Overview
- Technology
- Substrate-Like PCB, 10-layer
- Geography
- Global average data from PCB manufacturer data, IPC standards, and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- PCB manufacturer specifications, IPC standards, academic papers
- Coverage status
- Partial
- Pedigree-scored source files
- 15 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
25 flows. Quantities are not published; they ship with the dataset on Circa.
PCB release film Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
- This flow is a consumable of the manufacturing operation. The model reads it from the operation's own inventory rather than from the product's bill of materials.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- polyethylene terephthalate, granulate, amorphous
- Uncertainty
- No range defined.
- Unit
- kg
Kraft press paper Materialkg · -57.1% / +90.5%
- Derivation basis
-
- This flow is a consumable of the manufacturing operation. The model reads it from the operation's own inventory rather than from the product's bill of materials.
The sources for this row are listed below.
- Source citations
-
- qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
- ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
- syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
- insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
- ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
- greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
- Background data
- ecoinvent 3.12
- Background dataset
- kraft paper
- Uncertainty
- -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Electricity, China (CN) ElectricitykWh · -21.8% / +27.5%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations, plus the facility support a board shop runs: cooling for the lamination press and the plating baths, and treatment of the water the shop discharges.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Atotech Neoganth X Activator specifications
- P2InfoHouse drag-out reduction study
- Atotech Neoganth X Activator specifications; A Pollution Prevention Resource Manual for Metal Finishers - A Competitive Advantage Manual
- The Electrochemical Recovery of Metallic Palladium from Spent Electroless Plating Solution (JOM, 2009)
- AllPCB and RayPCB lamination process documentation
- iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
- electronics.org. Copper Electroplating Technology for Microvia Filling.
- magazines007.com. The PCB Magazine, February 2012.
- epawebapp.epa.ie (date not recorded). IE LICENCE APPLICATION OPERATION REPORT. PDF document.
- dravyom.com (date not recorded). Electroless Copper Plating Bath. Web page.
- insulectro.com (2021). Microfill EVF Copper Via Fill. PDF document.
- Chung et al. (2025). A three-dimensional bipolar microneedle electrode array with local ground integrated at each sidewall for enhanced focal electric stimulation. Microsystems & Nanoengineering. DOI: 10.1038/s41378-025-01093-0.
- rit.edu (2018). Wilhelm, ACS AM&I (2018). ACS AM&I (2018).
- KLA (date not recorded). KLAC BROCHURE Nuvogo 800.
- KLA (date not recorded). KLAC BROCHURE Nuvogo 700.
- KLA (date not recorded). KLAC BROCHURE Nuvogo Fine.
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Uncertainty
- -21.8% / +27.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Fresh water WaterL · -29.7% / +42.9%
- Derivation basis
-
- Calculated from process-water demand across all manufacturing operations, plus cooling-tower makeup for the lamination press and the plating baths.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- ResearchGate, Water use in PCB manufacturing
- Envirowise, Water use in PCB manufacturing
- Patent CN102286761B, Acid Copper Additives
- Patent US5151170A, Brightener Consumption
- SysPCB, Inner Layer Process
- NMFRC, Electroless Nickel Stoichiometry
- Background data
- ecoinvent 3.12
- Background dataset
- tap water
- Notes
- Process and cleaning water
- Uncertainty
- -29.7% / +42.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- L
Copper sulfate pentahydrate Process chemicalg · -33.3% / +38.8%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- copper sulfate
- Uncertainty
- -33.3% / +38.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Sulfuric acid Process chemicalg · -41.2% / +85.3%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- sulfuric acid
- Uncertainty
- -41.2% / +85.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Hydrochloric acid (chloride source) Process chemicalg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- hydrochloric acid, without water, in 30% solution state
- Uncertainty
- No range defined.
- Unit
- g
Dry Film Resist Process chemicalg · -7.4% / +11.1%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- proxy-mapped
- Background dataset
- methyl methacrylate
- Uncertainty
- -7.4% / +11.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Sodium carbonate developer Process chemicalg · -33.3% / +50%
- Source citations
-
- electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
- Background data
- ecoinvent 3.12
- Background dataset
- soda ash, dense
- Uncertainty
- -33.3% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Sodium hydroxide stripper Process chemicalg · -50% / +66.7%
- Source citations
-
- electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
- Background data
- ecoinvent 3.12
- Background dataset
- sodium hydroxide, without water, in 50% solution state
- Uncertainty
- -50% / +66.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Formaldehyde Process chemicalg · -49.6% / +100%
- Source citations
-
- dravyom.com (date not recorded). Electroless Copper Plating Bath. Web page.
- Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.
- Altynbaeva et al. (2023). Eco-Friendly Electroless Template Synthesis of Cu-Based Composite Track-Etched Membranes for Sorption Removal of Lead(II) Ions. Membranes. DOI: 10.3390/membranes13050495.
- Trouble in Your Tank: A Process Engineer's Guide to Electroless Copper
- Background data
- ecoinvent 3.12
- Background dataset
- formaldehyde
- Uncertainty
- -49.6% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
EDTA chelator Process chemicalg
- Source citations
-
- Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.
- Background data
- ecoinvent 3.12
- Background dataset
- EDTA, ethylenediaminetetraacetic acid
- Uncertainty
- No range defined.
- Unit
- g
Sodium hydroxide (pH control) Process chemicalg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- sodium hydroxide, without water, in 50% solution state
- Uncertainty
- No range defined.
- Unit
- g
Hydrogen peroxide Process chemicalg · -37.5% / +87.5%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- hydrogen peroxide, without water, in 50% solution state
- Uncertainty
- -37.5% / +87.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Solder mask solvent carrier Process chemicalg · -62.9% / +20%
- Source citations
-
- epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP), Volume II Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, February 1999. Government report.
- taiyo-america.com (date not recorded). TAIYO PSR-4000 LEW1 (US) Liquid Photoimageable Solder Mask, Technical Data Sheet, revised July 2013. Vendor datasheet.
- electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
- Background data
- proxy-mapped
- Background dataset
- chemical, organic, unspecified
- Uncertainty
- -62.9% / +20% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Sodium hydroxide Process chemicalg · -34.8% / +41.3%
- Source citations
-
- ResearchGate, Water use in PCB manufacturing
- Envirowise, Water use in PCB manufacturing
- Patent CN102286761B, Acid Copper Additives
- Patent US5151170A, Brightener Consumption
- SysPCB, Inner Layer Process
- NMFRC, Electroless Nickel Stoichiometry
- Background data
- ecoinvent 3.12
- Background dataset
- sodium hydroxide, without water, in 50% solution state
- Uncertainty
- -34.8% / +41.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Trisodium phosphate Process chemicalg · -40% / +60%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- trisodium phosphate
- Uncertainty
- -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Potassium permanganate Process chemicalg · -81.3% / +34.1%
- Source citations
-
- patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
- p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
- portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
- 19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment - Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results (grant #X 823856; update to EPA 744-R-95-006). Government report.
- zsepb.zs.gov.cn (date not recorded). Zhongshan Dajin Electronics Co. Ltd, annual 5 million m2 circuit-board expansion and retrofit project, environmental impact report form (zhong shan shi da jin dian zi you xian gong si nian chan 500 wan ping fang mi xian lu ban gai kuo jian xiang mu huan jing ying xiang bao gao biao), December 2024, project code 2404-442000-04-01-964388. PDF document.
- Background data
- ecoinvent 3.12
- Background dataset
- potassium permanganate
- Uncertainty
- -81.3% / +34.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Neutralizer (sulfuric acid or HCl) Process chemicalg · -20% / +50%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- sulfuric acid
- Uncertainty
- -20% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
SAC305 solder alloy Process chemicalg · ±33.3%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- composite
- Background dataset
- Modelled as a composite of its constituent materials.
- Uncertainty
- ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Liquid flux Process chemicalmL · -40% / +60%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- flux, for wave soldering
- Uncertainty
- -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- mL
ABF build-up film Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- proxy-mapped
- Background dataset
- epoxy resin insulator, SiO2
- Uncertainty
- No range defined.
- Unit
- g
Copper Foil Materialg · -10% / +0%
- Source citations
-
- insulectro.com (date not recorded). Denkai America, "TOB-III High reliability electrodeposited copper foil" Technical Data Sheet, Rev May 4 2020 (Insulectro-hosted). Technical data sheet.
- de.beta-layout.com (date not recorded). MSC-Ditron, "FR-4 copper clad Laminate EP-84" TDS, created 11/16/2006 (beta-layout-hosted). Technical data sheet.
- eurocircuits.com (date not recorded). Eurocircuits, "Tolerances on Copper Thickness" (fabricator technical guideline).
- z-zero.com (date not recorded). Z-zero (Bill Hargin), "Actual Copper Thicknesses (As Opposed to What You've Assumed)" (stack-up design house blog). Vendor web page.
- pcbworld.com (date not recorded). PCBWorld, "Copper thickness" technology page.
- Background data
- proxy-mapped
- Background dataset
- copper, cathode
- Uncertainty
- -10% / +0% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Copper Plating Materialg · ±20%
- Source citations
-
- aivon.com (date not recorded). AIVON (Sophia Wang), "IPC 6012: A Detailed Examination of Hole/Via Plating Thickness Requirements", March 17 2026. Vendor web page.
- jlcpcb.com (date not recorded). JLCPCB, "Optimize PCB Plating Thickness for Superior Durability" blog.
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Solder Mask Materialg · -22.9% / +27.1%
- Source citations
-
- taiyo-america.com (date not recorded). Taiyo America, "PSR-4000 CC01SE" TDS, LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK, Revised December 2013. Technical data sheet.
- Background data
- proxy-mapped
- Background dataset
- epoxy resin, liquid
- Notes
- Purchased input grossed to fund the authored process loss booked as Solder mask solids (developed) (mass-closure funding; the retained mass is the product-side figure).
- Uncertainty
- -22.9% / +27.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Outputs and waste
Wastewater Wastewaterm3 · -29.7% / +42.9%
- Derivation basis
-
- Calculated from the water balance: fresh-water input minus evaporation.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- ResearchGate, Water use in PCB manufacturing
- Envirowise, Water use in PCB manufacturing
- Patent CN102286761B, Acid Copper Additives
- Patent US5151170A, Brightener Consumption
- SysPCB, Inner Layer Process
- NMFRC, Electroless Nickel Stoichiometry
- Background data
- carried, no background dataset
- Background dataset
- No treatment route recorded for this output.
- Uncertainty
- -29.7% / +42.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- m3
Resin bleed-out Solid wasteg · -80% / +300%
- Source citations
-
- electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17, "Resin Flow Percent of Prepreg", Revision D, dated 8/97 (Originating Task Group: MIL-P-13949 Test Methods Task Group 7-11b). PDF document.
- electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.3.17.2, "Resin Flow of 'No Flow' Prepreg", Revision B, dated 8/97. PDF document.
- electronics.org (date not recorded). IPC-TM-650 Test Methods Manual, Number 2.4.38, "Prepreg Scaled Flow Testing", Revision A, dated 6/91. PDF document.
- kinwong.com (date not recorded). Kinwong Electronic Technology (Longchuan) - expansion and retrofit project completion environmental-protection acceptance monitoring report, form version (jian she xiang mu jun gong huan bao yan shou jian ce bao gao (biao)), 2021-08, 129 pp. (monitoring by Shenzhen Zhengyan Testing Technology Co., Ltd.). PDF document.
- zjjcmspublic.oss-cn-hangzhou-zwynet-d01-a.internet.cloud.zj.gov.cn (date not recorded). Zhejiang Luoqitaike (Rocktek) Technology Co., Ltd. - annual 0.8M m2 double-sided and multilayer circuit board project, construction-project environmental impact report form, pollution-impact class (jian she xiang mu huan jing ying xiang bao gao biao), April 2023, 167 pp. (prepared by Jinhua Huanke Environmental Technology Co., Ltd.). PDF document.
- patents.google.com (date not recorded). Hexion Specialty Chemicals Inc., US7592067B2, "Epoxy resin compositions, processes utilizing same and articles made therefrom", priority 2003-09-22, issued 2009-09-22. Patent.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- -80% / +300% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Kraft press paper Solid wasteg · -57.1% / +90.5%
- Source citations
-
- qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
- ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
- syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
- insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
- ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
- greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for waste paperboard, sorted
- Uncertainty
- -57.1% / +90.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Ablated dielectric debris Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Copper recovered before outfall discharge Solid wasteg · -100% / +177.8%
- Source citations
-
- mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
- epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
- 19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Uncertainty
- -100% / +177.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Anode bag sludge (phosphorus + organic adsorbates) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below are this dataset's own bibliography. They are not tied to this row.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
- research.sabanciuniv.edu (date not recorded). PROCESS INTEGRATION AND TECHNOLOGY DEVELOPMENT FOR LOW-COST, ACCESSIBLE HIGH DENSITY INTERCONNECT (HDI) PRINTED CIRCUIT BOARDS (PCBs). PDF document.
- patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
- IPCC 2019 Guidelines Vol 3 Ch 6
- EPA 40 CFR Part 98 Subpart I (2024)
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- No range defined.
- Unit
- g
DFR cover film (peeled before exposure) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Spent / lock-in DFR rejects Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, hazardous waste incineration, with energy recovery
- Uncertainty
- No range defined.
- Unit
- g
Develop sludge (filtered DFR particulate) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below are this dataset's own bibliography. They are not tied to this row.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
- IPCC 2019 Guidelines Vol 3 Ch 6
- EPA 40 CFR Part 98 Subpart I (2024)
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, hazardous waste incineration, with energy recovery
- Uncertainty
- No range defined.
- Unit
- g
Stripped DFR (post-plate) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- electronics.org. The Latest Technical Trend of Dry Film Photo Resist.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, hazardous waste incineration, with energy recovery
- Uncertainty
- No range defined.
- Unit
- g
Spent bath bail-out (sludge + Cu precipitate) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below are this dataset's own bibliography. They are not tied to this row.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- Balaramesh, Venkatesan, Jayalakshmi et al. (2025). Balaramesh, Venkatesan, Jayalakshmi et al. - Influence of conventional and sustainable electroless baths on autocatalytic copper deposition. Scientific Reports. DOI: 10.1038/s41598-025-19231-z.
- Trouble in Your Tank: A Process Engineer's Guide to Electroless Copper
- dravyom.com (date not recorded). Electroless Copper Plating Bath. Web page.
- Altynbaeva et al. (2023). Eco-Friendly Electroless Template Synthesis of Cu-Based Composite Track-Etched Membranes for Sorption Removal of Lead(II) Ions. Membranes. DOI: 10.3390/membranes13050495.
- IPCC 2019 Guidelines Vol 3 Ch 6
- EPA 40 CFR Part 98 Subpart I (2024)
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Uncertainty
- No range defined.
- Unit
- g
Spent etchant copper (post-electrowinning) Solid wasteg
- Source citations
-
- mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
- epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
- 19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Uncertainty
- No range defined.
- Unit
- g
Solder mask solids (developed) Solid wasteg · ±25%
- Source citations
-
- electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of waste plastic, mixture, municipal incineration
- Uncertainty
- ±25% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Spent oxide solution sludge Solid wasteg · -89.8% / +614.3%
- Source citations (dataset-level)
-
- mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
- epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
- 19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
- epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
- 19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- -89.8% / +614.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Epoxy smear residue Solid wasteg · -73.9% / +195.4%
- Source citations
-
- patents.google.com (date not recorded). Electrochemicals Inc., US6454868B1, "Permanganate desmear process for printed wiring boards", issued 2002-09-24. Patent.
- isola-group.com (date not recorded). Young, T. (Isola); Polakovic, F. and Carano, M. (Electrochemicals Inc.), "Thermal Reliability of Laser Ablated Microvias and Standard Through-Hole Technologies as a Function of Materials and Processing", paper S09-6-1. PDF document.
- link.springer.com (date not recorded). Cheng, Y.-H.; Hsu, C.-C.; Lan, C.-J.; Munoz, S.; Caparanga, A.; Soriano, A.N.; Li, M.-H., "Desmearing of FR4 Epoxy Resin Using NMP-Based Sweller", Journal of Electronic Materials, 2009, 38(11): 2368-2375. Journal article.
- sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
- 17260206.s21i.faiusr.com (date not recorded). Victory Giant Technology (Huizhou) Co., Ltd. - Plant 9 Intelligent CNC Machining Centre Project (Phase 1), completion environmental-protection acceptance monitoring report, March 2026 (prepared by Huizhou Landing Environmental Technology Co., Ltd.). PDF document.
- aivon.com (date not recorded). Aivon, "How We Resolved PCB Solder Mask Opening Design Conflicts in a 2-Layer FR4 PCB" (engineering case, production record #FR4-20260708-079).
- kinjipcb.com (date not recorded). Kinji Group (KinjiPCB), product page "10 Layer FR4 ENIG Mass Production PCB" (product/142).
- jlcpcb.com (date not recorded). JLCPCB Help Centre, "In what cases will there be charged extra?", section 9 "Too Many Drilling Holes" (page dated "Last updated on Aug 13, 2026").
- pcbtok.com (date not recorded). PCBTok (Sony He), "Complete PCB Via Size Guideline", 5 November 2024, section "PCB Density".
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- -73.9% / +195.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Manganese sludge (filter cake) Solid wasteg · -86% / +101.2%
- Source citations (dataset-level)
-
- sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
- epa.gov (date not recorded). U.S. EPA Office of Water - Preliminary Study of the Electrical and Electronic Components Point Source Category (40 CFR Part 469), EPA-821-R-22-005, DCN 11197, November 2022. Government report.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- sthjt.hubei.gov.cn (date not recorded). HJ 2058-2018 Technical specifications for wastewater treatment engineering of printed circuit board (yin zhi dian lu ban fei shui zhi li gong cheng ji shu gui fan), National Environmental Protection Standard of the PRC, issued 2018-08-31, effective 2018-12-01. PDF document.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- -86% / +101.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Routing dust (FR-4 particles) Solid wasteg · -63.5% / +62.2%
- Source citations
-
- eurocircuits.com (date not recorded). Eurocircuits, "Customer Panel Basics" technical guidelines (2 mm routing tool; 2.00 mm min profile clearance; 7.00 mm panel-edge clearance).
- circuitnet.com (date not recorded). Oosterhof A. & Nether S. (LPKF), "Depaneling of Circuit Boards", Proc. 20th Pan Pacific Microelectronics Symposium, Kauai, Feb 2-5 2015 (CircuitNet-hosted PDF). Conference paper.
- uniontool.co.jp (date not recorded). UNION TOOL CO., "PCB Routers" product page (RCMB/RCM/RI/RP/RPU/RS/RPEM/RLE/SCMB/SCM/DCE series diameter ranges).
- eurocircuits.com (date not recorded). Eurocircuits, "How to Panelise Small PCBs" (10 mm break-rout clearance recommendation, 14 mm pitch).
- archive.epa.gov (date not recorded). US EPA, "Guides to Pollution Prevention: The Printed Circuit Board Manufacturing Industry", EPA/625/7-90/007, June 1990, Risk Reduction Engineering Laboratory, Cincinnati OH. Government report.
- mee.gov.cn (date not recorded). HJ 450-2008, Cleaner Production Standard - Printed Circuit Board Manufacturing Industry, MEE China (issued 2008-11-21, effective 2009-02-01). PDF document.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- -63.5% / +62.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Copper Sludge Solid wasteg · -33.3% / +25%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for metalliferous hydroxide sludge
- Uncertainty
- -33.3% / +25% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Neutralization Sludge Solid wasteg · ±50%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- ±50% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Solder dross Solid wasteg · -37.5% / +50%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- AIM Solder white paper - Understanding Solder Dross; Indium Corporation reclaim data
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for waste tin sheet
- Uncertainty
- -37.5% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Spent flux residue Solid wasteg · -33.3% / +66.7%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, hazardous waste incineration, with energy recovery
- Uncertainty
- -33.3% / +66.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Scrapped material (line yield) Solid wasteg · -3.1% / +0.8%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below are this dataset's own bibliography. They are not tied to this row.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- insulectro.com (date not recorded). Denkai America, "TOB-III High reliability electrodeposited copper foil" Technical Data Sheet, Rev May 4 2020 (Insulectro-hosted). Technical data sheet.
- de.beta-layout.com (date not recorded). MSC-Ditron, "FR-4 copper clad Laminate EP-84" TDS, created 11/16/2006 (beta-layout-hosted). Technical data sheet.
- eurocircuits.com (date not recorded). Eurocircuits, "Tolerances on Copper Thickness" (fabricator technical guideline).
- z-zero.com (date not recorded). Z-zero (Bill Hargin), "Actual Copper Thicknesses (As Opposed to What You've Assumed)" (stack-up design house blog). Vendor web page.
- pcbworld.com (date not recorded). PCBWorld, "Copper thickness" technology page.
- qxb-img-osscache.qixin.com (date not recorded). Jiangxi Longyi Connection Technology - annual 1.10M m2 automotive-electronics project phase 1-1 completion environmental-protection acceptance report (jian she xiang mu jun gong huan bao yan shou bao gao). PDF document.
- ipcb.com (date not recorded). PCB multilayer board pressing process description (English glossary incl. Book definition).
- syspcb.com (date not recorded). PCB Lamination Technology: A Comprehensive Guide to Multilayer Board Manufacturing.
- insulectro.com (date not recorded). Pacothane Technologies / Insulectro, PACOPADS - Pressure Equalization Press Pads for Lamination of Flexible and Multilayer Circuit Boards. PDF document.
- ipcb.com (date not recorded). iPCB, PCB multilayer circuit board pressing method.
- greatpcb.com (date not recorded). GREATPCB, PCB Inner Layer Process: Panel Layout Explained.
- aivon.com (date not recorded). AIVON (Sophia Wang), "IPC 6012: A Detailed Examination of Hole/Via Plating Thickness Requirements", March 17 2026. Vendor web page.
- jlcpcb.com (date not recorded). JLCPCB, "Optimize PCB Plating Thickness for Superior Durability" blog.
- taiyo-america.com (date not recorded). Taiyo America, "PSR-4000 CC01SE" TDS, LIQUID PHOTOIMAGEABLE CURTAIN COAT SOLDER MASK, Revised December 2013. Technical data sheet.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Notes
- Calculated reject material after accounting for a manufacturing yield of 82.5%.
- Uncertainty
- -3.1% / +0.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Emissions to air
2 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.
Volatile organic compounds (VOCs) Emission to airg
- Derivation basis
-
- Calculated from flux solids and VOC content; MIT EHS-0167; NIOSH NPG
The sources for this row are listed below.
- Source citations
-
- electronics.org (date not recorded). Johnson, S.M. (GENESIS Material Technology), Liquid Photoresist and Soldermask Processing: The Real Environmental Impact, IPC technical resource E8&S32_02. PDF document.
- epa.gov (date not recorded). US EPA, Emission Inventory Improvement Program (EIIP), Volume II Chapter 6: Preferred and Alternative Methods for Estimating Air Emissions from Semiconductor Manufacturing, February 1999. Government report.
- taiyo-america.com (date not recorded). TAIYO PSR-4000 LEW1 (US) Liquid Photoimageable Solder Mask, Technical Data Sheet, revised July 2013. Vendor datasheet.
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- NMVOC, non-methane volatile organic compounds
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Particulates Emission to airg
- Source citations
-
- AIM Solder dross study; NIOSH soldering fume data
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- Particulate Matter, < 2.5 um
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Emissions to water
6 elementary flows released to water by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.
Cu Emission to waterg
- Source citations
-
- mee.gov.cn (date not recorded). GB 39731-2020, Emission standard of water pollutants for the electronics industry (official MEE PDF) - Table 1 item 13 total copper 0.5 direct / 2.0 indirect mg/L; Table 2 benchmark effluent volumes per wafer / per m2 PCB / per package. Standard.
- epa.gov (date not recorded). U.S. EPA Office of Water, "Preliminary Study of the Electrical and Electronic Components Point Source Category", EPA-821-R-22-005, DCN 11197 (2022) - Table 12 indirect Cu median 0.05 / mean 0.213 / max 5.64 / min 0.00015 mg/L (67 facilities, 1,309 results, 996 detects); Table 13 direct; Table 6 named-facility treatment trains; sec. 1.2.3.1 post-1983 process additions. Government report.
- 19january2021snapshot.epa.gov (date not recorded). U.S. EPA Design for the Environment, "Printed Wiring Board Pollution Prevention and Control Technology: Analysis of Updated Survey Results" (grant X 823856; update to EPA 744-R-95-006) - raw Cu 0.4 to >100 mg/l (sec. 6.2); Exhibit 6-1 permit-limit rows; drag-out Exhibits 4-4/4-5; treatment mix sec. 6.3. Government report.
- Compartment
- Water (surface water)
- CAS number
- 7440-50-8
- ecoinvent 3.12 elementary flow
- Copper ion
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Sulfate Emission to waterg
- Source citations
-
- p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
- patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
- portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
- Compartment
- Water (surface water)
- Formula
- SO42-
- CAS number
- 14808-79-8
- ecoinvent 3.12 elementary flow
- Sulfate
- Notes
- Aggregated from 3 contributing steps: H2SO4 dissociates in water → 2H⁺ + SO4²⁻ + K2SO4 → 2K⁺ + SO4²⁻ (ionic dissociation)
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Mixed organics (COD) Emission to waterg
- Derivation basis
-
- Calculated as a release to water, from a contaminant mass balance on the process chemistry.
No source is attached to this row.
- Source citations
- Not stated
- Compartment
- Water (surface water)
- ecoinvent 3.12 elementary flow
- COD, Chemical Oxygen Demand
- Uncertainty
- No range defined.
- Unit
- g
H2O2 Emission to waterg
- Derivation basis
-
- Calculated as a release to water, from a contaminant mass balance on the process chemistry.
No source is attached to this row.
- Source citations
- Not stated
- Compartment
- Water (surface water)
- CAS number
- 7722-84-1
- ecoinvent 3.12 elementary flow
- Hydrogen peroxide
- Uncertainty
- No range defined.
- Unit
- g
Mn2+ Emission to waterg
- Source citations
-
- epa.gov (date not recorded). U.S. EPA Office of Water - Preliminary Study of the Electrical and Electronic Components Point Source Category (40 CFR Part 469), EPA-821-R-22-005, DCN 11197, November 2022. Government report.
- Compartment
- Water (surface water)
- CAS number
- 16397-91-4
- ecoinvent 3.12 elementary flow
- Manganese II
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Potassium Emission to waterg
- Source citations
-
- p2infohouse.org (date not recorded). Pagel, P. (Minnesota Technical Assistance Program), Waste Reduction at a Printed Circuit Board Manufacturing Facility Using Modified Rinsing Technologies, U.S. EPA WRITE Program, pp. 483-492. PDF document.
- patents.google.com (date not recorded). US4601783A - High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards (Morton Thiokol Inc.; priority 1985-05-31; later MacDermid). Patent.
- portlandcleanair.org (date not recorded). Atotech USA Inc., Material Safety Data Sheet: SECURIGANTH P-500 DOSING SOLUTION (Rock Hill SC; PMCODE PKV, 7 pp.). PDF document.
- Compartment
- Water (surface water)
- Formula
- K+
- CAS number
- 24203-36-9
- ecoinvent 3.12 elementary flow
- Potassium I
- Notes
- K2SO4 → 2K⁺ + SO4²⁻ (ionic dissociation)
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Flows not quantified
5 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.
Not modelled (5)
Suppressor (PEG) Process chemicalg · -40% / +60%
- Source citations
-
- iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
- research.sabanciuniv.edu (date not recorded). PROCESS INTEGRATION AND TECHNOLOGY DEVELOPMENT FOR LOW-COST, ACCESSIBLE HIGH DENSITY INTERCONNECT (HDI) PRINTED CIRCUIT BOARDS (PCBs). PDF document.
- patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
- Uncertainty
- -40% / +60% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Accelerator (SPS) Process chemicalg · -33.3% / +66.7%
- Source citations
-
- iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
- patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
- Uncertainty
- -33.3% / +66.7% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Leveler (Janus Green B class) Process chemicalg · ±50%
- Source citations
-
- iopscience.iop.org (date not recorded). Three-Additive Model of Superfilling of Copper. Web page.
- patents.google.com (2009). US20090035940A1 - Copper metallization of through silicon via. Patent US20090035940A1.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- Proprietary plating or printing additive consumed in trace quantity, recorded in this inventory. Formulations vary by supplier and no representative public production dataset exists, so the upstream burden is left unlinked rather than approximated with an unrepresentative proxy.
- Uncertainty
- ±50% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Sodium chlorite Process chemicalg · -16.7% / +11.1%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- Consumption is recorded in this inventory. No production dataset for sodium chlorite exists in the public background database used for linkage. Chlorate, chloride, and hypochlorite chemistries are available, but not chlorite, so the upstream burden is left unlinked rather than approximated with a chemically different proxy.
- Uncertainty
- -16.7% / +11.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Ultra Thin Core Materialg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- This specialized layer construction is recorded in this inventory. No direct background production dataset exists for it, so the upstream burden is left unlinked rather than approximated with an unrepresentative laminate proxy.
- Uncertainty
- No range defined.
- Unit
- g
Limitations and unquantified flows (1)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- These materials are used at a step of the modelled flow and are also carried by this dataset's own material list. Each is counted once, on that list, and the step does not book it again: Via fill plating (bottom-up superfill) uses Copper anode (phosphorized soluble).
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Production covered
10-layer Substrate-Like PCB fabrication. The system boundary runs from laminate preparation and inner-layer imaging through lamination, drilling and via formation, plating and etching, solder mask, surface finishing, and electrical test.
The selected HASL finish means lowest cost, good solderability, rough surface (~20% market).
Modelling choices
Process inputs are normalized from the authored panel-area basis to one square metre of good PCB; no separate board-nesting utilization factor is applied. The 82.5% first-pass yield gross-ups all panel-process inputs to the functional unit.
This PCB family has no operational scenario because surface finish is its only configurable production choice, and no fab gas-recovery scenario applies to a panel process. This dataset is modelled with no water reuse. No reclaim rate is published for this kind of plant, so the water shown is the full fresh intake and no recycling credit has been deducted from it.