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Overview

General comment

Small Outline Diode (SOD) packages for signal and small power diodes. Plastic molded body with flat leads. Industry standard for high-volume signal diodes, ESD protection, and small rectifiers. Available in multiple sizes from ultra-small SOD523 to standard SOD123.

Technology
Discrete Semiconductor, Plastic SMD
Geography
Global average data from equipment vendor specifications and industry literature

System boundary

System boundary - Diode SODSystem boundary figure: identity, gate in, entering flows, the dashed system boundary and the unit processes inside it, the reference product, emissions and waste, and below it the flows that are recorded but not quantified. No inventory quantities.Diode SODGATE INRaw materials and sub-componentsENTERING FLOWSElectricityWaterProcess gasesMaterialsSYSTEM BOUNDARYMODELLED PROCESS SEQUENCEProcess sequenceLeadframeDie attachWire bondMoldingPost cureDejunkPlatingMarkTestTape reelREFERENCE PRODUCTDiode SODAssembled and tested componentEMISSIONS AND WASTEEmissions to airEmissions to waterWaste routesRECORDED BUT NOT QUANTIFIEDIn scope, left out of the quantified inventoryCut off below the significance threshold, or with no background dataset available - each is listed with its reason1FLOWsystem boundaryreference flowentering flowemission / waste

The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.

Download this figure (SVG)

Data quality and references

Composite DQI 1.6 Very good
Reliability
2.4
Completeness
1.9
Temporal
1.0
Geographic
2.0
Technological
1.0

Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.

Sampling procedure
Component vendor specifications, academic papers, industry literature
Coverage status
Partial
Pedigree-scored source files
4 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.

Technosphere inputs

15 flows. Quantities are not published; they ship with the dataset on Circa.

CF4 production Process gasg · -49.2% / +69.5%
Derivation basis
  • No retrievable public document identified

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
Carbon tetrafluoride (CF4)
Background dataset
Modelled by REEL; see the upstream dataset above.
Uncertainty
-49.2% / +69.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
SF6 production Process gasg · -49% / +53.1%
Derivation basis
  • No retrievable public document identified

No source is attached to this row.

Source citations
Not stated
Upstream REEL dataset
Sulfur hexafluoride (SF6)
Background dataset
Modelled by REEL; see the upstream dataset above.
Uncertainty
-49% / +53.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Electricity, Taiwan (TW) ElectricitykWh · -1.8% / +141.7%
Derivation basis
  • Calculated from equipment energy across all manufacturing operations, plus facility support such as cleanroom HVAC, ultrapure water, cooling, gas abatement, and bulk gases.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
  • Nexperia SOD package application notes
  • JEDEC SOD package standards
Background data
ecoinvent 3.12
Background dataset
electricity, high voltage
Uncertainty
-1.8% / +141.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
kWh
Fresh water WaterL
Derivation basis
  • Stated by the manufacturing model as the water its own assembly line uses: rinsing after the terminations are plated, and cleaning the finished parts. It is an allowance per finished piece rather than a sum over individual operations, and because this device buys no wafer there is no fabrication water carried anywhere else in this dataset.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12
Background dataset
tap water
Notes
Process and cleaning water
Uncertainty
No range defined.
Unit
L
Compressed air Process gasg · -25.9% / +29.7%
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12
Background dataset
compressed air, 700 kPa gauge
Uncertainty
-25.9% / +29.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Ar Process gasg · -60% / +100%
Derivation basis
  • No retrievable public document identified

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12
Background dataset
argon, liquid
Uncertainty
-60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
O2 Process gasg · -60% / +100%
Derivation basis
  • No retrievable public document identified

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12
Background dataset
oxygen, liquid
Uncertainty
-60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
H2 Process gasg · -44.3% / +88.3%
Derivation basis
  • No retrievable public document identified

The sources for this row are listed below.

Source citations
Background data
ecoinvent 3.12
Background dataset
hydrogen, gaseous, low pressure
Uncertainty
-44.3% / +88.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
N2 Process gasg · -25.4% / +49.5%
Source citations
Background data
ecoinvent 3.12
Background dataset
nitrogen, liquid
Uncertainty
-25.4% / +49.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Copper Leadframe Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
  • Nexperia SOD package application notes
  • JEDEC SOD package standards
Background data
ecoinvent 3.12
Background dataset
copper, cathode
Uncertainty
No range defined.
Unit
g
Mold Compound Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
  • Nexperia SOD package application notes
  • JEDEC SOD package standards
Background data
ecoinvent 3.12
Background dataset
epoxy resin insulator, SiO2
Uncertainty
No range defined.
Unit
g
Bond Wire Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
  • Nexperia SOD package application notes
  • JEDEC SOD package standards
Background data
ecoinvent 3.12
Background dataset
gold
Uncertainty
No range defined.
Unit
g
Silver Materialg · -7.2% / +50%
Derivation basis
  • The mass above is the adhesive that stays in the finished package. The paste bought at the gate is that mass divided by the declared utilization, and the difference is booked as the uncured paste lost at the dispenser. The utilization band comes from the same public review of needle-dispense die attach that the packaging datasets use, and the operation here is the same one: a needle-dispensed conductive epoxy onto a leadframe strip.

The sources for this row are listed below.

Source citations
Background data
ecoinvent 3.12
Background dataset
silver
Notes
From Silver-filled epoxy (84.5% silver)
Uncertainty
-7.2% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Epoxy resin, liquid Materialg · -7.2% / +50%
Derivation basis
  • The mass above is the adhesive that stays in the finished package. The paste bought at the gate is that mass divided by the declared utilization, and the difference is booked as the uncured paste lost at the dispenser. The utilization band comes from the same public review of needle-dispense die attach that the packaging datasets use, and the operation here is the same one: a needle-dispensed conductive epoxy onto a leadframe strip.

The sources for this row are listed below.

Source citations
Background data
ecoinvent 3.12
Background dataset
epoxy resin, liquid
Notes
From Silver-filled epoxy (15.5% epoxy)
Uncertainty
-7.2% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g
Tin Plating Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
  • Nexperia SOD package application notes
  • JEDEC SOD package standards
Background data
ecoinvent 3.12
Background dataset
tin
Uncertainty
No range defined.
Unit
g

Outputs and waste

Runner Scrap Solid wasteg
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12 treatment route
Background dataset
treatment of inert waste, sanitary landfill
Uncertainty
No range defined.
Unit
g
Leadframe Scrap Solid wasteg
Derivation basis
  • Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.

No source is attached to this row.

Source citations
Not stated
Background data
ecoinvent 3.12 treatment route
Background dataset
market for copper scrap, sorted, pressed
Uncertainty
No range defined.
Unit
g
Uncured Ag-filled die-attach epoxy (dispense loss) Solid wasteg · -72.2% / +500%
Source citations
Background data
ecoinvent 3.12 treatment route
Background dataset
market for precious metal from electronics scrap, in anode slime
Uncertainty
-72.2% / +500% around the published quantity. The bounds themselves ship with the dataset on Circa.
Unit
g

Emissions to air

1 elementary flow released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.

VOCs (from epoxy cure) Emission to airg
Compartment
Air (non-urban air or from high stacks)
ecoinvent 3.12 elementary flow
NMVOC, non-methane volatile organic compounds
Uncertainty
A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
Unit
g

Emissions to water

No emissions to water are recorded at this level.

Flows not quantified

1 flow is recorded for this dataset but carries no quantity — cut off below the significance threshold, or with no background dataset available. It remains inside the declared system boundary; each is listed with its reason.

Cut off - below the significance threshold (1)

Silicon Die Materialg
Derivation basis
  • Calculated from per-operation consumption, operation counts, and manufacturing yield.

The sources for this row are listed below.

Source citations (dataset-level)
  • ASM Pacific Technology. IDEALmold Specifications
  • Disco Corporation. DFL7161 Laser Saw Specifications
  • AAM International (Strip sizes 100x300mm)
  • US Patent 5945259A (Etching photoresist thickness)
  • US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
  • Bruderer BSTA 510 Specs (510kN, 22kW)
  • Samhoor Press Specs (200-800 SPM)
  • Nexperia SOD package application notes
  • JEDEC SOD package standards
Background data
cut off
Background dataset
Not applicable: this flow is not quantified in the inventory.
Reason
The silicon die enters this dataset as an externally fabricated input: die fabrication is outside this dataset's declared scope and no upstream wafer dataset is linked. The die mass is recorded for transparency.
Uncertainty
No range defined.
Unit
g

Limitations and unquantified flows (2)

Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.

  • The 'Package Mass' row carries the moulded body, lead frame and die-attach as one unmapped mass. Its constituent materials are not itemised and it is not linked to a background dataset.
  • These materials are used at a step of the modelled flow and are also carried by this dataset's own material list. Each is counted once, on that list, and the step does not book it again: Die attach uses Die attach epoxy (Ag-filled conductive).

The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.

Database-wide boundary policy — applies to every REEL dataset

These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.

Use phase
Product operation is outside the cradle-to-gate scope.
End-of-life treatment
Recycling and disposal are outside the cradle-to-gate scope.
Distribution and retail
The gate is a finished component ready for integration into a higher-level assembly.
Inbound transport of raw materials
Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
Returnable shipping containers
Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
Photomask fabrication
A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
Employee transport, administration and R&D overhead
Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
Capital goods
Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
Precious metal recovery credits
Scrap recovery credits for precious metals are excluded pending data availability.
Wafer reclaim
Test wafers and scrap are outside the system boundary.

Inside the boundary, linked rather than modelled

Silicon ingot growth and wafer slicing
Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
Freight between production stages
Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.

Cut-off criteria

A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.

Included regardless of the cut-off

  • Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
  • Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
  • Volatile organics (photoresist solvents, PGMEA) - air quality
  • Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
  • Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol