Electronics LCI Datasets
Browse the REEL LCI database by category: source-documented life cycle inventory data for the major electronics components used in modern IT hardware, built only from public sources.
Semiconductors
Semiconductor LCI Data
Wafer and chip inventories from 3nm FinFET to 180nm planar CMOS: 48 wafer datasets, 42 logic ICs, 20 specialty-wafer datasets, and 2 IC substrates. Process-flow traceable.
View datasetPCBs
PCB LCI Data
114 per-m² datasets covering 19 printed circuit board constructions – 2-layer flex through 40-layer backplanes, plus HDI, rigid-flex, and specialty boards – each with six supported surface finishes.
View datasetAdvanced Packaging
Advanced Packaging LCI Data
46 packaging datasets spanning CoWoS 2.5D, Foveros, EMIB, fan-out wafer- and panel-level packaging, HBM3/HBM4 TSV stacking, FCBGA, FBGA, QFN, and more. Stack-yield compounding is explicit.
View datasetMemory
Memory LCI Data
70 datasets across DRAM, GDDR7, 3D NAND through 321 layers, HBM3/HBM3E/HBM4, and HBF, including geography, production-maturity, and conventional-versus-cryogenic NAND scenarios where supported.
View datasetServers & GPUs
Server & GPU LCI Data
Component and infrastructure inventories for bottom-up server and accelerator studies: logic ICs, HBM, advanced packaging, high-layer-count PCBs, storage, cabling, PSUs, cooling hardware, trays, racks, and power distribution.
View datasetLooking for other categories? REEL LCI also covers passive components, connectors, cables, electromechanical, optoelectronics, specialty semiconductors, thermal management, power supply units, and infrastructure. Browse the full database on Circa.
Browse the full database
All REEL LCI datasets are available on Circa for direct integration into your LCA models, with the full methodology documented in the report.