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Electronics LCI Datasets

Browse the REEL LCI database by category — open, source-documented life cycle inventory data for the major electronics components used in modern IT hardware.

Semiconductors

Semiconductor LCI Data

Wafer and chip inventories from 3nm FinFET to 180nm planar CMOS. 14 logic wafer models, 38 logic ICs, plus specialty wafers and IC substrates. Process-flow traceable.

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PCBs

PCB LCI Data

Per-m² inventories for 19 printed circuit board constructions — 2-layer flex through 40-layer backplanes, plus HDI, rigid-flex, and specialty boards. Surface-finish variants exposed.

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Advanced Packaging

Advanced Packaging LCI Data

39 packaging models — TSMC CoWoS 2.5D, Intel Foveros and EMIB, fan-out wafer/panel-level, HBM TSV stacking, plus FCBGA, FBGA, QFN, and more. Stack-yield compounding.

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Memory

Memory LCI Data

DRAM (DDR4, DDR5, LPDDR), 3D NAND (TLC, QLC), and HBM stacks (HBM2/3/3E) with explicit TSV bonding and stack-yield compounding. Per-die and per-Gb inventories.

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Servers & GPUs

Server & GPU LCI Data

System-level inventories aggregating component-level datasets — chiplet GPU compute die, HBM stacks, silicon interposers, package substrates, high-layer-count PCBs, cabling, PSUs, and chassis — into card-level and server-level results. The bottom-up alternative to spend-based emission factors.

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Looking for other categories? REEL LCI also covers passive components, connectors, cables, electromechanical, optoelectronics, specialty semiconductors, thermal management, power supply units, and infrastructure. Browse the full database on Circa.

Browse the full database

All REEL LCI datasets are available on Circa for direct integration into your LCA models, with the full methodology documented in the report.

Browse on Circa Read the methodology (PDF)