Dataset index
Every dataset in the REEL LCI Database v1.0, grouped by category: 520 datasets in 320 families. Each link opens the dataset's documentation page with its system boundary, flow-by-flow sources, exclusions and data quality. Inventory quantities are not published here; they ship with the dataset itself on Circa. For search and filters use the dataset documentation explorer.
Cables 10 datasets
Components 30 datasets
- Blower Fan Array 4x
- Chassis Fan Array 6x40mm
- DDR5 128GB MRDIMM
- DDR5 16GB DIMM
- DDR5 16GB SODIMM
- DDR5 32GB CAMM2
- DDR5 32GB CSODIMM
- DDR5 32GB CUDIMM
- DDR5 memory voltage regulator assembly, 15 W
- Enterprise HDD 3.5"
- Flagship SoC PoP Assembly 16GB – 7nm AP + LPDDR5 (smartphone/tablet)
- Flagship SoC PoP Assembly 16GB – 7nm AP + LPDDR5X (smartphone/tablet)
- Flagship SoC PoP Assembly 8GB – 7nm AP + LPDDR5 (smartphone/tablet)
- Flagship SoC PoP Assembly 8GB – 7nm AP + LPDDR5X (smartphone/tablet)
- LPDDR5 16GB Server/Edge Memory Module – Discrete LPCAMM2-style (no SoC)
- LPDDR5X 16GB Server/Edge Memory Module – Discrete LPCAMM2-style (no SoC)
- NVMe M.2 SSD 128GB Versions: 1 TB
- PSU ATX 650W
- PSU DC Buck 48V 500W
- PSU DC POE 30W
- PSU Laptop Adapter 100W
- PSU Server 2000W
- PSU USB Charger GaN 65W
- PSU VRM CPU 300A
- SOCAMM 128GB LPDDR5X Memory Module (4×32GB 16DP stacks, NVIDIA Grace/GB300)
- SOCAMM2 192GB LPDDR5X Memory Module (6×32GB 16DP stacks, generic vendor)
- SOCAMM2 256GB LPDDR5X Memory Module (4×64GB 16DP stacks, generic vendor)
- SiC Power Module
- eUFS 5.0 256GB
Connectors 10 datasets
Electromechanical 4 datasets
Infrastructure 14 datasets
Logic ICs 42 datasets
- 5G Modem, FOWLP, 7nm
- ADC/DAC, QFN 6x6, 65nm
- Analog IC, SOP-8, 180nm
- Audio Codec, QFN 4x4, 65nm
- CAN Transceiver, SOIC-8, 180nm
- Clock Generator, QFN, 65nm
- DDR5 CKD, QFN, 28nm
- DDR5 MDB, QFN, 28nm
- DDR5 MRCD, QFN, 28nm
- Display Driver, QFN 8x8, 40nm
- ESD Protection, DFN, 65nm
- Ethernet PHY, QFN 6x6, 28nm
- Ethernet Switch, FC-BGA 32x32, 28nm
- FPGA, FC-BGA 35x35, 28nm
- Gate Driver, SOIC-8, 180nm
- LDO Regulator, DFN, 180nm
- LED Driver, TSSOP-16, 130nm
- Logic Buffer, TSSOP, 130nm
- Logic IC, CoWoS 2.5D, 3nm
- Logic IC, FC-BGA, 14nm
- Logic IC, FC-BGA, 5nm
- Logic IC, FC-BGA, 7nm
- Logic IC, FOWLP, 5nm
- Logic IC, FOWLP, 7nm
- MCU, LQFP-64, 28nm
- MCU, LQFP-64, 40nm
- MCU, LQFP-64, 65nm
- MCU, QFN, 28nm
- Motor Driver, QFN 6x6, 180nm
- NOR Flash 128Mb, SOIC-8, 65nm
- NPU, FC-BGA 27x27, 14nm
- Op-Amp, SOIC-8, 180nm
- PMIC, QFN 4x4, 180nm
- Power MOSFET, TO-220, 180nm
- RF LNA, QFN 3x3, 180nm
- RS-485 Transceiver, SOIC-8, 130nm
- RTC, SOIC-8, 130nm
- Temperature Sensor, DFN, 180nm
- UFS 5.0 Controller, FBGA, 5nm
- USB Hub, QFN 7x7, 90nm
- Voltage Reference, DFN, 180nm
- WiFi/BT SoC, QFN 5x5, 28nm
Memory components 31 datasets
- DRAM IC 16Gb, FBGA, 1β
- DRAM IC 8Gb, FBGA, 1α
- DRAM IC 8Gb, FBGA, 1γ
- GDDR7 IC 16Gb, FBGA, 1β
- HBF Gen 1, 512 GiB, 16-Hi Stack
- HBM3 16GB, 8-Hi Stack
- HBM3 24GB, 12-Hi Stack
- HBM3E 24GB, 8-Hi Stack
- HBM3E 36GB, 12-Hi Stack
- HBM4 32GB, 8-Hi Stack Versions: Mature · Ramp
- HBM4 48GB, 12-Hi Stack Versions: Mature · Ramp
- HBM4 64GB, 16-Hi Stack Versions: Mature · Ramp
- LPDDR5 DRAM IC 8Gb, FBGA, 1α
- LPDDR5 DRAM IC 8Gb, PoP, 1α
- LPDDR5 DRAM IC 8Gb, WLCSP, 1α
- LPDDR5X DRAM IC 16GB – 8DP WB-FBGA (8×16Gb, 1β)
- LPDDR5X DRAM IC 16Gb, FBGA, 1β
- LPDDR5X DRAM IC 16Gb, PoP, 1β
- LPDDR5X DRAM IC 16Gb, WLCSP, 1β
- LPDDR5X DRAM IC 32GB – 16DP WB-FBGA (16×16Gb, 1β)
- LPDDR5X DRAM IC 4GB – DDP WB-FBGA (2×16Gb, 1β)
- LPDDR5X DRAM IC 8GB – QDP WB-FBGA (4×16Gb, 1β)
- NAND Flash IC 1TB, FBGA, 232L
- NAND Flash IC 1TB, FBGA, 288L
- NAND Flash IC 512Gb, FBGA, 176L
Memory wafers 39 datasets
- 1-alpha DRAM wafer, 300mm, baseline scenario Versions: DRAM 1alpha Best Practice · DRAM 1alpha Moderate
- 1-beta DRAM wafer, 300mm, baseline scenario Versions: DRAM 1beta Best Practice · DRAM 1beta Moderate
- 1-gamma DRAM wafer, 300mm, baseline scenario Versions: DRAM 1gamma Best Practice · DRAM 1gamma Moderate
- 10nm-class DRAM wafer, 300mm, baseline scenario Versions: DRAM 10nm Best Practice · DRAM 10nm Moderate
- 3D NAND 128L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 128L Best Practice Conventional · NAND 3D 128L Moderate Conventional
- 3D NAND 176L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 176L Best Practice Conventional · NAND 3D 176L Moderate Conventional
- 3D NAND 232L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 232L Baseline Cryo · NAND 3D 232L Best Practice Conventional · NAND 3D 232L Best Practice Cryo · NAND 3D 232L Moderate Conventional · NAND 3D 232L Moderate Cryo
- 3D NAND 288L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 288L Baseline Cryo · NAND 3D 288L Best Practice Conventional · NAND 3D 288L Best Practice Cryo · NAND 3D 288L Moderate Conventional · NAND 3D 288L Moderate Cryo
- 3D NAND 321L wafer, 300mm, baseline scenario, conventional etch Versions: NAND 3D 321L Baseline Cryo · NAND 3D 321L Best Practice Conventional · NAND 3D 321L Best Practice Cryo · NAND 3D 321L Moderate Conventional · NAND 3D 321L Moderate Cryo
- GDDR7 DRAM (1β/1b) wafer, 300mm, baseline scenario Versions: GDDR7 Die Best Practice · GDDR7 Die Moderate
Optoelectronics 12 datasets
Packaging 46 datasets
- Chip-on-Wafer-on-Substrate (Silicon) package
- DIP package
- Dual Flat No-lead package
- Embedded Multi-die Interconnect Bridge package
- Embedded Wafer Level Ball Grid Array package
- Fan-Out Panel-Level package, 18x18 mm
- Fan-Out Panel-Level package, 30x30 mm
- Fan-Out Panel-Level package, 8x8 mm
- Fan-Out Wafer Level package
- Flip-Chip Ball Grid Array 27x27mm package
- Flip-Chip Ball Grid Array 32x32mm package
- Flip-Chip Ball Grid Array 35x35mm package
- Flip-Chip Ball Grid Array 50x50mm package
- Flip-Chip Ball Grid Array package
- HBM3 TSV Stacking and Assembly package, 8-Hi Versions: 12-Hi · 16-Hi
- HBM4 TSV Stacking and Assembly package, 8-Hi Versions: 12-Hi · 16-Hi
- Intel Foveros 3D Stacking package
- Low-profile Quad Flat Package 64-pin package
- PLCC package
- Package-on-Package
- Power Quad Flat No-lead with Exposed Thermal Pad package
- Quad Flat No-lead 2x2mm package
- Quad Flat No-lead 3x3mm package
- Quad Flat No-lead 4x4mm package
- Quad Flat No-lead 6x6mm package
- Quad Flat No-lead 7x7mm package
- Quad Flat No-lead 8x8mm package
- Quad Flat No-lead package
- Shrink Small Outline package
- Small Outline Integrated Circuit package
- Small Outline Package 8-lead package
- Thin Quad Flat package
- Thin Shrink Small Outline package
- Thin Small Outline package
- Transistor Outline 220 package
- Wafer-Level Chip-Scale Package - 3-Layer RDL package
- Wafer-Level Chip-Scale Package 3x3mm package
- Wafer-Level Chip-Scale Package 5x5mm package
- Wafer-Level Chip-Scale package
- Wafer-Level Package with Damascene RDL package
- Wire Bond Fine-pitch BGA with Vertically Stacked Dies package
- Wire Bond Fine-pitch Ball Grid Array package
Passives 57 datasets
- Aluminum Electrolytic
- Chip Inductor
- Chip Inductor 0201
- Chip Inductor 0603
- Chip Inductor 0805
- Chip Resistor
- Chip Resistor 0201
- Chip Resistor 0402
- Chip Resistor 0805
- Chip Resistor 1206
- Common Mode Choke
- Current Sense Resistor
- Ferrite Bead
- Ferrite Bead 0402
- Ferrite Bead 0805
- Film Capacitor X2
- Film Capacitor Y2
- MLCC C0G
- MLCC X5R
- MLCC X7R
- MLCC X7R 0201
- MLCC X7R 0603
- MLCC X7R 0805
- MLCC X7R 1206
- MOV Varistor SMD
- NTC Thermistor SMD
- PFC Boost Inductor
- PTC Thermistor SMD
- Planar Transformer
- Resistor MELF
- Resistor THT Axial
- Ring Core Inductor
- Tantalum Capacitor MnO2 10000 Case A Versions: Tantalum Capacitor MnO2 10000 Case B · Tantalum Capacitor MnO2 10000 Case C · Tantalum Capacitor MnO2 18000 Case A · Tantalum Capacitor MnO2 18000 Case B · Tantalum Capacitor MnO2 25000 Case A · Tantalum Capacitor MnO2 25000 Case B · Tantalum Capacitor MnO2 5000 Case B · Tantalum Capacitor MnO2 5000 Case C · Tantalum Capacitor MnO2 5000 Case D · Tantalum Capacitor MnO2 50000 Plus Case A · Tantalum Capacitor MnO2 50000 Plus Case R · Tantalum Capacitor Polymer 10000 Case A · Tantalum Capacitor Polymer 10000 Case B · Tantalum Capacitor Polymer 10000 Case C · Tantalum Capacitor Polymer 18000 Case A · Tantalum Capacitor Polymer 18000 Case B · Tantalum Capacitor Polymer 25000 Case A · Tantalum Capacitor Polymer 25000 Case B · Tantalum Capacitor Polymer 5000 Case B · Tantalum Capacitor Polymer 5000 Case C · Tantalum Capacitor Polymer 5000 Case D · Tantalum Capacitor Polymer 50000 Plus Case A · Tantalum Capacitor Polymer 50000 Plus Case R
- Thermistor THT Disk
PCBs 114 datasets
- 10-Layer HDI PCB, ENIG finish Versions: HDI 10-layer ENEPIG · HDI 10-layer HASL · HDI 10-layer ImAg · HDI 10-layer ImSn · HDI 10-layer OSP
- 10-Layer SLP PCB, ENIG finish Versions: SLP Smartphone ENEPIG · SLP Smartphone HASL · SLP Smartphone ImAg · SLP Smartphone ImSn · SLP Smartphone OSP
- 12-Layer Server PCB, ENIG finish Versions: Server 12-layer ENEPIG · Server 12-layer HASL · Server 12-layer ImAg · Server 12-layer ImSn · Server 12-layer OSP
- 14-Layer Server PCB, ENIG finish Versions: Server 14-layer ENEPIG · Server 14-layer HASL · Server 14-layer ImAg · Server 14-layer ImSn · Server 14-layer OSP
- 16-Layer Server PCB, ENIG finish Versions: Server 16-layer ENEPIG · Server 16-layer HASL · Server 16-layer ImAg · Server 16-layer ImSn · Server 16-layer OSP
- 18-Layer Networking PCB, ENIG finish Versions: Networking 18-layer ENEPIG · Networking 18-layer HASL · Networking 18-layer ImAg · Networking 18-layer ImSn · Networking 18-layer OSP
- 2-Layer Flex PCB, ENIG finish Versions: Flex 2-layer ENEPIG · Flex 2-layer HASL · Flex 2-layer ImAg · Flex 2-layer ImSn · Flex 2-layer OSP
- 20-Layer Networking PCB, ENIG finish Versions: Networking 20-layer ENEPIG · Networking 20-layer HASL · Networking 20-layer ImAg · Networking 20-layer ImSn · Networking 20-layer OSP
- 24-Layer Backplane PCB, ENIG finish Versions: Backplane 24-layer ENEPIG · Backplane 24-layer HASL · Backplane 24-layer ImAg · Backplane 24-layer ImSn · Backplane 24-layer OSP
- 28-Layer Backplane PCB, ENIG finish Versions: Backplane 28-layer ENEPIG · Backplane 28-layer HASL · Backplane 28-layer ImAg · Backplane 28-layer ImSn · Backplane 28-layer OSP
- 32-Layer Backplane PCB, ENIG finish Versions: Backplane 32-layer ENEPIG · Backplane 32-layer HASL · Backplane 32-layer ImAg · Backplane 32-layer ImSn · Backplane 32-layer OSP
- 4-Layer Automotive ECU PCB, ENIG finish Versions: Automotive ECU ENEPIG · Automotive ECU HASL · Automotive ECU ImAg · Automotive ECU ImSn · Automotive ECU OSP
- 4-Layer FR4 PCB, ENIG finish Versions: Standard 4-layer ENEPIG · Standard 4-layer HASL · Standard 4-layer ImAg · Standard 4-layer ImSn · Standard 4-layer OSP
- 40-Layer Backplane PCB, ENIG finish Versions: Backplane 40-layer ENEPIG · Backplane 40-layer HASL · Backplane 40-layer ImAg · Backplane 40-layer ImSn · Backplane 40-layer OSP
- 6-Layer FR4 PCB, ENIG finish Versions: Standard 6-layer ENEPIG · Standard 6-layer HASL · Standard 6-layer ImAg · Standard 6-layer ImSn · Standard 6-layer OSP
- 6-Layer RF Hybrid PCB, ENIG finish Versions: Radar Hybrid ENEPIG · Radar Hybrid HASL · Radar Hybrid ImAg · Radar Hybrid ImSn · Radar Hybrid OSP
- 6-Layer Rigid-Flex PCB, ENIG finish Versions: Rigid Flex ENEPIG · Rigid Flex HASL · Rigid Flex ImAg · Rigid Flex ImSn · Rigid Flex OSP
- 8-Layer HDI PCB, ENIG finish Versions: HDI 8-layer ENEPIG · HDI 8-layer HASL · HDI 8-layer ImAg · HDI 8-layer ImSn · HDI 8-layer OSP
- 8-Layer Memory DIMM PCB, ENIG finish Versions: Memory DIMM PCB ENEPIG · Memory DIMM PCB HASL · Memory DIMM PCB ImAg · Memory DIMM PCB ImSn · Memory DIMM PCB OSP
Specialty 16 datasets
Specialty wafers 20 datasets
- 90nm Silicon Photonics wafer, 200mm, baseline scenario Versions: Silicon Photonics Wafer 90nm Best Practice · Silicon Photonics Wafer 90nm Moderate
- CIS BSI 300mm wafer, 300mm, Japan
- Discrete Silicon 200mm wafer, 200mm, China
- GaAs VCSEL wafer, 100mm, United States Versions: Japan
- GaN-on-Si 200mm wafer, 200mm, Germany Versions: United States
- InGaAs Photodiode wafer, 100mm, United States Versions: Japan
- InP Laser Wafer 1550nm wafer, 100mm, United States Versions: Japan
- InP Laser wafer, 100mm, United States Versions: Japan
- LED GaN 100mm wafer, 100mm, China
- MEMS Inertial 200mm wafer, 200mm, Germany
- Power Discrete Silicon 200mm wafer, 200mm, Germany
- SiC 150mm wafer, 150mm, Germany Versions: United States
Substrates 2 datasets
Thermal 5 datasets
Upstream 20 datasets
- ArF Photoresist (193nm)
- Carbon tetrafluoride (CF4)
- Copper CMP Slurry
- Fluorine (F2)
- Germane (GeH4)
- Hexafluoro-1,3-butadiene (C4F6)
- Nitrogen trifluoride (NF3)
- Octafluorocyclobutane (c-C4F8)
- Oxide CMP Slurry
- Polyimide (PMDA/ODA) ((C22H10N2O5)n)
- Sulfur hexafluoride (SF6)
- TMAH Developer (2.38% solution) (N(CH3)4OH (aq))
- Tetramethylammonium hydroxide (N(CH3)4OH)
- Trimethylaluminum (Al(CH3)3)
- Trimethylgallium (Ga(CH3)3)
- Trimethylindium (In(CH3)3)
- Tungsten CMP Slurry
- Tungsten hexafluoride (WF6)
- Ultrapure Water (UPW) Production
- Water Supply (Municipal)
Wafers 48 datasets
- 10nm FinFET wafer, 300mm, baseline scenario Versions: Node 10nm Best Practice · Node 10nm Moderate
- 130nm Planar wafer, 300mm, baseline scenario Versions: Node 130nm Best Practice · Node 130nm Moderate
- 14nm FinFET wafer, 300mm, baseline scenario Versions: Node 14nm Best Practice · Node 14nm Moderate
- 180nm Planar wafer, 200mm, baseline scenario Versions: Node 180nm Best Practice · Node 180nm Moderate
- 20nm Planar HKMG wafer, 300mm, baseline scenario Versions: Node 20nm Best Practice · Node 20nm Moderate
- 22nm Planar HKMG wafer, 300mm, baseline scenario Versions: Node 22nm Best Practice · Node 22nm Moderate
- 28nm Planar HKMG wafer, 300mm, baseline scenario Versions: Node 28nm Best Practice · Node 28nm Moderate
- 3nm FinFET/GAA wafer, 300mm, Arizona, baseline scenario Versions: Node 3nm Arizona Best Practice · Node 3nm Arizona Moderate · Node 3nm Taiwan Baseline · Node 3nm Taiwan Best Practice · Node 3nm Taiwan Moderate
- 40nm Planar wafer, 300mm, baseline scenario Versions: Node 40nm Best Practice · Node 40nm Moderate
- 5nm FinFET wafer, 300mm, Arizona, baseline scenario Versions: Node 5nm Arizona Best Practice · Node 5nm Arizona Moderate · Node 5nm Taiwan Baseline · Node 5nm Taiwan Best Practice · Node 5nm Taiwan Moderate
- 65nm Planar wafer, 300mm, baseline scenario Versions: Node 65nm Best Practice · Node 65nm Moderate
- 7nm FinFET wafer, 300mm, baseline scenario Versions: Node 7nm Best Practice · Node 7nm Moderate
- 90nm Planar wafer, 300mm, baseline scenario Versions: Node 90nm Best Practice · Node 90nm Moderate
- BCD 180nm wafer, 200mm, best practice scenario Versions: BCD 180nm Moderate · BCD 180nm Moderate Gas No Recycling