Overview
- Technology
- Memory Module, Server Memory (Multiplexed Rank)
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Component vendor specifications, academic papers, industry literature
- Coverage status
- Composed from linked REEL datasets
- Pedigree-scored source files
- 64 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
9 flows. Quantities are not published; they ship with the dataset on Circa.
DRAM ICs REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 1-beta DRAM wafer, 300mm, moderate scenario
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Wafer demand calculated from die count, rectangular wafer packing, die yield and assembly yield. Wafer manufacturing yield is already included upstream.
- Uncertainty
- No range defined.
- Unit
- wafer
FBGA Packages REEL datasetpackage
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Wire Bond Fine-pitch Ball Grid Array package
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- package
Registering Clock Driver MRCD REEL datasetunit
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- DDR5 MRCD, QFN, 28nm
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- unit
Data Buffers MDB REEL datasetunit
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- DDR5 MDB, QFN, 28nm
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- unit
Printed Circuit Board REEL datasetm2
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 16-Layer Server PCB, ENIG finish
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- m2
Gold Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- JEDEC JESD82-552 (MDB) + MRDIMM Gen1/Gen2 (Micron/SK Hynix/Samsung)
- Background data
- ecoinvent 3.12
- Background dataset
- gold
- Uncertainty
- No range defined.
- Unit
- kg
Polyethylene terephthalate Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- JEDEC JESD82-552 (MDB) + MRDIMM Gen1/Gen2 (Micron/SK Hynix/Samsung)
- Background data
- ecoinvent 3.12
- Background dataset
- polyethylene terephthalate, granulate, amorphous
- Uncertainty
- No range defined.
- Unit
- kg
Wafer transport, KR fab to packaging site - Road Freight transporttkm · -100% / +172%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Additional Investment in Onyang Campus... Expanding Back-End Processing Too (Seoul Economic Daily)
- The Elec report, 2026-07: Samsung back-end investment focused on high-bandwidth memory
- DigiTimes report, 2024-11-13: Samsung Cheonan and Onyang back-end hubs
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, lorry, unspecified
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from memory fab to domestic back end. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses the route-class distance envelope, and its upper endpoint also adds the separate reusable-carrier return service.
- Uncertainty
- -100% / +172% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Electricity, Global (GLO) ElectricitykWh · -21.9% / +31%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- JEDEC JESD82-552 (MDB) + MRDIMM Gen1/Gen2 (Micron/SK Hynix/Samsung)
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Uncertainty
- -21.9% / +31% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Outputs and waste
No output flows are recorded at this level.
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
No flows are recorded for this dataset without a quantity.
Limitations and unquantified flows (3)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
From the dataset description
- DIE AREA IS NOT VENDOR-MATCHED. The 32 Gb dies this module carries are modelled at 64 mm², a figure derived from an earlier 16 Gb die area that has since been re-based. The two measured 1b-generation densities available put a 32 Gb die about 13 per cent larger than that. No public measurement of a 32 Gb DDR5 die exists to re-base onto, so the value is retained and the direction is disclosed instead: this dataset understates the silicon area of each die, and therefore the wafer share it books.
General
- The passive components identified in the bill of materials are not included in this inventory.
- The mass this dataset declares for the module is the sum of the constituents its own bill enumerates, and it is a lower bound rather than a total. It was restated to that sum because the packaged memory devices and the board alone weighed more than the figure previously declared for the whole module. Three things the module carries are outside it: the registering clock driver and the data buffers are named in the bill with no weight at all, and the module carries more passive parts than the enumerated passive rows account for. The module is therefore heavier than the mass published here.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Complete DDR5 MRDIMM (Multiplexed-Rank DIMM) server module assembly. 128 GB = 2 multiplexed ranks × 16 1β dies. Includes 1 MRCD + 10 MDB companion ASICs, a 16-layer server PCB, and a 288-pin edge connector.