Dataset index
Every dataset in the REEL LCI Database v1.0, grouped by category: 520 datasets in 320 families. Each link opens the dataset's documentation page with its system boundary, the source or derivation recorded for each flow, exclusions and data quality. Inventory quantities are not published here; they ship with the dataset itself on Circa. For search and filters use the dataset documentation explorer.
Cables 10 datasets
Components 30 datasets
- Blower Fan Array 4x
- Chassis Fan Array 6x40mm
- DDR5 128GB MRDIMM
- DDR5 16GB DIMM
- DDR5 16GB SODIMM
- DDR5 32GB CAMM2
- DDR5 32GB CSODIMM
- DDR5 32GB CUDIMM
- DDR5 memory voltage regulator assembly, 15 W
- Enterprise HDD 3.5"
- Flagship SoC PoP Assembly 16GB – 7nm AP + LPDDR5 (smartphone/tablet)
- Flagship SoC PoP Assembly 16GB – 7nm AP + LPDDR5X (smartphone/tablet)
- Flagship SoC PoP Assembly 8GB – 7nm AP + LPDDR5 (smartphone/tablet)
- Flagship SoC PoP Assembly 8GB – 7nm AP + LPDDR5X (smartphone/tablet)
- LPDDR5 16GB Server/Edge Memory Module – Discrete LPCAMM2-style (no SoC)
- LPDDR5X 16GB Server/Edge Memory Module – Discrete LPCAMM2-style (no SoC)
- NVMe M.2 SSD 128GB Versions: 1 TB
- PSU ATX 650W
- PSU DC Buck 48V 500W
- PSU DC POE 30W
- PSU Laptop Adapter 100W
- PSU Server 2000W
- PSU USB Charger GaN 65W
- PSU VRM CPU 300A
- SOCAMM 128GB LPDDR5X Memory Module (4×32GB 16DP stacks, NVIDIA Grace/GB300)
- SOCAMM2 192GB LPDDR5X Memory Module (6×32GB 16DP stacks, generic vendor)
- SOCAMM2 256GB LPDDR5X Memory Module (4×64GB 16DP stacks, generic vendor)
- SiC Power Module
- eUFS 5.0 256GB
Connectors 10 datasets
Electromechanical 4 datasets
Infrastructure 14 datasets
Logic ICs 42 datasets
- 5G Modem, FOWLP, 7nm
- ADC/DAC, QFN 6x6, 65nm
- Analog IC, SOP-8, 180nm
- Audio Codec, QFN 4x4, 65nm
- CAN Transceiver, SOIC-8, 180nm
- Clock Generator, QFN, 65nm
- DDR5 CKD, QFN, 28nm
- DDR5 MDB, QFN, 28nm
- DDR5 MRCD, QFN, 28nm
- Display Driver, QFN 8x8, 40nm
- ESD Protection, DFN, 65nm
- Ethernet PHY, QFN 6x6, 28nm
- Ethernet Switch, FC-BGA 32x32, 28nm
- FPGA, FC-BGA 35x35, 28nm
- Gate Driver, SOIC-8, 180nm
- LDO Regulator, DFN, 180nm
- LED Driver, TSSOP-16, 130nm
- Logic Buffer, TSSOP, 130nm
- Logic IC, CoWoS 2.5D, 3nm
- Logic IC, FC-BGA, 14nm
- Logic IC, FC-BGA, 5nm
- Logic IC, FC-BGA, 7nm
- Logic IC, FOWLP, 5nm
- Logic IC, FOWLP, 7nm
- MCU, LQFP-64, 28nm
- MCU, LQFP-64, 40nm
- MCU, LQFP-64, 65nm
- MCU, QFN, 28nm
- Motor Driver, QFN 6x6, 180nm
- NOR Flash 128Mb, SOIC-8, 65nm
- NPU, FC-BGA 27x27, 14nm
- Op-Amp, SOIC-8, 180nm
- PMIC, QFN 4x4, 180nm
- Power MOSFET, TO-220, 180nm
- RF LNA, QFN 3x3, 180nm
- RS-485 Transceiver, SOIC-8, 130nm
- RTC, SOIC-8, 130nm
- Temperature Sensor, DFN, 180nm
- UFS 5.0 Controller, FBGA, 5nm
- USB Hub, QFN 7x7, 90nm
- Voltage Reference, DFN, 180nm
- WiFi/BT SoC, QFN 5x5, 28nm
Memory components 31 datasets
- DRAM IC 16Gb, FBGA, 1β
- DRAM IC 8Gb, FBGA, 1α
- DRAM IC 8Gb, FBGA, 1γ
- GDDR7 IC 16Gb, FBGA, 1β
- HBF Gen 1, 512 GiB, 16-Hi Stack
- HBM3 16GB, 8-Hi Stack
- HBM3 24GB, 12-Hi Stack
- HBM3E 24GB, 8-Hi Stack
- HBM3E 36GB, 12-Hi Stack
- HBM4 32GB, 8-Hi Stack Versions: Mature · Ramp
- HBM4 48GB, 12-Hi Stack Versions: Mature · Ramp
- HBM4 64GB, 16-Hi Stack Versions: Mature · Ramp
- LPDDR5 DRAM IC 8Gb, FBGA, 1α
- LPDDR5 DRAM IC 8Gb, PoP, 1α
- LPDDR5 DRAM IC 8Gb, WLCSP, 1α
- LPDDR5X DRAM IC 16GB – 8DP WB-FBGA (8×16Gb, 1β)
- LPDDR5X DRAM IC 16Gb, FBGA, 1β
- LPDDR5X DRAM IC 16Gb, PoP, 1β
- LPDDR5X DRAM IC 16Gb, WLCSP, 1β
- LPDDR5X DRAM IC 32GB – 16DP WB-FBGA (16×16Gb, 1β)
- LPDDR5X DRAM IC 4GB – DDP WB-FBGA (2×16Gb, 1β)
- LPDDR5X DRAM IC 8GB – QDP WB-FBGA (4×16Gb, 1β)
- NAND Flash IC 1TB, FBGA, 232L
- NAND Flash IC 1TB, FBGA, 288L
- NAND Flash IC 512Gb, FBGA, 176L
Memory wafers 39 datasets
- 1-alpha DRAM wafer, 300mm, baseline scenario Versions: DRAM 1alpha Best Practice · DRAM 1alpha Moderate
- 1-beta DRAM wafer, 300mm, baseline scenario Versions: DRAM 1beta Best Practice · DRAM 1beta Moderate
- 1-gamma DRAM wafer, 300mm, baseline scenario Versions: DRAM 1gamma Best Practice · DRAM 1gamma Moderate
- 10nm-class DRAM wafer, 300mm, baseline scenario Versions: DRAM 10nm Best Practice · DRAM 10nm Moderate
- 3D NAND 128L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 128L Best Practice Conventional · NAND 3D 128L Moderate Conventional
- 3D NAND 176L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 176L Best Practice Conventional · NAND 3D 176L Moderate Conventional
- 3D NAND 232L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 232L Baseline Cryo · NAND 3D 232L Best Practice Conventional · NAND 3D 232L Best Practice Cryo · NAND 3D 232L Moderate Conventional · NAND 3D 232L Moderate Cryo
- 3D NAND 288L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 288L Baseline Cryo · NAND 3D 288L Best Practice Conventional · NAND 3D 288L Best Practice Cryo · NAND 3D 288L Moderate Conventional · NAND 3D 288L Moderate Cryo
- 3D NAND 321L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 321L Baseline Cryo · NAND 3D 321L Best Practice Conventional · NAND 3D 321L Best Practice Cryo · NAND 3D 321L Moderate Conventional · NAND 3D 321L Moderate Cryo
- GDDR7 DRAM (1β/1b) wafer, 300mm, baseline scenario Versions: GDDR7 Die Best Practice · GDDR7 Die Moderate
Optoelectronics 12 datasets
Packaging 46 datasets
- Chip-on-Wafer-on-Substrate (Silicon) package
- DIP package
- Dual Flat No-lead package
- Embedded Multi-die Interconnect Bridge package
- Embedded Wafer Level Ball Grid Array package
- Fan-Out Panel-Level package, 18x18 mm
- Fan-Out Panel-Level package, 30x30 mm
- Fan-Out Panel-Level package, 8x8 mm
- Fan-Out Wafer Level package
- Flip-Chip Ball Grid Array 27x27mm package
- Flip-Chip Ball Grid Array 32x32mm package
- Flip-Chip Ball Grid Array 35x35mm package
- Flip-Chip Ball Grid Array 50x50mm package
- Flip-Chip Ball Grid Array package
- HBM3 TSV Stacking and Assembly package, 8-Hi Versions: 12-Hi · 16-Hi
- HBM4 TSV Stacking and Assembly package, 8-Hi Versions: 12-Hi · 16-Hi
- Intel Foveros 3D Stacking package
- Low-profile Quad Flat Package 64-pin package
- PLCC package
- Package-on-Package
- Power Quad Flat No-lead with Exposed Thermal Pad package
- Quad Flat No-lead 2x2mm package
- Quad Flat No-lead 3x3mm package
- Quad Flat No-lead 4x4mm package
- Quad Flat No-lead 6x6mm package
- Quad Flat No-lead 7x7mm package
- Quad Flat No-lead 8x8mm package
- Quad Flat No-lead package
- Shrink Small Outline package
- Small Outline Integrated Circuit package
- Small Outline Package 8-lead package
- Thin Quad Flat package
- Thin Shrink Small Outline package
- Thin Small Outline package
- Transistor Outline 220 package
- Wafer-Level Chip-Scale Package - 3-Layer RDL package
- Wafer-Level Chip-Scale Package 3x3mm package
- Wafer-Level Chip-Scale Package 5x5mm package
- Wafer-Level Chip-Scale package
- Wafer-Level Package with Damascene RDL package
- Wire Bond Fine-pitch BGA with Vertically Stacked Dies package
- Wire Bond Fine-pitch Ball Grid Array package
Passives 57 datasets
- Aluminum Electrolytic
- Chip Inductor
- Chip Inductor 0201
- Chip Inductor 0603
- Chip Inductor 0805
- Chip Resistor
- Chip Resistor 0201
- Chip Resistor 0402
- Chip Resistor 0805
- Chip Resistor 1206
- Common Mode Choke
- Current Sense Resistor
- Ferrite Bead
- Ferrite Bead 0402
- Ferrite Bead 0805
- Film Capacitor X2
- Film Capacitor Y2
- MLCC C0G
- MLCC X5R
- MLCC X7R
- MLCC X7R 0201
- MLCC X7R 0603
- MLCC X7R 0805
- MLCC X7R 1206
- MOV Varistor SMD
- NTC Thermistor SMD
- PFC Boost Inductor
- PTC Thermistor SMD
- Planar Transformer
- Resistor MELF
- Resistor THT Axial
- Ring Core Inductor
- Tantalum Capacitor MnO2 10000 Case A Versions: Tantalum Capacitor MnO2 10000 Case B · Tantalum Capacitor MnO2 10000 Case C · Tantalum Capacitor MnO2 18000 Case A · Tantalum Capacitor MnO2 18000 Case B · Tantalum Capacitor MnO2 25000 Case A · Tantalum Capacitor MnO2 25000 Case B · Tantalum Capacitor MnO2 5000 Case B · Tantalum Capacitor MnO2 5000 Case C · Tantalum Capacitor MnO2 5000 Case D · Tantalum Capacitor MnO2 50000 Plus Case A · Tantalum Capacitor MnO2 50000 Plus Case R · Tantalum Capacitor Polymer 10000 Case A · Tantalum Capacitor Polymer 10000 Case B · Tantalum Capacitor Polymer 10000 Case C · Tantalum Capacitor Polymer 18000 Case A · Tantalum Capacitor Polymer 18000 Case B · Tantalum Capacitor Polymer 25000 Case A · Tantalum Capacitor Polymer 25000 Case B · Tantalum Capacitor Polymer 5000 Case B · Tantalum Capacitor Polymer 5000 Case C · Tantalum Capacitor Polymer 5000 Case D · Tantalum Capacitor Polymer 50000 Plus Case A · Tantalum Capacitor Polymer 50000 Plus Case R
- Thermistor THT Disk
PCBs 114 datasets
- 10-Layer HDI PCB, ENIG finish Versions: HDI 10-layer ENEPIG · HDI 10-layer HASL · HDI 10-layer ImAg · HDI 10-layer ImSn · HDI 10-layer OSP
- 10-Layer SLP PCB, ENIG finish Versions: SLP Smartphone ENEPIG · SLP Smartphone HASL · SLP Smartphone ImAg · SLP Smartphone ImSn · SLP Smartphone OSP
- 12-Layer Server PCB, ENIG finish Versions: Server 12-layer ENEPIG · Server 12-layer HASL · Server 12-layer ImAg · Server 12-layer ImSn · Server 12-layer OSP
- 14-Layer Server PCB, ENIG finish Versions: Server 14-layer ENEPIG · Server 14-layer HASL · Server 14-layer ImAg · Server 14-layer ImSn · Server 14-layer OSP
- 16-Layer Server PCB, ENIG finish Versions: Server 16-layer ENEPIG · Server 16-layer HASL · Server 16-layer ImAg · Server 16-layer ImSn · Server 16-layer OSP
- 18-Layer Networking PCB, ENIG finish Versions: Networking 18-layer ENEPIG · Networking 18-layer HASL · Networking 18-layer ImAg · Networking 18-layer ImSn · Networking 18-layer OSP
- 2-Layer Flex PCB, ENIG finish Versions: Flex 2-layer ENEPIG · Flex 2-layer HASL · Flex 2-layer ImAg · Flex 2-layer ImSn · Flex 2-layer OSP
- 20-Layer Networking PCB, ENIG finish Versions: Networking 20-layer ENEPIG · Networking 20-layer HASL · Networking 20-layer ImAg · Networking 20-layer ImSn · Networking 20-layer OSP
- 24-Layer Backplane PCB, ENIG finish Versions: Backplane 24-layer ENEPIG · Backplane 24-layer HASL · Backplane 24-layer ImAg · Backplane 24-layer ImSn · Backplane 24-layer OSP
- 28-Layer Backplane PCB, ENIG finish Versions: Backplane 28-layer ENEPIG · Backplane 28-layer HASL · Backplane 28-layer ImAg · Backplane 28-layer ImSn · Backplane 28-layer OSP
- 32-Layer Backplane PCB, ENIG finish Versions: Backplane 32-layer ENEPIG · Backplane 32-layer HASL · Backplane 32-layer ImAg · Backplane 32-layer ImSn · Backplane 32-layer OSP
- 4-Layer Automotive ECU PCB, ENIG finish Versions: Automotive ECU ENEPIG · Automotive ECU HASL · Automotive ECU ImAg · Automotive ECU ImSn · Automotive ECU OSP
- 4-Layer FR4 PCB, ENIG finish Versions: Standard 4-layer ENEPIG · Standard 4-layer HASL · Standard 4-layer ImAg · Standard 4-layer ImSn · Standard 4-layer OSP
- 40-Layer Backplane PCB, ENIG finish Versions: Backplane 40-layer ENEPIG · Backplane 40-layer HASL · Backplane 40-layer ImAg · Backplane 40-layer ImSn · Backplane 40-layer OSP
- 6-Layer FR4 PCB, ENIG finish Versions: Standard 6-layer ENEPIG · Standard 6-layer HASL · Standard 6-layer ImAg · Standard 6-layer ImSn · Standard 6-layer OSP
- 6-Layer RF Hybrid PCB, ENIG finish Versions: Radar Hybrid ENEPIG · Radar Hybrid HASL · Radar Hybrid ImAg · Radar Hybrid ImSn · Radar Hybrid OSP
- 6-Layer Rigid-Flex PCB, ENIG finish Versions: Rigid Flex ENEPIG · Rigid Flex HASL · Rigid Flex ImAg · Rigid Flex ImSn · Rigid Flex OSP
- 8-Layer HDI PCB, ENIG finish Versions: HDI 8-layer ENEPIG · HDI 8-layer HASL · HDI 8-layer ImAg · HDI 8-layer ImSn · HDI 8-layer OSP
- 8-Layer Memory DIMM PCB, ENIG finish Versions: Memory DIMM PCB ENEPIG · Memory DIMM PCB HASL · Memory DIMM PCB ImAg · Memory DIMM PCB ImSn · Memory DIMM PCB OSP
Specialty 16 datasets
Specialty wafers 20 datasets
- 90nm Silicon Photonics wafer, 200mm, baseline scenario Versions: Silicon Photonics Wafer 90nm Best Practice · Silicon Photonics Wafer 90nm Moderate
- CIS BSI 300mm wafer, 300mm, Japan
- Discrete Silicon 200mm wafer, 200mm, China
- GaAs VCSEL wafer, 100mm, United States Versions: Japan
- GaN-on-Si 200mm wafer, 200mm, Germany Versions: United States
- InGaAs Photodiode wafer, 100mm, United States Versions: Japan
- InP Laser Wafer 1550nm wafer, 100mm, United States Versions: Japan
- InP Laser wafer, 100mm, United States Versions: Japan
- LED GaN 100mm wafer, 100mm, China
- MEMS Inertial 200mm wafer, 200mm, Germany
- Power Discrete Silicon 200mm wafer, 200mm, Germany
- SiC 150mm wafer, 150mm, Germany Versions: United States
Substrates 2 datasets
Thermal 5 datasets
Upstream 20 datasets
- ArF Photoresist (193nm)
- Carbon tetrafluoride (CF4)
- Copper CMP Slurry
- Fluorine (F2)
- Germane (GeH4)
- Hexafluoro-1,3-butadiene (C4F6)
- Nitrogen trifluoride (NF3)
- Octafluorocyclobutane (c-C4F8)
- Oxide CMP Slurry
- Polyimide (PMDA/ODA) ((C22H10N2O5)n)
- Sulfur hexafluoride (SF6)
- TMAH Developer (2.38% solution) (N(CH3)4OH (aq))
- Tetramethylammonium hydroxide (N(CH3)4OH)
- Trimethylaluminum (Al(CH3)3)
- Trimethylgallium (Ga(CH3)3)
- Trimethylindium (In(CH3)3)
- Tungsten CMP Slurry
- Tungsten hexafluoride (WF6)
- Ultrapure Water (UPW) Production
- Water Supply (Municipal)
Wafers 48 datasets
- 10nm FinFET wafer, 300mm, baseline scenario Versions: Node 10nm Best Practice · Node 10nm Moderate
- 130nm Planar wafer, 300mm, baseline scenario Versions: Node 130nm Best Practice · Node 130nm Moderate
- 14nm FinFET wafer, 300mm, baseline scenario Versions: Node 14nm Best Practice · Node 14nm Moderate
- 180nm Planar wafer, 200mm, baseline scenario Versions: Node 180nm Best Practice · Node 180nm Moderate
- 20nm Planar HKMG wafer, 300mm, baseline scenario Versions: Node 20nm Best Practice · Node 20nm Moderate
- 22nm Planar HKMG wafer, 300mm, baseline scenario Versions: Node 22nm Best Practice · Node 22nm Moderate
- 28nm Planar HKMG wafer, 300mm, baseline scenario Versions: Node 28nm Best Practice · Node 28nm Moderate
- 3nm FinFET/GAA wafer, 300mm, Arizona, baseline scenario Versions: Node 3nm Arizona Best Practice · Node 3nm Arizona Moderate · Node 3nm Taiwan Baseline · Node 3nm Taiwan Best Practice · Node 3nm Taiwan Moderate
- 40nm Planar wafer, 300mm, baseline scenario Versions: Node 40nm Best Practice · Node 40nm Moderate
- 5nm FinFET wafer, 300mm, Arizona, baseline scenario Versions: Node 5nm Arizona Best Practice · Node 5nm Arizona Moderate · Node 5nm Taiwan Baseline · Node 5nm Taiwan Best Practice · Node 5nm Taiwan Moderate
- 65nm Planar wafer, 300mm, baseline scenario Versions: Node 65nm Best Practice · Node 65nm Moderate
- 7nm FinFET wafer, 300mm, baseline scenario Versions: Node 7nm Best Practice · Node 7nm Moderate
- 90nm Planar wafer, 300mm, baseline scenario Versions: Node 90nm Best Practice · Node 90nm Moderate
- BCD 180nm wafer, 200mm, best practice scenario Versions: BCD 180nm Moderate · BCD 180nm Moderate Gas No Recycling