Overview

General comment

Production covered

Package built around small silicon bridges embedded in the organic substrate, which give fine-pitch die-to-die wiring without a full interposer.

Functional unit is one package STARTED: the reference flow is a single package entering assembly, and the activities listed run through completed assembly and final test of that package.

Modelling choices

By the count-once yield-ownership convention, the gross-up from packages started to good packages is carried by the consuming IC or component dataset, not here.

Technology: EMIB
Geography: Global average data from equipment vendor specifications and industry literature

System boundary

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 2.1 Good

Reliability

3.0

Completeness

2.6

Temporal

2.1

Geographic

2.0

Technological

1.1

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure: Equipment vendor specifications, academic papers, industry literature
Coverage status: Partial
Pedigree-scored source files: 12 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

28 flows. Quantities are not published; they ship with the dataset on Circa.

C₄F₈ production Process gasg · ±50%

Source citations: Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation JVA 2019
Extreme low-k porous pSiCOH dielectrics. JVB 2017
Upstream REEL dataset: Octafluorocyclobutane (c-C4F8)
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: ±50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

ArF Photoresist Process chemicalg · -32.3% / +57.9%

Derivation basis: Lithography parameters

The sources for this row are listed below.
Source citations: patents.google.com (date not recorded). US11545361B2, "Method and apparatus for coating photo resist over a substrate". Patent.
microsi.com (date not recorded). Flack, W.W., Nguyen, H.-A. (Ultratech), Capsuto, E. (Shin-Etsu MicroSi), Abreau, K. (STEAG Hamatech USA), "Characterization of 100 Micron Thick Positive Photoresist on 300 mm Wafers", SPIE 2005 #5753-103. PDF document.
nrf.aux.eng.ufl.edu (date not recorded). AZ 9260 PHOTORESIST (520CPS) (US) Material Safety Data Sheet, substance key SXR109902, revision date 03/03/2010. PDF document.
Upstream REEL dataset: ArF Photoresist (193nm)
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: -32.3% / +57.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

TMAH Developer (2.38% solution) Process chemicalg · ±33%

Derivation basis: Developer usage

The sources for this row are listed below.
Source citations: 300mm wafer photoresist dispense. SPIE
Upstream REEL dataset: TMAH Developer (2.38% solution) (N(CH3)4OH (aq))
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: ±33% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

CMP Slurry (Copper) Process chemicalg · ±23.1%

Source citations: CMP process water and slurry consumption. NMFRC
Estimating CMP Process Mass Intensity. NCCAVS 2024
Upstream REEL dataset: Copper CMP Slurry
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: ±23.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

BARC Process chemicalg · -33.3% / +33.4%

Source citations: 300mm wafer photoresist dispense. SPIE
Upstream REEL dataset: ArF Photoresist (193nm)
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: -33.3% / +33.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Polyimide (PMDA/ODA) Process chemicalg · -25% / +25.1%

Derivation basis: Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.
Source citations: Not stated
Upstream REEL dataset: Polyimide (PMDA/ODA) ((C22H10N2O5)n)
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: -25% / +25.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Water supply (municipal) Waterm3 · -37.2% / +53.8%

Derivation basis: Calculated from process-water and ultrapure-water demand across all manufacturing operations, plus facility water allocated to each finished unit. The fresh intake shown is that demand less the share reused under the water-recycling scenario this dataset assumes, and wastewater follows the same balance.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

CMP process water and slurry consumption. NMFRC

Estimating CMP Process Mass Intensity. NCCAVS 2024
Upstream REEL dataset: Water Supply (Municipal)
Background dataset: Modelled by REEL; see the upstream dataset above.
Notes: Net fresh-water intake, supplied as municipal water
Uncertainty: -37.2% / +53.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: m3

Kraft press paper Materialkg · -57.1% / +90.5%

Derivation basis: This flow is a consumable of the manufacturing operation. The model reads it from the operation's own inventory rather than from the product's bill of materials.

The sources for this row are listed below.
Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
Background data: ecoinvent 3.12
Background dataset: kraft paper
Uncertainty: -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kg

Electricity, Taiwan (TW) ElectricitykWh · -63.6% / +122.1%

Derivation basis: Calculated from equipment energy across all manufacturing operations. It also includes the assembly site's facility overhead: air handling and cleanroom conditioning, chilled water, compressed dry air, exhaust and dust collection, wastewater treatment and uninterruptible power.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

limitekltd.com (date not recorded). EBARA F-REX 300S - Limitek used-equipment listing (EB023), including photographs of the tool rating plate. PDF document.

fabsurplus.com (date not recorded). EBARA CMP SPEC <F-REX300S> - Ebara-authored configuration/checklist sheet, SDI (fabsurplus) catalogue item 82844.

web.mit.edu (date not recorded). Branham, M. S. & Gutowski, T. G. (2010). Deconstructing Energy Use in Microelectronics Manufacturing: An Experimental Case Study of a MEMS Fabrication Facility. Environ. Sci. Technol. 44(11):4295-4301 (MIT-hosted author PDF). PDF document.

Atotech Neoganth X Activator specifications

P2InfoHouse drag-out reduction study

Atotech Neoganth X Activator specifications; A Pollution Prevention Resource Manual for Metal Finishers - A Competitive Advantage Manual

The Electrochemical Recovery of Metallic Palladium from Spent Electroless Plating Solution (JOM, 2009)

AllPCB and RayPCB lamination process documentation

advantest.com (2024). Advantest Unveils New Ultra-High-Current Power Supply for V93000 EXA Scale SoC Test System. Web page.

teradyne.com. Titan HP | Teradyne.

directindustry.es (date not recorded). Sistema de prueba para la industria electrónica - Titan HP - Teradyne - para semiconductores / modular / de alta potencia. Web page.

electronics360.globalspec.com (date not recorded). Chip complexity drives surge in system-level testing | Electronics360. Web page.

teradyne.com (date not recorded). Titan System Level Test. Web page.

Union Tool drilling conditions: FR-4 Double sided & 4-layer, max spindle speed 200 krpm

Union Tool drilling conditions: FR-4 6 & 8-layer, 200 krpm

Union Tool drilling conditions: FR-4 Double sided & 4-layer, 100 krpm

thk.com (date not recorded). THK CSR Report 2008, interview with the president of Hitachi Via Mechanics - 6-axis machines at 9,000 holes per minute (500 hits/min per spindle in three stacked boards). PDF document.

arkgroupindia.net (date not recorded). ARK Solution (ARK Group India), PCB drilling machines listing - spec table: 6 spindles, Spindle Hits 500 Hits/Min., 200,000 rpm.

instct.org (date not recorded). GSI Group / Westwind, Advances in Mechanical Micro-drilling, INSTCT industry seminar (Arundel, March 2011) - spindle-level hit rates, data courtesy of Posalux. PDF document.
Background data: ecoinvent 3.12
Background dataset: electricity, medium voltage
Uncertainty: -63.6% / +122.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: kWh

O₂ Process gasg

Source citations: Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation JVA 2019
Extreme low-k porous pSiCOH dielectrics. JVB 2017
Background data: ecoinvent 3.12
Background dataset: oxygen, liquid
Uncertainty: No range defined.
Unit: g

Ar Process gasg · -46.3% / +62%

Source citations: Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation JVA 2019
Applied Materials Endura Impulse PVD
Background data: ecoinvent 3.12
Background dataset: argon, liquid
Uncertainty: -46.3% / +62% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

N₂ Process gasg · -29.9% / +31.8%

Derivation basis: Cure atmosphere

The sources for this row are listed below.
Source citations: Applied Materials Endura Impulse PVD
Background data: ecoinvent 3.12
Background dataset: nitrogen, liquid
Uncertainty: -29.9% / +31.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

SiH₄ Process gasg · -91.4% / +42.8%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: silicon tetrahydride
Uncertainty: -91.4% / +42.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

NH₃ Process gasg · -93.7% / +57.9%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: ammonia, anhydrous, liquid
Uncertainty: -93.7% / +57.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Compressed air Process gasg · -29.9% / +40.6%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: compressed air, 700 kPa gauge
Uncertainty: -29.9% / +40.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Compressed air (tool) Process gasg · -33.4% / +66.6%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: compressed air, 700 kPa gauge
Uncertainty: -33.4% / +66.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Low-k Precursor (3MS/DEMS) Process chemicalg · ±33.4%

Source citations: Extreme low-k porous pSiCOH dielectrics. JVB 2017
PECVD low-k dielectric deposition. Patent US2018
Background data: proxy-mapped
Background dataset: silicone product
Uncertainty: ±33.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

EBR Solvent (PGMEA) Process chemicalg · ±33.3%

Source citations: 300mm wafer photoresist dispense. SPIE
Background data: CarbonMinds
Background dataset: propylene glycol methyl ether acetate (PGMEA)
Uncertainty: ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Cavity adhesive (die attach film) Process chemicalg · -40% / +60%

Derivation basis: Die attach material estimate

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: epoxy resin insulator, SiO2
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Cu Plating Solution Process chemicalg · -40% / +60%

Derivation basis: Plating parameters

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: copper sulfate
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Cu plating bath (CuSO₄ + H₂SO₄) Process chemicalg · -33.3% / +50%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: proxy-mapped
Background dataset: copper sulfate
Uncertainty: -33.3% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Flux (water soluble) Process chemicalg · -40% / +100%

Derivation basis: Flux type for FOWLP solder ball attach

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: flux, for wave soldering
Uncertainty: -40% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Capillary underfill (epoxy) Process chemicalg · -33.4% / +49.9%

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: epoxy resin insulator, SiO2
Uncertainty: -33.4% / +49.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Thermal Interface Material (TIM1) Process chemicalg · -50.8% / +146.2%

Source citations: smtnet.com (date not recorded). Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews (Ablestik Laboratories, Rancho Dominguez, California), "Advanced Thermal Interface Materials for Enhanced Flip Chip BGA". PDF document.
Wacker Chemie AG, "WACKER(R) SILICONE PASTE P 12 -- Thermally conductive silicone paste", technical data sheet, Version 1.5, date of last alteration 14.04.2014, 2 pp
Henkel, Technical Data Sheet, LOCTITE ABLESTIK 2902, August 2021, Reference 0.5, 2 pp
amkor.com (date not recorded). MiKyeong Choi, HyunHye Jung, KwangSeok Oh, DongSu Ryu, SangHyoun Lee, WonChul Do, YoungDo Kweon, Mike Kelly, KyungRok Park, JinYoung Khim, Ron Huemoeller, "Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), pp. 1332-1336, DOI 10.1109/ECTC32862.2020.00211. Academic paper.
Background data: ecoinvent 3.12
Background dataset: silicone product
Uncertainty: -50.8% / +146.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Lid adhesive (silicone) Process chemicalg · -69% / +343.1%

Source citations: patents.google.com (date not recorded). Intel Corporation, US20210398871A1, "Integrated circuit heat spreader including sealant interface material", priority date 2020-06-18, publication date 2021-12-23. Patent.
freepatentsonline.com (date not recorded). Taiwan Semiconductor Manufacturing Company, Ltd., US20130260511A1, "Lid attach process and apparatus for fabrication of semiconductor packages", filed 2012-06-12. Patent.
freepatentsonline.com (date not recorded). Taiwan Semiconductor Manufacturing Company, Ltd., US20170076960A1, "Lid attach processes for semiconductor packages", filed 2016-11-02. Patent.
Henkel, Technical Data Sheet, LOCTITE ABLESTIK 104, December 2015, Reference 0.0, 2 pp
Henkel, Technical Data Sheet, LOCTITE(R) ABLESTIK 286, November 2024, 1 p
Background data: ecoinvent 3.12
Background dataset: silicone product
Uncertainty: -69% / +343.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Silicon with Cu routing Materialkg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: silicon, electronics grade
Uncertainty: No range defined.
Unit: kg

BT resin + ABF buildup Materialunit

Derivation basis: Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.
Source citations: Not stated
Upstream REEL dataset: ABF Substrate
Background dataset: Modelled by REEL; see the upstream dataset above.
Uncertainty: No range defined.
Unit: unit

Cu Materialkg

Derivation basis: Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12
Background dataset: copper, cathode
Uncertainty: No range defined.
Unit: kg

Outputs and waste

Wastewater Wastewaterm3 · -37.2% / +53.8%

Derivation basis: Calculated from the water balance: fresh-water input minus evaporation.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

CMP process water and slurry consumption. NMFRC

Estimating CMP Process Mass Intensity. NCCAVS 2024
Background data: carried, no background dataset
Background dataset: No treatment route recorded for this output.
Uncertainty: -37.2% / +53.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: m3

CMP slurry waste Solid wasteg · ±23.1%

Source citations (dataset-level): CMP process water and slurry consumption. NMFRC
Estimating CMP Process Mass Intensity. NCCAVS 2024
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

CMP process water and slurry consumption. NMFRC

Estimating CMP Process Mass Intensity. NCCAVS 2024
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: ±23.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Spent photoresist (liquid spin-off) Solid wasteg · -29.3% / +117.9%

Source citations: TCEQ. Industrial Waste Classification
patents.google.com (date not recorded). US9720325B2, "Photoresist coating scheme". Patent.
patents.google.com (date not recorded). US7405033B2, "Method for manufacturing resist pattern and method for manufacturing semiconductor device". Patent.
microchemicals.com (date not recorded). MicroChemicals GmbH, "Spin-Coating", chapter of Basics of Microstructuring / Fundamentals of Microstructuring. PDF document.
cdn.vanderbilt.edu (date not recorded). MICROPOSIT S1805 POSITIVE PHOTORESIST, Material Safety Data Sheet, revision date 04/08/2011, version 3.2. PDF document.
nanofab.utah.edu (date not recorded). JSR ARF AM 2073J-19 Material Safety Data Sheet, date prepared April 15, 2009 (Revision 5). PDF document.
epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP) Volume II, Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, 2/24/99. PDF document.
rcrapublic.epa.gov (date not recorded). US EPA RCRA Online RO 11249, memorandum 9444.1987(18), letter to Mr. Frank Czigler, S & W Waste Inc., dated MAY 20 1987. PDF document.
patents.google.com (date not recorded). US9421567B2, "Recycle photochemical to reduce cost of material and environmental impact". Patent.
pmc.ncbi.nlm.nih.gov (date not recorded). Ni, J., Zhang, Q., Zhang, X., Sun, Z., Bao, D., "Detection Method and Common Characteristics of Waste Solvent from Semiconductor Industry", Molecules 28(16):5992, 2023. Journal article.
epa.gov (date not recorded). US EPA, "Defining Hazardous Waste: Listed, Characteristic and Mixed Radiological Wastes".
semiengineering.com (date not recorded). SemiEngineering, "Improving EUV Process Efficiency".
dspace.mit.edu (date not recorded). Modeling and analysis of extrusion-spin coating: an efficient and deterministic photoresist coating method in microlithography (MIT Mechanical Engineering thesis). Thesis.
microsi.com (date not recorded). Flack, W.W., Nguyen, H.-A. (Ultratech), Capsuto, E. (Shin-Etsu MicroSi), Abreau, K. (STEAG Hamatech USA), "Characterization of 100 Micron Thick Positive Photoresist on 300 mm Wafers", SPIE 2005 #5753-103. PDF document.
nrf.aux.eng.ufl.edu (date not recorded). AZ 9260 PHOTORESIST (520CPS) (US) Material Safety Data Sheet, substance key SXR109902, revision date 03/03/2010. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: -29.3% / +117.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Spent EBR solvent (PGMEA) Solid wasteg · ±33.3%

Source citations: 300mm wafer photoresist dispense. SPIE
patents.google.com (date not recorded). WO2002035287A2, "Edge bead remover for thick film photoresists".
epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP) Volume II, Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, 2/24/99. PDF document.
rcrapublic.epa.gov (date not recorded). US EPA RCRA Online RO 11249, memorandum 9444.1987(18), letter to Mr. Frank Czigler, S & W Waste Inc., dated MAY 20 1987. PDF document.
epa.gov (date not recorded). US EPA, "Defining Hazardous Waste: Listed, Characteristic and Mixed Radiological Wastes".
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Chamber deposits Solid wasteg · -85% / +0%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

300mm wafer photoresist dispense. SPIE

Applied Materials Endura Impulse PVD

Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation JVA 2019

Extreme low-k porous pSiCOH dielectrics. JVB 2017

PECVD low-k dielectric deposition. Patent US2018

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -85% / +0% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Dicing slurry (Si/EMC/Cu particles) Solid wasteg

Derivation basis: No retrievable public document identified

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: No range defined.
Unit: g

Mixed process waste Solid wasteg

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below come from the manufacturing operations behind this row.
Sources (inherited): Inherited, rolled up from the contributing process steps:

patents.google.com (date not recorded). Intel Corporation, US20210398871A1, "Integrated circuit heat spreader including sealant interface material", priority date 2020-06-18, publication date 2021-12-23. Patent.

freepatentsonline.com (date not recorded). Taiwan Semiconductor Manufacturing Company, Ltd., US20130260511A1, "Lid attach process and apparatus for fabrication of semiconductor packages", filed 2012-06-12. Patent.

freepatentsonline.com (date not recorded). Taiwan Semiconductor Manufacturing Company, Ltd., US20170076960A1, "Lid attach processes for semiconductor packages", filed 2016-11-02. Patent.

Henkel, Technical Data Sheet, LOCTITE ABLESTIK 104, December 2015, Reference 0.0, 2 pp

Henkel, Technical Data Sheet, LOCTITE(R) ABLESTIK 286, November 2024, 1 p

smtnet.com (date not recorded). Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews (Ablestik Laboratories, Rancho Dominguez, California), "Advanced Thermal Interface Materials for Enhanced Flip Chip BGA". PDF document.

Wacker Chemie AG, "WACKER(R) SILICONE PASTE P 12 -- Thermally conductive silicone paste", technical data sheet, Version 1.5, date of last alteration 14.04.2014, 2 pp

Henkel, Technical Data Sheet, LOCTITE ABLESTIK 2902, August 2021, Reference 0.5, 2 pp

amkor.com (date not recorded). MiKyeong Choi, HyunHye Jung, KwangSeok Oh, DongSu Ryu, SangHyoun Lee, WonChul Do, YoungDo Kweon, Mike Kelly, KyungRok Park, JinYoung Khim, Ron Huemoeller, "Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era", 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), pp. 1332-1336, DOI 10.1109/ECTC32862.2020.00211. Academic paper.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Resin bleed-out Solid wasteg · -80% / +300%

Source citations: electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17, "Resin Flow Percent of Prepreg", Revision D, dated 8/97 (Originating Task Group: MIL-P-13949 Test Methods Task Group 7-11b). PDF document.
electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17.2, "Resin Flow of 'No Flow' Prepreg", Revision B, dated 8/97. PDF document.
electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.4.38, "Prepreg Scaled Flow Testing", Revision A, dated 6/91. PDF document.
kinwong.com (date not recorded). Kinwong Electronic Technology (Longchuan) - expansion and retrofit project completion environmental-protection acceptance monitoring report, form version (jian she xiang mu jun gong huan bao yan shou jian ce bao gao (biao)), 2021-08, 129 pp. (monitoring by Shenzhen Zhengyan Testing Technology Co., Ltd.). PDF document.
zjjcmspublic.oss-cn-hangzhou-zwynet-d01-a.internet.cloud.zj.gov.cn (date not recorded). Zhejiang Luoqitaike (Rocktek) Technology Co., Ltd. - annual 0.8M m2 double-sided and multilayer circuit board project, construction-project environmental impact report form, pollution-impact class (jian she xiang mu huan jing ying xiang bao gao biao), April 2023, 167 pp. (prepared by Jinhua Huanke Environmental Technology Co., Ltd.). PDF document.
patents.google.com (date not recorded). Hexion Specialty Chemicals Inc., US7592067B2, "Epoxy resin compositions, processes utilizing same and articles made therefrom", priority 2003-09-22, issued 2009-09-22. Patent.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: -80% / +300% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Kraft press paper Solid wasteg · -57.1% / +90.5%

Source citations: qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for waste paperboard, sorted
Uncertainty: -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

FR-4 drill dust Solid wasteg · ±95.1%

Derivation basis: Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: ±95.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Spent drill bits Solid wasteg · -86.8% / +32.2%

Source citations: uniontool.co.jp (date not recorded). Union Tool Co., Technical Information Issue No. AT0062, "Drill Bit Wearing Investigation between D/S to 10Layers PWB", Union Tool Co. Technical Research, Nagaoka Factory, Nagaoka, Japan. PDF document.
Union Tool Co., "FR-4 / Double sided & 4-layer (phi 0.05 mm - phi 6.5 mm), Maximum spindle speed 200 krpm" drilling conditions chart, Copyright (C) 2005 Union Tool Co
cdn.grovesindustrial.com (date not recorded). Harvey Tool Company LLC, Safety Data Sheet "CEMENTED TUNGSTEN CARBIDE CUTTING TOOLS, UNCOATED, SDS GROUP 21", Date of Issue 01/28/2020, Version 1.0. PDF document.
ipcb.com (date not recorded). iPCB, "Causes of PCB Process Defects and Elimination Methods---Drilling", technical article.
carbiderecycling.com (date not recorded). Carbide Recycling Company, "We Buy Scrap Carbide Drills".
rrcarbide.com (date not recorded). RR Carbide, "Current Scrap Prices" (carbide, tungsten, cobalt and high-speed steel buy prices), page dated 08/18/2026.
kennametal.com (date not recorded). Kennametal Inc., "Carbide Recycling" service page.
17260206.s21i.faiusr.com (date not recorded). Victory Giant Technology (Huizhou) Co., Ltd. - Plant 9 Intelligent CNC Machining Centre Project (Phase 1), completion environmental-protection acceptance monitoring report, March 2026 (prepared by Huizhou Landing Environmental Technology Co., Ltd.). PDF document.
zsepb.zs.gov.cn (date not recorded). Zhongshan PCB plant capacity-expansion project environmental impact report (265 to 500 wan m2/a line-circuit-board expansion), stream S8 spent drill bits. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, underground deposit
Uncertainty: -86.8% / +32.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Dielectric spin-off Solid wasteg

Derivation basis: Dielectric dispense and waste rate

No source is attached to this row.
Source citations: Not stated
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of inert waste, sanitary landfill
Uncertainty: No range defined.
Unit: g

Photoresist solids in NMP strip bath Solid wasteg · -33.4% / +66.6%

Source citations: microsi.com (date not recorded). Flack, W.W., Nguyen, H.-A. (Ultratech), Capsuto, E. (Shin-Etsu MicroSi), Abreau, K. (STEAG Hamatech USA), "Characterization of 100 Micron Thick Positive Photoresist on 300 mm Wafers", SPIE 2005 #5753-103. PDF document.
nrf.aux.eng.ufl.edu (date not recorded). AZ 9260 PHOTORESIST (520CPS) (US) Material Safety Data Sheet, substance key SXR109902, revision date 03/03/2010. PDF document.
rcrapublic.epa.gov (date not recorded). US EPA RCRA Online RO 11249, memorandum 9444.1987(18), letter to Mr. Frank Czigler, S & W Waste Inc., dated MAY 20 1987. PDF document.
Background data: ecoinvent 3.12 treatment route
Background dataset: treatment of hazardous waste, hazardous waste incineration, with energy recovery
Uncertainty: -33.4% / +66.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Copper in wastewater-treatment sludge/recovery Solid wasteg · -2.5% / +0.5%

Source citations (dataset-level): epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
Background data: ecoinvent 3.12 treatment route
Background dataset: market for copper scrap, sorted, pressed
Uncertainty: -2.5% / +0.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Emissions to air

6 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

C₄F₈ Emission to airg

Derivation basis: Calculated from input and typical abatement

The sources below are this dataset's own bibliography. They are not tied to this row.
Source citations (dataset-level): Inherited from this dataset's own bibliography, not tied to this row:

Plasma etching of high aspect ratio features in SiO2 using Ar/C4F8/O2 mixtures: A computational investigation JVA 2019

Extreme low-k porous pSiCOH dielectrics. JVB 2017

IPCC 2019 Guidelines Vol 3 Ch 6

EPA 40 CFR Part 98 Subpart I (2024)
Compartment: Air (non-urban air or from high stacks)
CAS number: 115-25-3
ecoinvent 3.12 elementary flow: Tetrafluoromethane
Notes: Proxied to CF4 (Tetrafluoromethane) for ecoinvent linking. The two substances are not equivalent: this one has the substantially greater warming effect of the pair, so any characterization performed through this proxy link understates it. Use the substance's own factor rather than the proxy's.
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

NH₃ Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
CAS number: 7664-41-7
ecoinvent 3.12 elementary flow: Ammonia
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

VOCs (from resist/dielectric) Emission to airg

Derivation basis: Engineering estimate based on material usage

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: No range defined.
Unit: g

Flux volatiles Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: No range defined.
Unit: g

VOCs (from underfill cure) Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: No range defined.
Unit: g

VOCs Emission to airg

Derivation basis: Calculated as an air release, from a mass balance on the process gases going in, with the destruction or removal efficiency of any point-of-use abatement applied.

No source is attached to this row.
Source citations: Not stated
Compartment: Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow: NMVOC, non-methane volatile organic compounds
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Emissions to water

4 elementary flows released to water by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Cu2+ Emission to waterg

Source citations: epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
Compartment: Water (surface water)
Formula: Cu
CAS number: 7440-50-8
ecoinvent 3.12 elementary flow: Copper ion
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Sn2+ Emission to waterg

Source citations: p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Drag-Out Reduction (2000). Report.
p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Rinse Water Reduction (2000). Report.
Park et al. - Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn-Ag alloy solders for flip-chip interconnections, RSC Advances, 2017
Compartment: Water (surface water)
Formula: Sn
CAS number: 7440-31-5
ecoinvent 3.12 elementary flow: Tin ion
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Ammonium Emission to waterg

Source citations: p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Drag-Out Reduction (2000). Report.
p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Rinse Water Reduction (2000). Report.
Park et al. - Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn-Ag alloy solders for flip-chip interconnections, RSC Advances, 2017
Compartment: Water (surface water)
Formula: NH4+
CAS number: 14798-03-9
ecoinvent 3.12 elementary flow: Ammonium
Notes: TMAH biodegrades in WWTP; NH4+ mass fraction 18.04/91.15
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Dissolved organics (COD) Emission to waterg

Source citations: p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Drag-Out Reduction (2000). Report.
p2infohouse.org (date not recorded). Florida Pollution Prevention Program - Electroplating Tip Sheet: Rinse Water Reduction (2000). Report.
Park et al. - Effects of the degradation of methane sulfonic acid electrolyte on the collapse failure of Sn-Ag alloy solders for flip-chip interconnections, RSC Advances, 2017
Compartment: Water (surface water)
ecoinvent 3.12 elementary flow: COD, Chemical Oxygen Demand
Uncertainty: A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit: g

Flows not quantified

2 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.

Cut off - below the significance threshold (2)

Seed Etchant (Cu/Ti) Process chemicalg · -40% / +60%

Derivation basis: Etching parameters

No source is attached to this row.
Source citations: Not stated
Background data: cut off
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: Seed-layer removal is a wet-bench step using phosphoric acid for tantalum-based seed layers, or sulfuric acid with hydrogen peroxide for copper. Those acids are already tracked in this inventory's wet chemistry, and the additional consumption for seed removal alone is minimal, so no separate upstream production dataset is attached.
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

SnAg plating bath (MSA-based) Process chemicalg · -40% / +60%

Derivation basis: Solder plating bath

No source is attached to this row.
Source citations: Not stated
Background data: cut off
Background dataset: Not applicable: this flow is not quantified in the inventory.
Reason: The tin-silver plating bath is consumed in trace quantity and its formulation is complex, recorded in this inventory. This row covers the bath chemistry alone; the tin and silver the bath deposits onto the package are not carried on it. Where this dataset lists no separate deposited-solder material row, the deposited tin and silver are absent from the dataset altogether rather than accounted for elsewhere, and whether they belong inside this boundary is an open question this record does not settle. The bath chemistry falls below the declared cut-off threshold, so no upstream production dataset is attached.
Uncertainty: -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit: g

Limitations and unquantified flows (4)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

From the dataset description

The fate of the copper removed at the back-end metal-layer polishing step is unresolved in this inventory. No route is asserted for it, so no row here identifies that copper leaving in the wastewater or in the polishing residue. The copper rows this dataset publishes come from the package's copper wastewater balance at the facility outfall and do not cover the metal-layer step.

General

The uncertainty range on this dataset's abated fluorinated-gas emissions to air is the range of the incoming gas, carried through in proportion. It does not widen for how much of the gas is consumed in the reaction, or for how completely the abatement destroys what is left; both of those are held at their central values on this dataset. Wafer datasets do carry those two through into the range, so the range published here is narrower than the one a wafer dataset publishes for the same kind of emission.
These materials are used at a step of the modelled flow and are also carried by this dataset's own material list. Each is counted once, on that list, and the step does not book it again: Bridge wafer fab uses Cu sputtering target and Cu electroplating anode; ABF buildup and fine line patterning uses Cu sputtering target and Cu electroplating anode; Die bumping uses Copper (anode or replenishment).
Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase: Product operation is outside the cradle-to-gate scope.
End-of-life treatment: Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail: The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials: Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers: Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication: A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead: Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods: Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits: Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim: Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing: Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages: Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
Volatile organics (photoresist solvents, PGMEA) - air quality
Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol