Overview
- Technology
- SiC half-bridge power module – AMB Si3N4 substrate + Ag-sinter die attach + Cu baseplate + silicone grease TIM
- Geography
- DE manufacturing default. Module sub-component mfg can span TW/KR/CN (SiC dies fab) + JP (some passives) + DE (final assembly).
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Published vendor datasheets for representative modules (Wolfspeed CAB006M12FM3, Infineon FF600R12IE5)
- Coverage status
- Partial
- Pedigree-scored source files
- 7 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
20 flows. Quantities are not published; they ship with the dataset on Circa.
Copper Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- Wolfspeed CAB006M12FM3 datasheet (public)
- Infineon HybridPACK FF600R12IE5 datasheet (public, Si IGBT analog)
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- No range defined.
- Unit
- kg
Stainless Steel Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- Wolfspeed CAB006M12FM3 datasheet (public)
- Infineon HybridPACK FF600R12IE5 datasheet (public, Si IGBT analog)
- Background data
- ecoinvent 3.12
- Background dataset
- steel, chromium steel 18/8, hot rolled
- Uncertainty
- No range defined.
- Unit
- kg
Copper baseplate Materialkg · ±33.3%
- Source citations
-
- rogerscorp.com (date not recorded). Rogers Corporation - Active Metal Brazing (technical-expertise page). Web page.
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Electrolytic copper (OFE) Materialkg
- Source citations
-
- padar.it (date not recorded). PADAR TECNOENERGIE. Web page.
- rogerscorp.com (date not recorded). Rogers Corporation - Active Metal Brazing (technical-expertise page). Web page.
- 2003. Metallized Ceramic Substrates for the New Decade. Metal Finishing. DOI: 10.1016/s0026-0576(00)80671-6.
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Uncertainty
- No range defined.
- Unit
- kg
Flux (rosin/no-clean type) Materialkg · -50% / +300%
- Source citations
-
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Background data
- ecoinvent 3.12
- Background dataset
- flux, for wave soldering
- Uncertainty
- -50% / +300% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Tin Materialkg
- Source citations
-
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Background data
- ecoinvent 3.12
- Background dataset
- tin
- Notes
- From SAC305 solder paste (default – RoHS-compliant) (82.0% tin)
- Uncertainty
- No range defined.
- Unit
- kg
Silver Materialkg
- Source citations
-
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Background data
- ecoinvent 3.12
- Background dataset
- silver
- Notes
- From SAC305 solder paste (default – RoHS-compliant) (2.5% silver). v3.10 GLO market for silver
- Uncertainty
- No range defined.
- Unit
- kg
Copper, cathode Materialkg
- Source citations
-
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Background data
- ecoinvent 3.12
- Background dataset
- copper, cathode
- Notes
- From SAC305 solder paste (default – RoHS-compliant) (0.4% copper)
- Uncertainty
- No range defined.
- Unit
- kg
Flux, for wave soldering Materialkg
- Source citations
-
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Background data
- ecoinvent 3.12
- Background dataset
- flux, for wave soldering
- Notes
- From SAC305 solder paste (default – RoHS-compliant) (11.0% flux)
- Uncertainty
- No range defined.
- Unit
- kg
Thermal interface material Materialkg · -52.4% / +197.6%
- Source citations
-
- Semikron Danfoss International, Application Note AN 18-001, "Thermal Paste Application", Revision 01, issue date 2024-05-31, 23 pp
- Wacker Chemie AG, "WACKER(R) SILICONE PASTE P 12 -- Thermally conductive silicone paste", technical data sheet, Version 1.5, date of last alteration 14.04.2014, 2 pp
- Wacker Chemie AG, Safety Data Sheet (1907/2006/EC), Material 60003095, "WACKER(R) SILICONE PASTE P 12 HEAT SINK COMPOUND", Version 4.3 (GB), date of print 26.03.2019, date of last alteration 06.06.2018, 9 pp
- Henkel, Technical Data Sheet, BERGQUIST GAP FILLER TGF 4000 (known as BERGQUIST GAP FILLER 4000), September 2023, Reference 2, 2 pp
- Background data
- ecoinvent 3.12
- Background dataset
- silicone product
- Uncertainty
- -52.4% / +197.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Aluminum Oxide Filler Materialkg
- Derivation basis
-
- TIM formulation literature
No source is attached to this row.
- Source citations
- Not stated
- Background data
- proxy-mapped
- Background dataset
- aluminium oxide, metallurgical
- Uncertainty
- No range defined.
- Unit
- kg
Silicone Base Materialkg
- Derivation basis
-
- TIM formulation literature
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- silicone product
- Uncertainty
- No range defined.
- Unit
- kg
Zinc Oxide Filler Materialkg
- Derivation basis
-
- TIM formulation literature
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- zinc oxide
- Uncertainty
- No range defined.
- Unit
- kg
Electricity, Global (GLO) ElectricitykWh · -45.3% / +73.9%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- Wolfspeed CAB006M12FM3 datasheet (public)
- Infineon HybridPACK FF600R12IE5 datasheet (public, Si IGBT analog)
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Notes
- Energy demand from AMB substrate, Ag sinter die attach, wire bonding, baseplate assembly and silicone gel potting, adjusted for assembly yield.
- Uncertainty
- -45.3% / +73.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Process water WaterL · -60% / +200%
- Derivation basis
-
- Calculated from process-water and ultrapure-water demand across all manufacturing operations. This model includes no facility support, so the demand is the manufacturing operations alone. The fresh intake shown is that demand less the share reused under the water-recycling scenario this dataset assumes, and wastewater follows the same balance.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- tap water
- Notes
- Water demand from baseplate assembly, adjusted for assembly yield.
- Uncertainty
- -60% / +200% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- L
Nitrogen (inert atmosphere) Process gasg · -40% / +100%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- nitrogen, liquid
- Uncertainty
- -40% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Nitrogen (N2) Process gasg · -25.4% / +49.1%
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- nitrogen, liquid
- Uncertainty
- -25.4% / +49.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Hydrogen (H2) Process gasg · -25.4% / +49.2%
- Source citations
-
- uwaterloo.ca (date not recorded). A. Pequegnat, J. Persic, M. Mayer, Y. Zhou, J. Hong, K. Ahn, "Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding", Microelectronics Reliability 51 (2011) 43-52, doi 10.1016/j.microrel.2010.02.023. PDF document.
- Alfred Yeung, Ivy Sutiono, Jochen Milke (Heraeus Materials Technology), "Optimization of Free Air Ball Formation of Copper and Palladium Coated Copper Bonding Wires", Proceedings of IMAPS 2010, 43rd International Symposium on Microelectronics, pp. 000661 ff
- Background data
- ecoinvent 3.12
- Background dataset
- hydrogen, gaseous, low pressure
- Uncertainty
- -25.4% / +49.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Nitrogen (N2 reflow atmosphere) Process gasg · -40% / +100%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- nitrogen, liquid
- Uncertainty
- -40% / +100% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
N2 Process gasg · -30% / +50%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12
- Background dataset
- nitrogen, liquid
- Uncertainty
- -30% / +50% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- g
Outputs and waste
Reject Cu (brazing void / delamination scrap) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- What is Active Metal Brazing AMB Ceramic PCB? - PCB & MCPCB - EBest Technology
- wintrustek.com (date not recorded). What is Active Metal Brazing (AMB) Ceramic Substrate? Web page.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Uncertainty
- No range defined.
- Unit
- g
Reject ceramic (Si3N4) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- energy.gov (2025). AMMTO Draft WBG PE Strategic Framework FINAL. PDF document.
- rogerscorp.com (date not recorded). Rogers Corporation - Active Metal Brazing (technical-expertise page). Web page.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Reject brazing alloy Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- What is Active Metal Brazing AMB Ceramic PCB? - PCB & MCPCB - EBest Technology
- wintrustek.com (date not recorded). What is Active Metal Brazing (AMB) Ceramic Substrate? Web page.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- No range defined.
- Unit
- g
Spent buffer pads (PTFE – fluorinated polymer) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- scribd.com (date not recorded). Supplier Directory Overview | PDF. Web page.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, hazardous waste incineration, with energy recovery
- Uncertainty
- No range defined.
- Unit
- g
Reject Ag-sinter paste / failed dies (precious metal recovery) Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- everisland.com (date not recorded). Factsheet PE338 ENG. PDF document.
- heraeus-electronics.com (date not recorded). Factsheet Magic PE360 ENG. PDF document.
- Silver sinter paste optimized for pressure sintering under air atmosphere on precious and non-precious metal surfaces with high reliable si
- assets.wolfspeed.com (2024). Wolfspeed PRD 07969 Sintering Considerations and the Die Top System Application Note. PDF document.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for precious metal from electronics scrap, in anode slime
- Uncertainty
- No range defined.
- Unit
- g
Reject baseplate Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- rogerscorp.com (date not recorded). Rogers Corporation - Active Metal Brazing (technical-expertise page). Web page.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- market for copper scrap, sorted, pressed
- Uncertainty
- No range defined.
- Unit
- g
Reject solder Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below come from the manufacturing operations behind this row.
- Sources (inherited)
- Inherited, rolled up from the contributing process steps:
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of hazardous waste, underground deposit
- Uncertainty
- No range defined.
- Unit
- g
Thermal-compound mixing residue Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Thermal-compound packaging waste Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of waste plastic, mixture, municipal incineration
- Uncertainty
- No range defined.
- Unit
- g
Out-of-spec thermal compound Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Excess/wiped TIM (all classes) Solid wasteg
- Source citations
-
- Semikron Danfoss International, Application Note AN 18-001, "Thermal Paste Application", Revision 01, issue date 2024-05-31, 23 pp
- Wacker Chemie AG, "WACKER(R) SILICONE PASTE P 12 -- Thermally conductive silicone paste", technical data sheet, Version 1.5, date of last alteration 14.04.2014, 2 pp
- Henkel, Technical Data Sheet, LOCTITE(R) ABLESTIK 286, November 2024, 1 p
- Henkel, Technical Data Sheet, LOCTITE(R) ABLESTIK ABP 2025DNP, January 2025, 2 pp
- Henkel, Technical Data Sheet, BERGQUIST GAP FILLER TGF 4000 (known as BERGQUIST GAP FILLER 4000), September 2023, Reference 2, 2 pp
- Parker Hannifin Corporation, Chomerics Division, "Thermal Interface Material Dispensing Guide -- For Thermally Conductive Gels, Cure-in-Place Potting Compounds and Thermal Greases", document MB 1006 EN May 2021, (c) 2021, 20 pp
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Injection-molding runner and sprue scrap Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Emissions to air
2 elementary flows released to air by this dataset's own operations. Quantities are not published; they ship with the dataset on Circa.
VOCs Emission to airg
- Source citations
-
- everisland.com (date not recorded). Factsheet PE338 ENG. PDF document.
- assets.wolfspeed.com (2024). Wolfspeed PRD 07969 Sintering Considerations and the Die Top System Application Note. PDF document.
- rehm-group.com (date not recorded). Condensation Soldering with PFPE Heat Transfer Media. Web page.
- Silicone processing emission factors
- frontiersin.org (2022). Frontiers | Reduction of Carbon Emission Is Optimized During the Life Cycle of Commonly Used Force Main Pipe Materials. Journal article. DOI: 10.3389/frwa.2022.735519/full.
- Farazmandnia, Ilinca (2025). Recyclable Wind Turbine Blades: A Life Cycle Analysis. Materials. DOI: 10.3390/ma18163762.
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- NMVOC, non-methane volatile organic compounds
- Uncertainty
- No range defined.
- Unit
- g
particulates Emission to airg
- Derivation basis
-
- Dust control estimates
No source is attached to this row.
- Source citations
- Not stated
- Compartment
- Air (non-urban air or from high stacks)
- ecoinvent 3.12 elementary flow
- Particulate Matter, < 2.5 um
- Uncertainty
- No range defined.
- Unit
- g
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
7 flows are recorded for this dataset but carry no quantity — cut off below the significance threshold, or with no background dataset available. They remain inside the declared system boundary; each is listed with its reason.
Cut off - below the significance threshold (1)
Plastic Compound Materialkg
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- Wolfspeed CAB006M12FM3 datasheet (public)
- Infineon HybridPACK FF600R12IE5 datasheet (public, Si IGBT analog)
- Background data
- cut off
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- A generic plastic housing or insulation material, recorded in this inventory. Where its mass is significant it is tracked as a named plastic at component level, so no upstream production dataset is attached to this catch-all entry.
- Uncertainty
- No range defined.
- Unit
- kg
Not modelled (6)
Active brazing alloy (Cu-Sn-Ti) Materialkg · -50% / +100.1%
- Source citations
-
- What is Active Metal Brazing AMB Ceramic PCB? - PCB & MCPCB - EBest Technology
- wintrustek.com (date not recorded). What is Active Metal Brazing (AMB) Ceramic Substrate? Web page.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- The quantified material is retained, but its authored name does not identify a sufficiently specific background dataset or defensible proxy; background modeling remains an explicit gap.
- Uncertainty
- -50% / +100.1% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Ag-sinter paste (90-99% Ag micro/nano particles + organic solvents) Materialkg · -50% / +57.5%
- Source citations
-
- everisland.com (date not recorded). Factsheet PE338 ENG. PDF document.
- heraeus-electronics.com (date not recorded). Factsheet Magic PE360 ENG. PDF document.
- Silver sinter paste optimized for pressure sintering under air atmosphere on precious and non-precious metal surfaces with high reliable si
- assets.wolfspeed.com (2024). Wolfspeed PRD 07969 Sintering Considerations and the Die Top System Application Note. PDF document.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- The quantified material is retained, but its authored name does not identify a sufficiently specific background dataset or defensible proxy; background modeling remains an explicit gap.
- Uncertainty
- -50% / +57.5% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Buffer pads (PTFE) – die protection during pressure sintering Materialkg · -54.5% / +127.2%
- Source citations
-
- scribd.com (date not recorded). Supplier Directory Overview | PDF. Web page.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- The quantified material is retained, but its authored name does not identify a sufficiently specific background dataset or defensible proxy; background modeling remains an explicit gap.
- Uncertainty
- -54.5% / +127.2% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Silicon nitride (Si3N4) Materialkg · ±4.9%
- Source citations
-
- energy.gov (2025). AMMTO Draft WBG PE Strategic Framework FINAL. PDF document.
- rogerscorp.com (date not recorded). Rogers Corporation - Active Metal Brazing (technical-expertise page). Web page.
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- The quantified material is retained, but its authored name does not identify a sufficiently specific background dataset or defensible proxy; background modeling remains an explicit gap.
- Uncertainty
- ±4.9% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Syringe and tube packaging Materialkg
- Derivation basis
-
- Packaging material estimates
No source is attached to this row.
- Source citations
- Not stated
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- The quantified material is retained, but its authored name does not identify a sufficiently specific background dataset or defensible proxy; background modeling remains an explicit gap.
- Uncertainty
- No range defined.
- Unit
- kg
SiC MOSFET die fabrication Materialdie
- Derivation basis
- Not stated
- Source citations
- Not stated
- Background data
- not modelled
- Background dataset
- Not applicable: this flow is not quantified in the inventory.
- Reason
- SiC MOSFET die fabrication is declared but not linked from the module assembly model; the die-production burden is recorded but not quantified in this dataset - deferred, not judged immaterial.
- Uncertainty
- No range defined.
- Unit
- die
Limitations and unquantified flows (4)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
Materials
- These flows are named in this inventory but ship without a quantity, so their burden is not carried anywhere in the dataset: SiC MOSFET die fabrication. Each row states its own reason on the row itself.
General
- The declared mass of this module includes a small remainder that its itemised material breakdown does not identify. The listed constituents account for nearly all of the declared mass, and the balance is not attributed to any named material, so nothing here says what that remainder is made of. The declared total is kept as it stands rather than trimmed to the parts that are named, and the remainder is recorded as an open reconciliation rather than absorbed into a constituent that did not earn it.
- The silver-sinter die attach on this module is quantified twice over and the two declarations do not agree. This dataset buys the paste the sintering process applies over the die-attach interface, while the module's own itemised mass carries a slightly heavier joint. The solvent release and the silver-bearing reject follow the heavier one, because they are derived from the paste that made the joint; the purchased paste follows the process rate. The difference between the two is small and is not resolved here. The rejected material itself is not bought by any purchase this dataset carries: the sintering process exports it as a silver-bearing reject on the strength of its own over-provisioning allowance, and no input row anywhere in this dataset buys the extra paste that allowance describes.
- The filled thermal-compound residues on this module ship on a general non-hazardous landfill route. A ceramic-filled silicone is largely mineral once its polymer has burned, so that route is a placeholder rather than a supported disposition for them, and establishing a material-specific fate is open research. The packaging residue beside them is an unfilled polymer and now carries the combustible-organic fate its material supports. No recycling route on any of these residues is funded by a disclosed sale, so none is claimed.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Silicon-carbide half-bridge power module: sintered-silver die attach on an active-metal-brazed silicon-nitride substrate over a copper baseplate.