Overview
- Technology
- Not stated
- Geography
- Global average data from equipment vendor specifications and industry literature
System boundary
The figure groups this dataset's unit processes by class. It is not a count of manufacturing steps — each process runs over as many passes as the flow requires, and those pass counts ship with the dataset.
Data quality and references
Pedigree scores follow the ecoinvent data-quality matrix: 1 is the best attainable, 5 the weakest. The composite is their aggregate.
- Sampling procedure
- Component vendor specifications, academic papers, industry literature
- Coverage status
- Partial
- Pedigree-scored source files
- 3 — the source records behind this dataset's manufacturing operations. Each carries the five pedigree axes above; the composite DQI aggregates them.
Technosphere inputs
5 flows. Quantities are not published; they ship with the dataset on Circa.
Electricity, China (CN) ElectricitykWh · -44.6% / +44.8%
- Derivation basis
-
- Calculated from equipment energy across all manufacturing operations. This model includes no facility support, so the total is the manufacturing operations alone.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- TIA-604 (FOCIS) standard for LC connector interface
- Senko Advanced Components LC connector specifications
- IEC 61754-20 - Fibre optic interconnecting devices - LC connector
- Microlap 1.25 mm OD LC-type ferrule product page - outer diameter and 6.4-6.5 mm ferrule length
- Background data
- ecoinvent 3.12
- Background dataset
- electricity, medium voltage
- Uncertainty
- -44.6% / +44.8% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kWh
Yttria-stabilized zirconia (Y-TZP) Materialkg · -1.5% / +0%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- TIA-604 (FOCIS) standard for LC connector interface
- Senko Advanced Components LC connector specifications
- IEC 61754-20 - Fibre optic interconnecting devices - LC connector
- Microlap 1.25 mm OD LC-type ferrule product page - outer diameter and 6.4-6.5 mm ferrule length
- Background data
- ecoinvent 3.12
- Background dataset
- zirconium oxide
- Uncertainty
- -1.5% / +0% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
PBT-GF30 Materialkg · -16.7% / +25%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- TIA-604 (FOCIS) standard for LC connector interface
- Senko Advanced Components LC connector specifications
- IEC 61754-20 - Fibre optic interconnecting devices - LC connector
- Microlap 1.25 mm OD LC-type ferrule product page - outer diameter and 6.4-6.5 mm ferrule length
- Background data
- proxy-mapped
- Background dataset
- glass fibre reinforced plastic, polyamide, injection moulded
- Uncertainty
- -16.7% / +25% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Stainless steel 302 Materialkg · ±33.3%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- TIA-604 (FOCIS) standard for LC connector interface
- Senko Advanced Components LC connector specifications
- IEC 61754-20 - Fibre optic interconnecting devices - LC connector
- Microlap 1.25 mm OD LC-type ferrule product page - outer diameter and 6.4-6.5 mm ferrule length
- Background data
- ecoinvent 3.12
- Background dataset
- steel, chromium steel 18/8, hot rolled
- Uncertainty
- ±33.3% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Silicone rubber Materialkg · ±40%
- Derivation basis
-
- Calculated from per-operation consumption, operation counts, and manufacturing yield.
The sources for this row are listed below.
- Source citations (dataset-level)
-
- TIA-604 (FOCIS) standard for LC connector interface
- Senko Advanced Components LC connector specifications
- IEC 61754-20 - Fibre optic interconnecting devices - LC connector
- Microlap 1.25 mm OD LC-type ferrule product page - outer diameter and 6.4-6.5 mm ferrule length
- Background data
- ecoinvent 3.12
- Background dataset
- silicone product
- Uncertainty
- ±40% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Outputs and waste
Packaging Scrap Solid wasteg
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
No source is attached to this row.
- Source citations
- Not stated
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Uncertainty
- No range defined.
- Unit
- g
Scrapped material (line yield) Solid wastekg · -23.9% / +28.6%
- Derivation basis
-
- Calculated from the mass balance of spent materials and consumables, with treatment selected from the waste classification.
The sources below are this dataset's own bibliography. They are not tied to this row.
- Source citations (dataset-level)
- Inherited from this dataset's own bibliography, not tied to this row:
- TIA-604 (FOCIS) standard for LC connector interface
- Senko Advanced Components LC connector specifications
- IEC 61754-20 - Fibre optic interconnecting devices - LC connector
- Microlap 1.25 mm OD LC-type ferrule product page - outer diameter and 6.4-6.5 mm ferrule length
- Background data
- ecoinvent 3.12 treatment route
- Background dataset
- treatment of inert waste, sanitary landfill
- Notes
- Calculated reject material after accounting for a manufacturing yield of 97%.
- Uncertainty
- -23.9% / +28.6% around the published quantity. The bounds themselves ship with the dataset on Circa.
- Unit
- kg
Emissions to air
No emissions to air are recorded at this level.
Emissions to water
No emissions to water are recorded at this level.
Flows not quantified
No flows are recorded for this dataset without a quantity.
Limitations and unquantified flows (2)
Limits this dataset declares about itself: first any limit stated in its own description, then any limit it declares flow by flow, grouped by channel. Each entry below is the model's own disclosure.
- Manufacture of the ceramic ferrules, meaning sintering the zirconia and grinding it to its final concentricity, is not modelled and no inventory for it exists in this release.
- The energy of ferrule manufacture is expected to dominate this connector and is absent from the figures published here, so the energy reported for this dataset is understated.
The flows above are this dataset's own records. What follows are the scope rules set once for the whole database in the methodology report, repeated here so every dataset page carries them.
Database-wide boundary policy — applies to every REEL dataset
These boundaries are set once for the whole database, in Chapter 2 of the methodology report, and apply to this dataset wherever they are relevant to it. The excluded flows listed above are specific to this dataset.
- Use phase
- Product operation is outside the cradle-to-gate scope.
- End-of-life treatment
- Recycling and disposal are outside the cradle-to-gate scope.
- Distribution and retail
- The gate is a finished component ready for integration into a higher-level assembly.
- Inbound transport of raw materials
- Transport of purchased raw materials to the manufacturing facility is already inside the upstream "market for" datasets that users link to a background database, so it is not modelled a second time here. This does not cover freight between REEL production stages, which is modelled where a dataset authors it.
- Returnable shipping containers
- Where freight between production stages is modelled, the mass moved is the product itself. The shipping container (FOSB, SEMI M31) is returnable capital equipment whose per-trip share is unsourced, so its tare is excluded from the transport effort.
- Photomask fabrication
- A mask set's embodied burden is amortised across a high-volume production run and is not attributed per wafer. Users assessing low-volume production should add mask fabrication separately; the methodology report gives the basis for the exclusion.
- Employee transport, administration and R&D overhead
- Employee transportation, facility administration and R&D/pilot-production overhead are outside scope.
- Capital goods
- Manufacturing equipment, cleanroom construction and facility infrastructure are excluded, on the grounds of absent public data on equipment embodied energy, uncertainty in equipment lifetime and allocation, common practice in electronics LCA, and a focus on the operational inventory. Future versions may include capital goods when sufficient public data becomes available.
- Precious metal recovery credits
- Scrap recovery credits for precious metals are excluded pending data availability.
- Wafer reclaim
- Test wafers and scrap are outside the system boundary.
Inside the boundary, linked rather than modelled
- Silicon ingot growth and wafer slicing
- Inside the cradle-to-gate scope, but treated as upstream material inputs linked to background databases rather than modelled as REEL processes.
- Freight between production stages
- Where a dataset's product moves between REEL production stages - wafer fabrication to the packaging site, for example - that leg is authored as a transport service and linked to an ecoinvent freight activity. It is measured as a transport effort in tonne-kilometres, not as a mass. Route distances are authored per route class with a stated band; a lower bound of zero is a modelling statement that the two sites can be co-located, not a missing value.
Cut-off criteria
A flow is excluded from a process inventory when it contributes less than 1 % of the total mass of inputs to that unit process, or less than 1 % of its total energy input. The denominator is total process inputs, not product mass. That distinction matters in semiconductor manufacturing, where the input mass of water, chemicals and gases greatly exceeds the product mass, so the threshold removes only genuinely minor flows.
Included regardless of the cut-off
- Perfluorocarbons (CF4, C2F6, SF6, NF3) - high GWP, EPA regulated
- Heavy metals (Pb, Cd, Hg, Cr(VI)) - RoHS regulated, high toxicity
- Volatile organics (photoresist solvents, PGMEA) - air quality
- Precious metals (Au, Ag, Pd, Pt) - high embodied impacts
- Ozone-depleting substances (legacy CFCs, HCFCs) - Montreal Protocol
Duplex fiber-optic receptacle with two zirconia ceramic ferrules that align the fiber ends, in a push-pull latching housing.