Changelog

Major expansion and consolidation of the database ahead of independent critical review, growing coverage to 520 unit process datasets across 18 component categories.

Coverage

Current-generation memory was added: high-bandwidth memory stacks, graphics DRAM, 1γ DRAM, 321-layer 3D NAND and DDR5 module families. The release also brought in silicon photonics and optical transceivers with explicit III–V optical sub-assemblies, single-mode optical fibre and fibre connectors, tantalum capacitor vendor variants, and an expanded set of upstream specialty-chemical datasets.

Variants

Datasets ship with declared variant axes: operational scenarios for wafers; geography options for leading-edge logic and specialty wafers, with a representative manufacturing region per technology; stack heights and production-maturity yield scenarios for high-bandwidth memory; and surface finishes for printed boards.

Methodology

Emissions to water are extracted with chemistry-based transformation rules and abatement destruction efficiencies. The facility-support model was reworked and anchored to publicly disclosed reference fabs, with recipe-driven cleanroom heating and cooling and per-region climate adjustment, and a facility-overhead layer was added for back-end assembly and test sites. A uniform good-unit functional unit gives explicit yield ownership between wafer, packaging and component datasets, and die-count allocation is based on rectangular die packing. Uncertainty is propagated end to end with declared band provenance, per-flow source citations resolve from curated source registries, and dataset-level data-quality scoring disciplines authored pedigree labels against the underlying source evidence.

Corrections

Successive internal review rounds re-anchored packaging process energies, etch-gas quantities and fate, and upstream feed stoichiometry. Every revision was verified dataset by dataset against the preceding release state.

Provenance and review

Citation and uncertainty-band coverage are accounted per inventory row, with recorded exemptions. Data-quality composites use configuration-weighted scoring with one-decimal display. The intra-chain freight layer uses structured legs with a chargeable-weight air basis and documented route mixes. An independent critical review, completed 2026-08-25, was performed; the signed review statement (PDF) is reproduced in the methodology report and available here as a separate download.

Initial public release.

Coverage

363 unit process datasets across 18 component categories, covering semiconductor wafers from 3nm to 180nm, complete integrated circuits, memory (DRAM, NAND and high-bandwidth memory), advanced packaging (chip-on-wafer-on-substrate, fan-out wafer-level and flip-chip ball grid array), printed circuit boards, passive components, connectors, cables, and supporting infrastructure.