Overview
- Technology
- LPDDR5X 16GB PoP (7 nm AP + 1β DRAM)
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Component vendor specifications, academic papers, industry literature
- Coverage status
- Composed from linked REEL datasets
- Pedigree-scored source files
- 52 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
5 flows. Quantities are not published; they ship with the dataset on Circa.
AP Die REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 7nm FinFET wafer, 300mm, moderate scenario
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Wafer demand calculated from die count, rectangular wafer packing, die yield and assembly yield. Wafer manufacturing yield is already included upstream. This entry states no die yield of its own, so the sizing uses the die yield the referenced wafer dataset declares for its own reference die.
- Uncertainty
- No range defined.
- Unit
- wafer
DRAM Dies REEL datasetwafer
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- 1-beta DRAM wafer, 300mm, moderate scenario
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Wafer demand calculated from die count, rectangular wafer packing, die yield and assembly yield. Wafer manufacturing yield is already included upstream. This entry states no die yield of its own, so the sizing uses the die yield the referenced wafer dataset declares for its own reference die.
- Uncertainty
- No range defined.
- Unit
- wafer
PoP Package REEL datasetpackage
- Derivation basis
-
- Calculated by the manufacturing model. The linked REEL dataset carries the upstream life cycle sources.
No source is attached to this row.
- Source citations
- Not stated
- Upstream REEL dataset
- Package-on-Package
- Background dataset
- Modelled by REEL; see the upstream dataset above.
- Notes
- Adjusted for assembly yield.
- Uncertainty
- No range defined.
- Unit
- package
Wafer transport, KR fab to packaging site - Road Freight transporttkm · -100% / +172%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Additional Investment in Onyang Campus... Expanding Back-End Processing Too (Seoul Economic Daily)
- The Elec report, 2026-07: Samsung back-end investment focused on high-bandwidth memory
- DigiTimes report, 2024-11-13: Samsung Cheonan and Onyang back-end hubs
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, lorry, unspecified
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from memory fab to domestic back end. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses the route-class distance envelope, and its upper endpoint also adds the separate reusable-carrier return service.
- Uncertainty
- -100% / +172% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Wafer transport, TW fab to packaging site - Road Freight transporttkm · -50% / +300%
- Derivation basis
-
- Specified for this manufacturing operation and scaled to the dataset's functional unit.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- Focus Taiwan report, 2026-04-10: ASE Kaohsiung operations
- TrendForce news report, 2024-08-06: SPIL chip-on-wafer order
- Background data
- ecoinvent 3.12
- Background dataset
- transport, freight, lorry, unspecified
- Notes
- Freight for the part-finished product moving between REEL-modelled sites: the wafer fraction this dataset consumes, travelling from foundry logic die to PoP module integration, intra-island. Shipped mass is that wafer fraction times the wafer mass implied by its declared diameter, times a shipping-packaging factor covering the returnable front-opening shipping box and its secondary carton; the packaging production burden is excluded as returnable, while its mass is carried because freight scales with what is actually shipped. Road freight is allocated on actual shipped mass, and the mapped road market already includes carrier empty returns; the central therefore has no return uplift. The authored band uses only the physically reachable intra-island road-distance envelope; it does not encode an offshore-air alternative or carrier-return uplift.
- Uncertainty
- -50% / +300% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- tkm — tonne-kilometres, a transport effort rather than a mass
Outputs and waste
Packaging assembly reject Solid wastekg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- kg
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
No flows are recorded for this dataset without a quantity.
Limitations and unquantified flows (1)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- These flows are named in this inventory but ship without a quantity, so their burden is not carried anywhere in the dataset: Packaging assembly reject. Each row states its own reason on the row itself.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Complete LPDDR5X 16GB Package-on-Package module for premium flagship smartphones and mobile workstations. Bottom package contains 7nm application processor; top package contains 8 stacked 1β LPDDR5X DRAM dies. Half the DRAM dies vs equivalent LPDDR5 PoP module.