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Overview

General comment

High power surface mount transistor package. Larger version of DPAK for higher power dissipation. Common for automotive power stages, high-current MOSFETs, and power regulators. Large exposed thermal pad enables good PCB heatsinking.

Technology
Standard manufacturing process
Geography
Global average data from equipment vendor specifications and industry literature

System boundary

System boundary - Transistor D2PAKSystem boundary figure: identity, gate in, entering flows, the dashed system boundary and the unit processes inside it, the reference product, emissions and waste, and below it the flows that are recorded but not quantified. No inventory quantities.Transistor D2PAKGATE INRaw materials and sub-componentsENTERING FLOWSElectricityWaterProcess gasesProcess chemicalsMaterialsFreight transportOtherSYSTEM BOUNDARYMODELLED UNIT PROCESSES, BY CLASSAssemblyWafer backgrindDie attach placementSolder reflow die attachWire bondingTransfer moldingPackage singulationOtherPackage nitrogen supply energyREFERENCE PRODUCTTransistor D2PAKAssembled and tested componentEMISSIONS AND WASTEEmissions to airEmissions to waterWaste routesRECORDED BUT NOT QUANTIFIEDIn scope, left out of the quantified inventoryCut off below the significance threshold, or with no background dataset available - each is listed with its reason2FLOWSsystem boundaryreference flowentering flowemission / waste

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 1.9 Very good
Reliability
3.3
Completeness
2.4
Temporal
1.3
Geographic
2.0
Technological
1.4

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure
Component vendor specifications, academic papers, industry literature
Coverage status
Partial
Pedigree-scored source files
7 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

12 flows. Quantities are not published; they ship with the dataset on Circa.

200mm Power MOSFET/IGBT REEL datasetwafer
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Yield-adjusted wafer fraction; carries the suppressed wafer-fab elementary flows
Uncertainty
No range defined.
Unit
wafer
Water supply (municipal) Waterm3 · -20.7% / +20.9%
Derivation basis
  • This quantity is the sum of two terms: the package-assembly share of the model aggregated demand, and the wafer dicing the model records as component-owned, which no other dataset referenced by this dataset carries. Where the two terms were authored in different volume units, the dicing term was converted to the unit already in use on this row before they were added.

The sources for this row are listed below.

Source citations
  • Disco Corporation DFD6361 dicing saw specifications (blade-dicing cutting-water flow rate)
Upstream REEL dataset
Water Supply (Municipal)
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Net fresh-water intake, supplied as municipal water; package-level only; wafer-fab water carried by the wafer reference. The uncertainty range is the pre-split range scaled by the same package share, not a range derived for the package step on its own. The package share is stated net of wafer fabrication, which the wafer reference carries; the component-owned dicing term is additional to it and is not part of that share, so the qualifier above applies to the package term alone.
Uncertainty
-20.7% / +20.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
m3
Wafer transport, DE fab to packaging site - Air (long haul) Freight transporttkm · -47.4% / +80%
Derivation basis
  • Specified for this manufacturing operation and scaled to the dataset's functional unit.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12
Background dataset
transport, freight, aircraft, dedicated freight, long haul
Notes
Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from European specialty or power fab to its Asian packaging site, intercontinental. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable wafer shipping box for this wafer diameter and its secondary carton. The factor for this diameter is derived from two published container masses, one of which is taken from an online marketplace listing rather than a manufacturer datasheet; that lighter figure pulls the factor down, so the value used is the lower of the two readings available rather than the cautious one, and the box it describes is not the front-opening shipping box used at the larger wafer diameter; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Air freight is allocated on chargeable weight rather than actual shipped mass. The authored band holds the fixed route distance: its lower endpoint uses actual shipped mass, its central uses chargeable-weight allocation, and its upper endpoint adds the separate reusable-carrier return service, not aircraft backhaul. The route distance is a declared proxy: the route evidence carries two independent European fab to back-end air lanes of essentially the same length, but both end at a Southeast Asian back end rather than at the site this dataset declares, so that European long-haul class stands in for a lane no public source states end to end.
Uncertainty
-47.4% / +80% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
tkm — tonne-kilometres, a transport effort rather than a mass
Electricity, Taiwan (TW) ElectricitykWh · -19% / +28.9%
Derivation basis
  • Calculated from equipment energy across all manufacturing operations, plus facility support such as cleanroom HVAC, ultrapure water, cooling, gas abatement, and bulk gases.
  • This quantity is the sum of two terms: the package-assembly share of the model aggregated demand, and the wafer dicing the model records as component-owned, which no other dataset referenced by this dataset carries.
  • Package reflow nitrogen generation and delivery are represented by electricity. The direct process volume remains an on-site product under cutoff accounting.

The sources below are this row's own, and those of the manufacturing operations behind it.

Source citations
  • Disco Corporation DFD6361 dicing saw specifications (blade-dicing process power and wafer throughput)
Sources (inherited)
Inherited, rolled up from the contributing process steps:
Background data
ecoinvent 3.12
Background dataset
electricity, high voltage
Notes
package-level only; wafer-fab electricity carried by the wafer reference. The uncertainty range is the pre-split range scaled by the same package share, not a range derived for the package step on its own. The package share is stated net of wafer fabrication, which the wafer reference carries; the component-owned dicing term is additional to it and is not part of that share, so the qualifier above applies to the package term alone.
Uncertainty
-19% / +28.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kWh
Compressed air Process gasg · -30.1% / +39.8%
Source citations
  • CAE Online: Teradyne Catalyst Specifications
  • EE Journal: "Advantest Unveils New Ultra-High-Current Power Supply" (2024)
  • 4Semi: TEL Precio Wafer Prober Specifications
  • FormFactor Summit 11000/12000 Facility Planning Guide
  • 3D InCites: "ERS Electronic Introduces High Power Dissipation Thermal Chuck" (2023)
  • Abachy: "How Much Energy and Water Are Required for Wafer Fabrication" (2025)
Background data
ecoinvent 3.12
Background dataset
compressed air, 700 kPa gauge
Notes
package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
Uncertainty
-30.1% / +39.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Solder flux (low-residue / no-clean) Process chemicalg · -66.7% / +166.6%
Background data
ecoinvent 3.12
Background dataset
flux, for wave soldering
Uncertainty
-66.7% / +166.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Leadframe Cu Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
ecoinvent 3.12
Background dataset
copper, cathode
Uncertainty
No range defined.
Unit
g
Mold Compound Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
ecoinvent 3.12
Background dataset
epoxy resin insulator, SiO2
Uncertainty
No range defined.
Unit
g
Al Wire Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
proxy-mapped
Background dataset
aluminium, cast alloy
Uncertainty
No range defined.
Unit
g
Tin Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
ecoinvent 3.12
Background dataset
tin
Notes
From Solder (96.5% tin)
Uncertainty
No range defined.
Unit
g
Silver Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
ecoinvent 3.12
Background dataset
silver
Notes
From Solder (3.0% silver)
Uncertainty
No range defined.
Unit
g
Copper, cathode Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
ecoinvent 3.12
Background dataset
copper, cathode
Notes
From Solder (0.5% copper)
Uncertainty
No range defined.
Unit
g

Outputs and waste

Silicon Kerf Solid wasteg
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.

Source citations (dataset-level)
Inherited from this dataset's own bibliography, not tied to this row:
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Strano 2025 (Lubricant 0.8-5 g/m²)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of inert waste, sanitary landfill
Uncertainty
No range defined.
Unit
g
Mixed process waste Solid wasteg · ±0.9%
Source citations
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of inert waste, sanitary landfill
Uncertainty
±0.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Dicing slurry (Si/EMC/Cu particles) Solid wasteg
Derivation basis
  • No retrievable public document identified

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of hazardous waste, underground deposit
Uncertainty
No range defined.
Unit
g

Emissions to air

1 elementary flow released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Flux volatiles Emission to airg
Compartment
Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow
NMVOC, non-methane volatile organic compounds
Uncertainty
A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit
g

Emissions to water

1 elementary flow released to water by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

Si Emission to waterg
Source citations
Compartment
Water (surface water)
CAS number
7440-21-3
ecoinvent 3.12 elementary flow
Silicon
Uncertainty
A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit
g

Flows not quantified

2 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.

Cut off - below the significance threshold (2)

N2 Process gasg · -25.6% / +44.3%
Derivation basis
  • Engineering estimate; the solder-reflow evidence supports the nitrogen atmosphere requirement, while direct public per-package consumption is an open data gap

The sources for this row are listed below.

Source citations
Background data
cut off
Background dataset
Not applicable: this flow is not quantified in the inventory.
Notes
package-level remainder; wafer-allocated share carried by the wafer reference. The uncertainty range is the pre-subtraction range scaled by the remaining share, not a range derived for the remainder on its own
Reason
Reflow nitrogen remains visible as direct process inventory. Its generation and delivery are represented by electricity, so a purchased-liquid market link would duplicate the upstream supply burden.
Uncertainty
-25.6% / +44.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Silicon Die Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
Background data
cut off
Background dataset
Not applicable: this flow is not quantified in the inventory.
Reason
This die or wafer input is carried as a reference to its own upstream dataset elsewhere in this inventory. This mass-tracking row is excluded from upstream linkage so the same input is not counted twice.
Uncertainty
No range defined.
Unit
g

Process steps deferred in this release (1)

Steps of this dataset's process flow that are declared but carry no quantified inventory in this release. Each is listed with its reason.

Test (utility only)
Test: the electricity this step draws is included in this dataset, from a figure pinned on the step itself. Everything else the step consumes or releases is deferred pending public data.

Limitations and unquantified flows (3)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

  • The number of wire bonds in this package is an engineering estimate. No published count was found for this package class, so it is taken from the heavy aluminium wedge-bond geometry a larger power package in this database declares, applied to the bond-wire mass this product declares. The bonder electricity and its nitrogen cover gas follow that estimate and move with it, and the reliability this dataset publishes is held to the estimate tier on account of the count. The forming gas the same operation uses is not itemised separately here: what is left of it once the wafer purchase is credited with the share it already carries falls below the size at which this dataset reports a trace gas.
  • For these process steps the modelled flow includes the electricity they draw and nothing else; their materials, their consumables and any release they make are not modelled and are deferred pending public data: Test.
  • Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase
Product operation is outside the cradle-to-gate scope.
End-of-life treatment
Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail
The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials
Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers
Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication
A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead
Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods
Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits
Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim
Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing
Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages
Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

  • Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
  • Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
  • Volatile organics (photoresist solvents, PGMEA) - air quality
  • Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
  • Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol