Overview
- Technology
- QFN-24
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Equipment vendor specifications, academic papers, industry literature
- Coverage status
- Partial
- Pedigree-scored source files
- 9 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
13 flows. Quantities are not published; they ship with the dataset on Circa.
CF4 production Process gasg · -49.2% / +69.5%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Carbon tetrafluoride (CF4)
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Uncertainty
- -49.2% / +69.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
SF6 production Process gasg · -49% / +53.1%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Sulfur hexafluoride (SF6)
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Uncertainty
- -49% / +53.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Electricity, Taiwan (TW) ElectricitykWh · -48.6% / +143.3%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations. It also includes the assembly site's facility overhead: air handling and cleanroom conditioning, chilled water, compressed dry air, exhaust and dust collection, wastewater treatment and uninterruptible power.
- REEL derivation: engineering estimate of per-package laser-marking energy from the marker system power rating and line throughput; no single published document reports this per-package value
- REEL derivation: engineering estimate of per-package tape-and-reel energy from the equipment power rating and line throughput; no single published document reports this per-package value
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- AAM International (Strip sizes 100x300mm)
- US Patent 5945259A (Etching photoresist thickness)
- US Patent 6008068A (Leadframe thickness 0.125-0.25mm)
- Strano 2025 (Lubricant 0.8-5 g/m²)
- Bruderer BSTA 510 Specs (510kN, 22kW)
- Samhoor Press Specs (200-800 SPM)
- Hu et al. (2019). Analysis of energy efficiency improvement of high-tech fabrication plants. International Journal of Low-Carbon Technologies. DOI: 10.1093/ijlct/ctz041.
- sst.semiconductor-digest.com (date not recorded). Semiconductor Digest - Package-on-package (PoP) with Through-mold Vias (2008). Trade press article.
- directindustry.com (date not recorded). DirectIndustry - Kulicke & Soffa IConn (ProCu) PLUS wire bonder listing (1.5 kVA nominal / 2.6 kVA max).
- c2mi.ca (date not recorded). C2MI - IConn ProCu Plus LA equipment listing.
- electronicspecifier.com (date not recorded). electronicspecifier - ASMPT unveils latest wire bonder (Eagle AERO, up to 24 2-mm connections/s), 26 Sep 2022. Trade press article.
- Guste, Marinas & Ong, Machines 12 (2024) 467, Table 3; Besi Datacon 2200 evo product page
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Uncertainty
- -48.6% / +143.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Compressed air Process gasg · -30.3% / +41.2%
- Derivation basis
-
- Estimated from similar handling equipment
The sources below come from the manufacturing operations behind this row.
- Source citations (specific to this process)
- Inherited, rolled up from the contributing process steps:
- Hu et al. (2019). Analysis of energy efficiency improvement of high-tech fabrication plants. International Journal of Low-Carbon Technologies. DOI: 10.1093/ijlct/ctz041.
- Background data
- ecoinvent 3.12
- Background dataset
- compressed air, 700 kPa gauge
- Uncertainty
- -30.3% / +41.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Ar Process gasg · -60% / +100%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- argon, liquid
- Uncertainty
- -60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
O2 Process gasg · -60% / +100%
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- oxygen, liquid
- Uncertainty
- -60% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
H2 Process gasg · -28.4% / +55.4%
- Derivation basis
-
- No retrievable public document identified
The sources for this row are listed below.
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- hydrogen, gaseous, low pressure
- Uncertainty
- -28.4% / +55.4% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
N2 Process gasg · -25.4% / +49.1%
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- nitrogen, liquid
- Uncertainty
- -25.4% / +49.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Cu alloy C19400 Materialkg · ±20%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Silver Materialkg · -27.8% / +83.3%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- silver
- Notes
- From Silver-filled epoxy (84.5% silver)
- Uncertainty
- -27.8% / +83.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Epoxy resin, liquid Materialkg · -27.8% / +83.3%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- epoxy resin, liquid
- Notes
- From Silver-filled epoxy (15.5% epoxy)
- Uncertainty
- -27.8% / +83.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Cu wire Materialkg · ±20%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Epoxy Mold Compound (EMC) Materialkg · ±20%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- epoxy resin insulator, SiO2
- Uncertainty
- ±20% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Outputs and waste
Dicing slurry (Si/EMC/Cu particles) Solid wasteg
- Derivation basis
-
- No retrievable public document identified
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- No range defined.
- Unit
- g
Uncured Ag-filled die-attach epoxy (dispense loss) Solid wasteg · -78.4% / +633.3%
- Source citations
-
- seipi.org.ph (date not recorded). Amalin, M.S. (STMicroelectronics Calamba), "Challenging the Process and Material Characteristic to Address the High Epoxy Usage/Consumption of VI Power Packages", 32nd ASEMEP National Technical Symposium. Symposium paper.
- musashi-engineering.de (date not recorded). Musashi Engineering, "SuperSigma CM IV" fully digital controlled dispenser catalogue, CAT. No.SuperSigmaCMIV-12231-E-COPY (Nov 2023). Vendor catalogue.
- irjaes.com (date not recorded). Capili, M.D. (STMicroelectronics Calamba), "Comparative Analysis for Die Attach Dispensing Methods", Int. Research Journal of Advanced Engineering and Science, Vol.4 Issue 4, pp.170-172, 2019. PDF document.
- datasheets.tdx.henkel.com (date not recorded). Henkel, LOCTITE ABLESTIK 84-1LMI Technical Data Sheet, Oct 2014. Technical data sheet.
- datasheets.tdx.henkel.com (date not recorded). Henkel, LOCTITE ABLESTIK ABP 2025DNP Technical Data Sheet, Jan 2025. Technical data sheet.
- seipi.org.ph (date not recorded). Cantos, Lopez & Wagan (STMicroelectronics Calamba OPS2), "A Six Sigma Approach to Address High PPM at Die Attach Due to Epoxy Related Rejects", 34th ASEMEP National Technical Symposium. Symposium paper.
- Machine Capability Enhancement to Address Lacking Epoxy Coverage During Die Attach Process of QFN Packages", J. Engineering Research and Reports ms JERR_88623, publisher-hosted preprint (UNDER PEER REVIEW watermark)
- seipi.org.ph (date not recorded). Villarico, De La Rosa & Cuchapin (Texas Instruments Philippines, Baguio), "Automated Dispense Nozzle Cleaning Machine: TI Inside", 31st ASEMEP National Technical Symposium. Symposium paper.
- mm.digikey.com (date not recorded). Henkel, SDS LOCTITE ABLESTIK 2902-R (TRA-DUCT 2902-R), issue 11/11/2019. Safety data sheet.
- caplinq.com (date not recorded). Henkel, SDS LOCTITE ABLESTIK 3888 TPK, SDS No. 542703 V003.0, revision 17.04.2020 (Caplinq-hosted). Safety data sheet.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for precious metal from electronics scrap, in anode slime
- Uncertainty
- -78.4% / +633.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Emissions to air
2 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.
VOCs (from epoxy cure) Emission to airg
- Source citations
-
- etd.gsfc.nasa.gov (date not recorded). NASA Goddard Space Flight Center, Engineering and Technology Directorate, "Outgassing Data for Selecting Spacecraft Materials" online database, complete CSV export (13,582 records; ASTM E595 total mass loss, collected volatile condensable material and water vapour regained by material, manufacturer and application).
- etd.gsfc.nasa.gov (date not recorded). NASA Goddard Space Flight Center, Engineering and Technology Directorate, "Outgassing Database - User Guide" (ASTM E595 apparatus and conditions, TML / CVCM / WVR definitions, and the low-outgassing pass criteria).
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- NMVOC, non-methane volatile organic compounds
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Particulates (marking fume) Emission to airg
- Derivation basis
-
- Estimated from mold compound ablation
No source is attached to this row.
- Source citations
- Not stated
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- Particulate Matter, < 2.5 um
- Uncertainty
- A minimum-maximum range is defined for this flow. Bounds ship with the dataset on Circa.
- Unit
- g
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
No flows are recorded for this dataset without a quantity.
Limitations and unquantified flows (4)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- Not quantifiedWater and chemistry for the wafer-thinning and singulation steps are not quantified on this dataset, although the inventory books the spent slurry those steps produce.
- These materials are used at a step of the modelled flow and are also carried by this dataset's own material list. Each is counted once, on that list, and the step does not book it again: Cu wire bonding uses Copper wire (Cu); Epoxy dispense and die placement uses Die attach epoxy (Ag-filled conductive).
- Where the process record behind a step offers a choice of material, the modelled flow takes the one this dataset's own material list carries, and the entries it does not select are not added: Cu wire bonding takes copper wire from that list, not Gold wire (Au).
- Some consumable pulls referenced by the modelled process steps did not resolve to an inventory row and are absent from this dataset. They are itemised in the dataset's own export audit.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Production covered
Leadless molded package on a plated copper leadframe, in the mid-size body used for power-management chips, motor drivers and microcontrollers. Functional unit is one package STARTED: the reference flow is a single package entering assembly, and the activities listed run through completed assembly and final test of that package.
Modelling choices
By the count-once yield-ownership convention, the gross-up from packages started to good packages is carried by the consuming IC or component dataset, not here.