Overview
- Technology
- TO-220
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Equipment vendor specifications, academic papers, industry literature
- Coverage status
- Partial
- Pedigree-scored source files
- 11 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
12 flows. Quantities are not published; they ship with the dataset on Circa.
CF4 production Process gasg · -49.2% / +69.5%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Carbon tetrafluoride (CF4)
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Uncertainty
- -49.2% / +69.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
SF6 production Process gasg · -49% / +53.1%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Sulfur hexafluoride (SF6)
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Uncertainty
- -49% / +53.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Electricity, Taiwan (TW) ElectricitykWh · -56% / +110.6%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations. It also includes the assembly site's facility overhead: air handling and cleanroom conditioning, chilled water, compressed dry air, exhaust and dust collection, wastewater treatment and uninterruptible power.
- REEL derivation: engineering estimate of per-package lead trim and form energy from the press power rating and line throughput; no single published document reports this per-package value
- REEL derivation: engineering estimate of per-package laser-marking energy from the marker system power rating and line throughput; no single published document reports this per-package value
- Package reflow nitrogen generation and delivery are represented by electricity. The direct process volume remains an on-site product under cutoff accounting.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- AAM International (Strip sizes 100x300mm)
- US Patent 5945259A (Etching photoresist thickness)
- US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
- Strano 2025 (Lubricant 0.8-5 g/m²)
- Bruderer BSTA 510 Specs (510kN, 22kW)
- Samhoor Press Specs (200-800 SPM)
- Hu et al. (2019). Analysis of energy efficiency improvement of high-tech fabrication plants. International Journal of Low-Carbon Technologies. DOI: 10.1093/ijlct/ctz041.
- Guste, Marinas & Ong, Machines 12 (2024) 467, Table 3; Besi Datacon 2200 evo product page
- sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Package-on-package (PoP) with Through-mold Vias (2008). Trade press article.
- directindustry.com (date not recorded). DirectIndustry - Kulicke & Soffa IConn (ProCu) PLUS wire bonder listing (1.5 kVA nominal / 2.6 kVA max).
- c2mi.ca (date not recorded). C2MI - IConn ProCu Plus LA equipment listing.
- electronicspecifier.com (date not recorded). electronicspecifier - ASMPT unveils latest wire bonder (Eagle AERO, up to 24 2-mm connections/s), 26 Sep 2022. Trade press article.
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Uncertainty
- -56% / +110.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Compressed air Process gasg · -43.7% / +78.8%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- compressed air, 700 kPa gauge
- Uncertainty
- -43.7% / +78.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Ar Process gasg · -60% / +100%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- argon, liquid
- Uncertainty
- -60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
O2 Process gasg · -60% / +100%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- oxygen, liquid
- Uncertainty
- -60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
H2 Process gasg · -38.3% / +75.9%
- Derivation basis
-
- No retrievable public document identified
The sources for this row are listed below.
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- hydrogen, gaseous, low pressure
- Uncertainty
- -38.3% / +75.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Solder flux (low-residue / no-clean) Process chemicalg · -66.7% / +166.7%
- Source citations
-
- indium.com (date not recorded). Indium Corporation, "Flux Coatings for Solder Preforms" product data sheet, Form No. 97824 (A4) R15 (standard flux coating weight percentage on solder preforms). PDF document.
- Background data
- ecoinvent 3.12
- Background dataset
- flux, for wave soldering
- Uncertainty
- -66.7% / +166.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Cu alloy C19400 (Cu-Fe-P) Materialkg · ±16.7%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- AAM International (Strip sizes 100x300mm)
- US Patent 5945259A (Etching photoresist thickness)
- US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
- Bruderer BSTA 510 Specs (510kN, 22kW)
- Samhoor Press Specs (200-800 SPM)
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- ±16.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
SAC305 or PbSnAg eutectic Materialkg · -33.3% / +66.7%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- AAM International (Strip sizes 100x300mm)
- US Patent 5945259A (Etching photoresist thickness)
- US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
- Bruderer BSTA 510 Specs (510kN, 22kW)
- Samhoor Press Specs (200-800 SPM)
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Background data
- composite
- Background dataset
- Modelled as a composite of its constituent materials.
- Uncertainty
- -33.3% / +66.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Al (5N pure or Al-0.5%Mg) Materialkg · -16.7% / +25%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- AAM International (Strip sizes 100x300mm)
- US Patent 5945259A (Etching photoresist thickness)
- US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
- Bruderer BSTA 510 Specs (510kN, 22kW)
- Samhoor Press Specs (200-800 SPM)
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Background data
- proxy-mapped
- Background dataset
- aluminium, cast alloy
- Uncertainty
- -16.7% / +25% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Epoxy Mold Compound (EMC) Materialkg · ±16.7%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- AAM International (Strip sizes 100x300mm)
- US Patent 5945259A (Etching photoresist thickness)
- US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
- Bruderer BSTA 510 Specs (510kN, 22kW)
- Samhoor Press Specs (200-800 SPM)
- ASM Pacific Technology. IDEALmold Specifications
- Disco Corporation. DFL7161 Laser Saw Specifications
- Background data
- ecoinvent 3.12
- Background dataset
- epoxy resin insulator, SiO2
- Uncertainty
- ±16.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Outputs and waste
Lead scrap (Cu alloy) Solid wasteg · -60% / +100%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Uncertainty
- -60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Emissions to air
2 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.
Flux volatiles Emission to airg
- Source citations
-
- indium.com (date not recorded). Indium Corporation, "TACFlux for Board Assembly and Rework" product data sheet, Form No. 97776 R15 (reflow residue percentage by grade for no-clean tacky fluxes). PDF document.
- circuitinsight.com (date not recorded). Diepstraten, G. (Vitronics Soltec B.V.), How to Manage Material Outgassing in Reflow Oven, SMTA Proceedings (circuitinsight mirror). Symposium paper.
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- NMVOC, non-methane volatile organic compounds
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Particulates (marking fume) Emission to airg
- Derivation basis
-
- Estimated from mold compound ablation
No source is attached to this row.
- Source citations
- Not stated
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- Particulate Matter, < 2.5 um
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
1 flow is recorded for this dataset but carries no quantity — cut off below the significance threshold, or with no background dataset available. It remains inside the declared system boundary; each is listed with its reason.
Cut off - below the significance threshold (1)
N2 Process gasg · -75% / +129.9%
- Derivation basis
-
- Engineering estimate; the solder-reflow evidence supports the nitrogen atmosphere requirement, while direct public per-package consumption is an open data gap
The sources for this row are listed below.
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- cut off
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- Reflow nitrogen remains visible as direct process inventory. Its generation and delivery are represented by electricity, so a purchased-liquid market link would duplicate the upstream supply burden.
- Uncertainty
- -75% / +129.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Limitations and unquantified flows (2)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- Where the process record behind a step offers a choice of material, the modelled flow takes the one this dataset's own material list carries, and the entries it does not select are not added: Thick Al wire bonding (wedge) takes aluminium wire from that list, not Gold wire (Au) or Copper wire (Cu).
- Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Production covered
Through-hole power package: the die is soldered to a copper leadframe with a heatsink tab, wedge-bonded with thick aluminum wire, and transfer-molded with three radial leads. Functional unit is one package STARTED: the reference flow is a single package entering assembly, and the activities listed run through completed assembly and final test of that package.
Modelling choices
By the count-once yield-ownership convention, the gross-up from packages started to good packages is carried by the consuming IC or component dataset, not here.