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Overview

General comment

DC-SCM (Data Center Secure Control Module) for MGX compute trays. Implements baseboard management controller (BMC) functionality for server management, monitoring, and out-of-band control. Compact vertical-mount design for 1 RU servers using SFF-TA-1002 interface.

Technology
Electronics Infrastructure, Management Controller
Geography
Global average data from equipment vendor specifications and industry literature

System boundary

System boundary - MGX DC SCMSystem boundary figure: identity, gate in, entering flows, the dashed system boundary and the unit processes inside it, the reference product, emissions and waste, and below it the flows that are recorded but not quantified. No inventory quantities.MGX DC SCMGATE INRaw materials and sub-componentsENTERING FLOWSMaterialsOtherSYSTEM BOUNDARYCOMPOSED OF OTHER REEL DATASETS4-layer FR-4 PCB(85.5x34mm)4-Layer FR4 PCB, ENIG finishBMC System-on-Chip (ASPEEDAST2600 or similar)MCU, QFN, 28nmeMMC flash storage (8GB)NAND Flash IC 512Gb, FBGA, 176LDecoupling and bypassMLCCsMLCC X7RPull-up/termination chipresistorsChip ResistorFerrite beads for powerfilteringFerrite BeadSFF-TA-1002 board-to-boardconnectorMezzanine High SpeedREFERENCE PRODUCTMGX DC SCMAssembled and tested componentEMISSIONS AND WASTEEmissions to airEmissions to waterWaste routesRECORDED BUT NOT QUANTIFIEDExclusions not yet characterisedNo exclusion record was found for this datasetNOT CHARACTERISEDsystem boundaryreference flowentering flowemission / waste

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 2.1 Good
Reliability
3.0
Completeness
1.9
Temporal
1.8
Geographic
2.0
Technological
2.3
How the score is calculated: Constituent datasets have more influence when they contribute a larger share of the modelled cradle-to-gate energy demand.

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure
Architecture specifications, engineering estimates, vendor datasheets
Coverage status
Composed from linked REEL datasets
Pedigree-scored source files
79 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

8 flows. Quantities are not published; they ship with the dataset on Circa.

4-layer FR-4 PCB (85.5x34mm) REEL datasetm2
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
4-Layer FR4 PCB, ENIG finish
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
m2
BMC System-on-Chip (ASPEED AST2600 or similar) REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
MCU, QFN, 28nm
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
eMMC flash storage (8GB) REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
NAND Flash IC 512Gb, FBGA, 176L
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Decoupling and bypass MLCCs REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
MLCC X7R
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Pull-up/termination chip resistors REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
Chip Resistor
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Ferrite beads for power filtering REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
Ferrite Bead
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
SFF-TA-1002 board-to-board connector REEL datasetunit
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
Mezzanine High Speed
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for assembly yield.
Uncertainty
No range defined.
Unit
unit
Steel, low-alloyed, hot rolled Materialkg · -9.9% / +14.9%
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.
  • REEL derivation: dimensions measured from the vendor mechanical drawings and product images cited alongside; mass computed from the measured geometry and the material density

The sources for this row are listed below.

Source citations (dataset-level)
  • MGX Accelerated Computing Rack and Trays Specification 1.1
Background data
ecoinvent 3.12
Background dataset
steel, low-alloyed, hot rolled
Notes
Purchased input grossed to fund the authored process loss booked as Bracket Steel Blanking (mass-closure funding; the retained mass is the product-side figure).
Uncertainty
-9.9% / +14.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kg

Outputs and waste

Bracket Steel Blanking Solid wastekg · -40% / +60%
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12 treatment route
Background dataset
market for iron scrap, sorted, pressed
Uncertainty
-40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kg
Rejected Assemblies Solid wastekg · -50% / +100%
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of inert waste, sanitary landfill
Uncertainty
-50% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kg

Emissions to air

No emissions to air are recorded at this level.

Emissions to water

No emissions to water are recorded at this level.

Flows not quantified

No flows are recorded for this dataset without a quantity.

Limitations and unquantified flows (1)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

  • About two thirds of the declared module mass has no material row in this inventory. The printed circuit board, the baseboard-management controller, the flash device, the passive components and the mezzanine connector are included; the remaining board-level parts, shielding and hardware are not.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase
Product operation is outside the cradle-to-gate scope.
End-of-life treatment
Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail
The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials
Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers
Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication
A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead
Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods
Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits
Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim
Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing
Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages
Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

  • Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
  • Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
  • Volatile organics (photoresist solvents, PGMEA) - air quality
  • Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
  • Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol