWSElectricityFreight transportOtherSYSTEM BOUNDARYCOMPOSED OF OTHER REEL DATASETSDRAM Dies1-beta DRAM wafer, 300mm, moderatescenarioStack PackagesWire Bond Fine-pitch BGA withVertically Stacked Dies packagePrinted Circuit Board8-Layer Memory DIMM PCB, ENIG finishBoard ConnectorDDR5 DIMM SocketDecoupling MLCCMLCC X7R 0201Chip ResistorsChip Resistor 0402REFERENCE PRODUCTSOCAMM 128GB LPDDR5X Memory Module(4×32GB 16DP stacks, NVIDIAGrace/GB300)Final assemblyEMISSIONS AND WASTEEmissions to airEmissions to waterWaste routesRECORDED BUT NOT QUANTIFIEDExclusions not yet characterisedNo exclusion record was found for this datasetNOT CHARACTERISEDsystem boundaryreference flowentering flowemission / waste

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 2.3 Good
Reliability
3.0
Completeness
2.1
Temporal
2.0
Geographic
2.0
Technological
2.4
How the score is calculated: Constituent datasets have more influence when they contribute a larger share of the modelled cradle-to-gate energy demand.

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure
Component vendor specifications, academic papers, industry literature
Coverage status
Composed from linked REEL datasets
Pedigree-scored source files
76 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

8 flows. Quantities are not published; they ship with the dataset on Circa.

DRAM Dies REEL datasetwafer
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Wafer demand calculated from die count, rectangular wafer packing, die yield and assembly yield. Wafer manufacturing yield is already included upstream. This entry states no die yield of its own, so the sizing uses the die yield the referenced wafer dataset declares for its own reference die.
Uncertainty
No range defined.
Unit
wafer
Stack Packages REEL datasetpackage
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
package
Printed Circuit Board REEL datasetm2
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
m2
Board Connector REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
DDR5 DIMM Socket
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Decoupling MLCC REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
MLCC X7R 0201
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Chip Resistors REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
Chip Resistor 0402
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Wafer transport, KR fab to packaging site - Road Freight transporttkm · -100% / +172%
Derivation basis
  • Specified for this manufacturing operation and scaled to the dataset's functional unit.

The sources below come from the manufacturing operations behind this row.

Sources (inherited)
Inherited, rolled up from the contributing process steps:
  • Additional Investment in Onyang Campus... Expanding Back-End Processing Too (Seoul Economic Daily)
  • The Elec report, 2026-07: Samsung back-end investment focused on high-bandwidth memory
  • DigiTimes report, 2024-11-13: Samsung Cheonan and Onyang back-end hubs
Background data
ecoinvent 3.12
Background dataset
transport, freight, lorry, unspecified
Notes
Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from memory fab to domestic back end. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses the route-class distance envelope, and its upper endpoint also adds the separate reusable-carrier return service.
Uncertainty
-100% / +172% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
tkm — tonne-kilometres, a transport effort rather than a mass
Electricity, Global (GLO) ElectricitykWh · -21% / +29%
Derivation basis
  • Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.

The sources for this row are listed below.

Source citations (dataset-level)
  • Micron SOCAMM product announcements (128GB LPDDR5X for NVIDIA Grace/GB300) | url: https://www.globenewswire.com/news-release/2025/03/18/3044997/14450/en/index.html
  • Tom's Hardware: Micron and SK hynix Unveil LPDDR5X SOCAMM Up to 128GB for AI Servers | url: https://www.tomshardware.com/pc-components/ram/micron-and-sk-hynix-unveil-lpddr5x-socamm-up-to-128gb-for-ai-servers
Background data
ecoinvent 3.12
Background dataset
electricity, medium voltage
Uncertainty
-21% / +29% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kWh

Outputs and waste

Packaging assembly reject Solid wastekg
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of inert waste, sanitary landfill
Uncertainty
No range defined.
Unit
kg

Emissions to air

No emissions to air are recorded at this level.

Emissions to water

No emissions to water are recorded at this level.

Flows not quantified

No flows are recorded for this dataset without a quantity.

Limitations and unquantified flows (3)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

Waste

  • These flows are named in this inventory but ship without a quantity, so their burden is not carried anywhere in the dataset: Packaging assembly reject. Each row states its own reason on the row itself.

General

  • The compression connector is modelled with a 288-pin DDR5 DIMM socket as a stand-in. No public inventory for a dedicated compression connector of this pin count was available; the substituted part is a soldered host-board socket rather than the screw-retained compression connector this module actually uses, and it is the single largest material row on the dataset.
  • The module board is modelled with a memory-DIMM board scaled to this module's outline. No public board specification for this form factor was available, so the layer count and build-up are estimated.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase
Product operation is outside the cradle-to-gate scope.
End-of-life treatment
Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail
The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials
Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers
Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication
A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead
Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods
Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits
Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim
Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing
Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages
Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

  • Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
  • Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
  • Volatile organics (photoresist solvents, PGMEA) - air quality
  • Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
  • Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol