Overview
- Technology
- Memory Module, Compression-Attached (CAMM2)
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Component vendor specifications, academic papers, industry literature
- Coverage status
- Composed from linked REEL datasets
- Pedigree-scored source files
- 65 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
5 flows. Quantities are not published; they ship with the dataset on Circa.
DRAM ICs REEL datasetunit
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- DRAM IC 16Gb, FBGA, 1β
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- unit
Clock Driver CKD REEL datasetunit
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- DDR5 CKD, QFN, 28nm
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- unit
Printed Circuit Board REEL datasetm2
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 10-Layer HDI PCB, ENIG finish
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- m2
Gold Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- JEDEC JESD318 (CAMM2)
- Background data
- ecoinvent 3.12
- Background dataset
- gold
- Uncertainty
- No range defined.
- Unit
- kg
Electricity, Global (GLO) ElectricitykWh · -27% / +39.2%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- JEDEC JESD318 (CAMM2)
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Uncertainty
- -27% / +39.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Outputs and waste
No output flows are recorded at this level.
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
No flows are recorded for this dataset without a quantity.
Limitations and unquantified flows (2)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- The passive components identified in the bill of materials are not included in this inventory.
- The declared mass of this module is larger than the sum of the constituents its own bill enumerates. The module carries more passive parts than the bill lists, and the balance is not attributed to any named material, so nothing here says what that remainder is made of. The declared total is kept as it stands rather than trimmed to the parts that are named, and the remainder is recorded as an open reconciliation rather than absorbed into a constituent that did not earn it.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Complete DDR5 CAMM2 (Compression-Attached Memory Module, JESD318) assembly. Replaces SODIMM in laptops/mini-PCs. 10-layer HDI PCB (78×54 mm), 1β DRAM, 1 CKD for high-speed SKUs, compression LGA connector.