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Overview

General comment

Production covered

Stacked low-power DRAM component: four dies stacked in one package, the quad-die configuration, a wire-bonded fine-pitch ball-grid array.

Modelling choices

The wafer demand, the die count, the packaging yield and the scrapped-package mass on this dataset are all its own, derived from that stack height.

Technology
1β LPDDR5X DRAM stacked, QDP WB-FBGA
Geography
Global average data from equipment vendor specifications, academic papers, and assembly industry data

System boundary

System boundary - LPDDR5X DRAM IC 8GB – QDP WB-FBGA (4×16Gb, 1β)System boundary figure: identity, gate in, entering flows, the dashed system boundary and the unit processes inside it, the reference product, emissions and waste, and below it the flows that are recorded but not quantified. No inventory quantities.LPDDR5X DRAM IC 8GB – QDP WB-FBGA (4×16Gb, 1β)GATE INRaw materials and sub-componentsENTERING FLOWSElectricityWaterFreight transportOtherSYSTEM BOUNDARYCOMPOSED OF OTHER REEL DATASETS1β DRAM (12-14nmhalf-pitch)1-beta DRAM wafer, 300mm, moderatescenarioWB-FBGA-StackWire Bond Fine-pitch BGA withVertically Stacked Dies packageDirect inputs at this level are only what this assembly stage itself adds.The referenced wafer and packaging datasets above carry their own material and energy inputs.REFERENCE PRODUCTLPDDR5X DRAM IC 8GB – QDP WB-FBGA(4×16Gb, 1β)Component-level testingEMISSIONS AND WASTEEmissions to airEmissions to waterWaste routesRECORDED BUT NOT QUANTIFIEDExclusions not yet characterisedNo exclusion record was found for this datasetNOT CHARACTERISEDsystem boundaryreference flowentering flowemission / waste

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 2.2 Good
Reliability
3.0
Completeness
2.1
Temporal
2.0
Geographic
2.0
Technological
2.4
How the score is calculated: Constituent datasets have more influence when they contribute a larger share of the modelled cradle-to-gate energy demand.

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure
Equipment vendor specifications, academic papers, HBM/DRAM industry literature
Coverage status
Composed from linked REEL datasets
Pedigree-scored source files
46 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

5 flows. Quantities are not published; they ship with the dataset on Circa.

1β DRAM (12-14nm half-pitch) REEL datasetwafer
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Yield-adjusted wafer fraction
Uncertainty
No range defined.
Unit
wafer
WB-FBGA-Stack REEL datasetpackage
Derivation basis
  • Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.

No source is attached to this row.

Source citations
Not stated
Background dataset
Modelled by REEL; see the upstream dataset above.
Notes
Adjusted for packaging yield.
Uncertainty
No range defined.
Unit
package
Wafer transport, KR fab to packaging site - Road Freight transporttkm · -100% / +172%
Derivation basis
  • Specified for this manufacturing operation and scaled to the dataset's functional unit.

The sources below come from the manufacturing operations behind this row.

Sources (inherited)
Inherited, rolled up from the contributing process steps:
  • Additional Investment in Onyang Campus... Expanding Back-End Processing Too (Seoul Economic Daily)
  • The Elec report, 2026-07: Samsung back-end investment focused on high-bandwidth memory
  • DigiTimes report, 2024-11-13: Samsung Cheonan and Onyang back-end hubs
Background data
ecoinvent 3.12
Background dataset
transport, freight, lorry, unspecified
Notes
Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from memory fab to domestic back end. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses the route-class distance envelope, and its upper endpoint also adds the separate reusable-carrier return service.
Uncertainty
-100% / +172% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
tkm — tonne-kilometres, a transport effort rather than a mass
Electricity, South Korea (KR) ElectricitykWh · ±25%
Derivation basis
  • Single blade wafer-dicing step, allocated to this die from the wafer-level inventory by die area and wafer diameter, grossed up for the packaging yield loss and multiplied by die count. Owned at the IC level because the packaging leaf removed its die-preparation step and the wafer dataset books no singulation. Not an aggregate and carries no facility support.

The sources for this row are listed below.

Source citations
  • Disco Corporation DFD6361 dicing saw specifications (blade-dicing process power and wafer throughput)
Background data
ecoinvent 3.12
Background dataset
electricity, high voltage
Notes
Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
Uncertainty
±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kWh
Water supply (municipal) WaterL · ±23.1%
Derivation basis
  • Cutting water for the single blade wafer-dicing step above, on the same per-die allocation. Not an aggregate of process-step water demand.

The sources for this row are listed below.

Source citations
  • Disco Corporation DFD6361 dicing saw specifications (blade-dicing cutting-water flow rate)
Background data
ecoinvent 3.12
Background dataset
tap water
Notes
Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
Uncertainty
±23.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
L

Outputs and waste

Failed packages (assembly reject) Solid wasteg · -21.5% / +45%
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

The sources below are this dataset's own bibliography. They are not tied to this row.

Source citations (dataset-level)
Inherited from this dataset's own bibliography, not tied to this row:
  • Micron Y42M LPDDR5X QDP datasheet
  • Samsung K3KL LPDDR5X QDP
  • IEEE ECTC 2018 wire-bond stacking yield model
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of waste electric and electronic equipment, shredding
Uncertainty
-21.5% / +45% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Silicon Kerf Solid wasteg · ±25%
Source citations
  • Semiconductor Digest, reported blade-dicing kerf width
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of inert waste, sanitary landfill
Notes
Wafer dicing (blade), allocated to this die. Owned at the IC level: the packaging leaf removed its die-preparation step and the wafer dataset books no singulation, so this dataset is where the cut is counted. Already inside the wafer-stage total this dataset reports; published as its own row because no technosphere reference in this dataset carries it.
Uncertainty
±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g

Emissions to air

No emissions to air are recorded at this level.

Emissions to water

No emissions to water are recorded at this level.

Flows not quantified

No flows are recorded for this dataset without a quantity.

Limitations and unquantified flows (2)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

From the dataset description

  • PACKAGE LEGS: the packaging inventory it consumes is the eight-die reference stack, not a four-die one. The die attach and the wire bonding inside that inventory repeat once per die at the reference height, so this product carries more of both than it should; the moulding, ball attach, singulation, marking and test happen once per package and are unaffected. Publishing a packaging inventory per stack height is a change to what this database ships rather than to a number inside it, and is deferred.

General

  • The packaging inventory this dataset consumes is the reference eight-die stack, not a four-die one. Die attach and wire bonding repeat once per die and are the larger part of that inventory's electricity, so a stack shorter than the reference carries more packaging burden than it should and a taller one carries less; the moulding, ball attach, singulation, marking and test operations happen once per package and are unaffected. The die silicon, the die-attach film, the bond wire and the assembly reject DO follow this dataset's own declared stack height. Resolving the rest means publishing a packaging dataset per stack height, which is a change to what this database ships rather than to a number inside it, and it is disclosed here instead.

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase
Product operation is outside the cradle-to-gate scope.
End-of-life treatment
Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail
The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials
Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers
Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication
A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead
Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods
Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits
Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim
Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing
Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages
Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

  • Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
  • Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
  • Volatile organics (photoresist solvents, PGMEA) - air quality
  • Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
  • Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol