Overview
- Technology
- Discrete Semiconductor, Cylindrical SMD
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Component vendor specifications, academic papers, industry literature
- Coverage status
- Partial
- Pedigree-scored source files
- 2 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
6 flows. Quantities are not published; they ship with the dataset on Circa.
Electricity, Taiwan (TW) ElectricitykWh · ±20%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations, plus facility support such as cleanroom HVAC, ultrapure water, cooling, gas abatement, and bulk gases.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Vishay MELF diode application notes
- JEDEC DO-213 (MELF package standard)
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, high voltage
- Uncertainty
- ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Fresh water WaterL
- Derivation basis
-
- Stated by the manufacturing model as the water its own assembly line uses: rinsing after the terminations are plated, and cleaning the finished parts. It is an allowance per finished piece rather than a sum over individual operations, and because this device buys no wafer there is no fabrication water carried anywhere else in this dataset.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- tap water
- Notes
- Process and cleaning water
- Uncertainty
- No range defined.
- Unit
- L
Glass Body Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Vishay MELF diode application notes
- JEDEC DO-213 (MELF package standard)
- Background data
- proxy-mapped
- Background dataset
- flat glass, uncoated
- Uncertainty
- No range defined.
- Unit
- g
Copper Caps Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Vishay MELF diode application notes
- JEDEC DO-213 (MELF package standard)
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- No range defined.
- Unit
- g
Tin Plating Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Vishay MELF diode application notes
- JEDEC DO-213 (MELF package standard)
- Background data
- ecoinvent 3.12
- Background dataset
- tin
- Uncertainty
- No range defined.
- Unit
- g
Silver Frit Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Vishay MELF diode application notes
- JEDEC DO-213 (MELF package standard)
- Background data
- ecoinvent 3.12
- Background dataset
- silver
- Uncertainty
- No range defined.
- Unit
- g
Outputs and waste
Glass Scrap Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Cap Rejects Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
1 flow is recorded for this dataset but carries no quantity — cut off below the significance threshold, or with no background dataset available. It remains inside the declared system boundary; each is listed with its reason.
Cut off - below the significance threshold (1)
Silicon Die Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Vishay MELF diode application notes
- JEDEC DO-213 (MELF package standard)
- Background data
- cut off
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- The silicon die enters this dataset as an externally fabricated input: die fabrication is outside this dataset's declared scope and no upstream wafer dataset is linked. The die mass is recorded for transparency.
- Uncertainty
- No range defined.
- Unit
- g
Limitations and unquantified flows (1)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- The 'Package Mass' row carries the moulded body, lead frame and die-attach as one unmapped mass. Its constituent materials are not itemised and it is not linked to a background dataset.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Metal Electrode Leadless Face (MELF) package diodes. Cylindrical glass body with metal end caps. Superior stability due to hermetic glass sealing. Available in standard MELF (DO-213AB) and mini-MELF/mMELF (DO-213AA). Used for signal switching, rectification, and protection circuits.